JP2020537343A5 - - Google Patents

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Publication number
JP2020537343A5
JP2020537343A5 JP2020519728A JP2020519728A JP2020537343A5 JP 2020537343 A5 JP2020537343 A5 JP 2020537343A5 JP 2020519728 A JP2020519728 A JP 2020519728A JP 2020519728 A JP2020519728 A JP 2020519728A JP 2020537343 A5 JP2020537343 A5 JP 2020537343A5
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JP
Japan
Prior art keywords
copper
containing layer
substrate
layer
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020519728A
Other languages
English (en)
Japanese (ja)
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JP7240008B2 (ja
JP2020537343A (ja
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Publication date
Priority claimed from US15/984,343 external-priority patent/US10566267B2/en
Application filed filed Critical
Publication of JP2020537343A publication Critical patent/JP2020537343A/ja
Publication of JP2020537343A5 publication Critical patent/JP2020537343A5/ja
Application granted granted Critical
Publication of JP7240008B2 publication Critical patent/JP7240008B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020519728A 2017-10-05 2018-10-04 マイクロ電子デバイスのための保護層を備えたダイ取り付け表面銅層 Active JP7240008B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762568463P 2017-10-05 2017-10-05
US62/568,463 2017-10-05
US15/984,343 US10566267B2 (en) 2017-10-05 2018-05-19 Die attach surface copper layer with protective layer for microelectronic devices
US15/984,343 2018-05-19
PCT/US2018/054415 WO2019071006A1 (en) 2017-10-05 2018-10-04 COPPER LAYER WITH CHIP FASTENING SURFACE WITH PROTECTIVE LAYER FOR MICROELECTRONIC DEVICES

Publications (3)

Publication Number Publication Date
JP2020537343A JP2020537343A (ja) 2020-12-17
JP2020537343A5 true JP2020537343A5 (enExample) 2021-11-11
JP7240008B2 JP7240008B2 (ja) 2023-03-15

Family

ID=65993419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020519728A Active JP7240008B2 (ja) 2017-10-05 2018-10-04 マイクロ電子デバイスのための保護層を備えたダイ取り付け表面銅層

Country Status (4)

Country Link
US (3) US10566267B2 (enExample)
JP (1) JP7240008B2 (enExample)
CN (1) CN111344860A (enExample)
WO (1) WO2019071006A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10566267B2 (en) * 2017-10-05 2020-02-18 Texas Instruments Incorporated Die attach surface copper layer with protective layer for microelectronic devices
US11322464B2 (en) 2019-10-01 2022-05-03 Taiwan Semiconductor Manufacturing Company, Ltd. Film structure for bond pad

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