JP2020532856A - 高バンド・ギャップ材料を含むストリング・ドライバを備えたデバイス及びシステム、並びに形成の方法 - Google Patents
高バンド・ギャップ材料を含むストリング・ドライバを備えたデバイス及びシステム、並びに形成の方法 Download PDFInfo
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- JP2020532856A JP2020532856A JP2020510085A JP2020510085A JP2020532856A JP 2020532856 A JP2020532856 A JP 2020532856A JP 2020510085 A JP2020510085 A JP 2020510085A JP 2020510085 A JP2020510085 A JP 2020510085A JP 2020532856 A JP2020532856 A JP 2020532856A
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- high bandgap
- bandgap material
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Abstract
Description
本願は、その開示の全体が参照により本明細書に組み込まれる2017年8月29日出願の米国仮特許出願第62/551,353号の35U.S.C.§119(e)の下での利益を主張する。本願はまた、「DEVICES AND SYSTEMS WITH STRING DRIVERS INCLUDING HIGH BAND GAP MATERIAL AND METHODS OF FORMATION」に関して2018年8月23日に出願された米国特許出願第16/110,217号に対する優先権を主張する。この出願は、前述した米国仮特許出願の正式な変換である。
Claims (20)
- ストリング・ドライバを備えたデバイスであって、
ドレイン領域とソース領域との間のチャネル領域であって、前記チャネル領域、前記ドレイン領域、又は前記ソース領域のうちの少なくとも1つは、高バンド・ギャップ材料を備えた、チャネル領域と、
前記高バンド・ギャップ材料に隣接し、前記高バンド・ギャップ材料から離間されたゲート領域とを備えた、デバイス。 - 前記高バンド・ギャップ材料は、酸化亜鉛、インジウム・ガリウム亜鉛酸化物、インジウム亜鉛酸化物、炭化ケイ素、酸化スズ、及びガリウム砒素から成る群から選択された、請求項1に記載のデバイス。
- 前記ドレイン領域及び前記ソース領域はおのおの、0.20マイクロメートル未満(0.20μm未満)のオフセット領域によって、前記チャネル領域から離間された、請求項1に記載のデバイス。
- 前記ドレイン領域及び前記ソース領域は、前記高バンド・ギャップ材料を備え、前記チャネル領域は、低バンド・ギャップ材料を備えた、請求項1に記載のデバイス。
- 前記低バンド・ギャップ材料は、ゲルマニウム(Ge)、シリコン・ゲルマニウム(SiGe)、及びインジウム・ガリウム砒素(InGaAs)から成る群から選択された、請求項4に記載のデバイス。
- 前記チャネル領域は、前記高バンド・ギャップ材料と、別の高バンド・ギャップ材料とを備えた、請求項1に記載のデバイス。
- 電荷ストレージ・デバイスのアレイと、
電荷ストレージ・デバイスの前記アレイと動作可能に通信するアクセス・ラインとをさらに備え、
前記ストリング・ドライバは、前記アクセス・ラインのうちの少なくとも1つのアクセス・ラインと動作可能に通信し、
前記ドレイン領域及び前記ソース領域は、前記高バンド・ギャップ材料を備え、
前記チャネル領域は、前記高バンド・ギャップ材料又は低バンド・ギャップ材料を備え、
前記チャネル領域は、前記ドレイン領域と前記ソース領域との間に延在する、請求項1に記載のデバイス。 - 前記ストリング・ドライバは、複数の前記チャネル領域を備え、前記チャネル領域は、前記高バンド・ギャップ材料を備えた、請求項1から7のいずれか一項に記載のデバイス。
- 前記ソース領域は、少なくとも1つのドーパントでドープされた前記高バンド・ギャップ材料を備え、
前記ドレイン領域は、前記少なくとも1つのドーパントでドープされた前記高バンド・ギャップ材料を備え、
前記少なくとも1つのドーパントは、アルミニウム(Al)及びシリコン(Si)から成る群から選択された、請求項1から7のいずれか一項に記載のデバイス。 - 前記チャネル領域は、前記ソース領域と前記ドレイン領域との間に横方向に配置され、前記ソース領域及び前記ドレイン領域は、前記高バンド・ギャップ材料を備えた、請求項1から7のいずれか一項に記載のデバイス。
- デバイスのストリング・ドライバを形成する方法であって、
高バンド・ギャップ材料を形成することと、
前記高バンド・ギャップ材料に隣接して、誘電性材料を形成することと、
前記誘電性材料に隣接して、導電性材料の領域を形成することとを備え、前記導電性材料の前記領域は、少なくとも前記誘電性材料によって、前記高バンド・ギャップ材料から離間された、方法。 - 前記高バンド・ギャップ材料を形成する前に、別の誘電性材料を形成することをさらに備え、
前記高バンド・ギャップ材料を形成することは、前記他の誘電性材料に隣接して、前記高バンド・ギャップ材料を形成することを備えた、請求項11に記載の方法。 - 前記誘電性材料を形成する前に、前記高バンド・ギャップ材料のドープされていない部分によって、又は、低バンド・ギャップ材料のドープされていない部分によって、ドープされた高バンド・ギャップ材料の少なくとも1つのソース領域から離間された、ドープされた高バンド・ギャップ材料の少なくとも1つのドレイン領域を形成するために、前記高バンド・ギャップ材料の一部分にドーピングすることをさらに備えた、請求項11に記載の方法。
- 前記高バンド・ギャップ材料を形成する前に、
別の導電性材料を形成することと、
他の導電性材料に少なくとも1つのドーパントをドーピングすることとをさらに備え、
前記高バンド・ギャップ材料を形成することは、前記少なくとも1つのドーパントでドープされた前記他の導電性材料と物理的に接触する前記高バンド・ギャップ材料を形成することを備え、
前記高バンド・ギャップ材料の一部分にドーピングすることは、
前記高バンド・ギャップ材料の少なくとも下部部分を熱に曝して、前記少なくとも1つのドーパントを、前記他の導電性材料から、前記高バンド・ギャップ材料の前記下部部分に拡散させることと、
追加の量の前記少なくとも1つのドーパントを、前記高バンド・ギャップ材料の上部部分に注入することとを備えた、請求項13に記載の方法。 - 前記高バンド・ギャップ材料の一部分にドーピングすることは、前記高バンド・ギャップ材料の前記一部分に少なくとも1つのドーパントを注入することを備え、前記一部分は、前記高バンド・ギャップ材料のドープされていない部分に、又は、前記低バンド・ギャップ材料のドープされていない部分に、横方向に隣接した、請求項13に記載の方法。
- 前記導電性材料の前記領域を形成することは、前記誘電性材料を形成することに先行し、前記高バンド・ギャップ材料を形成することに先行し、
前記誘電性材料を形成することは、
前記導電性材料を貫通して開口部を形成することと、
前記開口部に露出された前記導電性材料に隣接して、前記誘電性材料を形成することとを備え、
前記高バンド・ギャップ材料を形成することは、前記誘電性材料に隣接して、前記高バンド・ギャップ材料を形成することを備えた、請求項11に記載の方法。 - 前記高バンド・ギャップ材料に沿って、別の高バンド・ギャップ材料を形成することをさらに備えた、請求項16に記載の方法。
- 前記誘電性材料を形成することは、前記高バンド・ギャップ材料を形成することに先行し、前記導電性材料を形成することは、前記誘電性材料を形成することに先行し、前記誘電性材料は、前記導電性材料を、前記高バンド・ギャップ材料から離間させる、請求項11に記載の方法。
- 前記誘電性材料を形成することは、前記高バンド・ギャップ材料を形成することに後続し、前記導電性材料の前記領域を形成することは、前記誘電性材料を形成することに後続する、請求項11に記載の方法。
- 前記高バンド・ギャップ材料を形成することは、前記高バンド・ギャップ材料を、400℃未満の温度で、堆積させることを備えた、請求項11から19のいずれか一項に記載の方法。
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PCT/US2018/047809 WO2019046106A1 (en) | 2017-08-29 | 2018-08-23 | DEVICES AND SYSTEMS WITH CHAIN DRIVERS COMPRISING HIGH BANNED MATERIAL AND METHODS OF FORMATION |
US16/110,217 | 2018-08-23 | ||
US16/110,217 US11018255B2 (en) | 2017-08-29 | 2018-08-23 | Devices and systems with string drivers including high band gap material and methods of formation |
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Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10734399B2 (en) * | 2017-12-29 | 2020-08-04 | Micron Technology, Inc. | Multi-gate string drivers having shared pillar structure |
CN111816659A (zh) * | 2019-04-12 | 2020-10-23 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其形成方法和工作方法 |
US11127859B2 (en) * | 2019-06-10 | 2021-09-21 | Nanya Technology Corporation | Semiconductor device and manufacturing method thereof |
CN110265484B (zh) * | 2019-06-26 | 2022-08-09 | 京东方科技集团股份有限公司 | 薄膜晶体管、阵列基板、显示装置 |
US11018154B2 (en) * | 2019-08-19 | 2021-05-25 | Macronix International Co., Ltd. | Memory device and method for fabricating the same |
US11127747B2 (en) | 2019-08-23 | 2021-09-21 | Micron Technology, Inc. | Transistors including two-dimensional materials |
US11594644B2 (en) | 2019-11-13 | 2023-02-28 | Micron Technology, Inc. | Microelectronic devices including passivation materials, related electronic devices, and related methods |
US11404583B2 (en) | 2019-12-31 | 2022-08-02 | Micron Technology, Inc. | Apparatus including multiple channel materials, and related methods, memory devices, and electronic systems |
EP3882978A1 (en) * | 2020-03-16 | 2021-09-22 | Samsung Electronics Co., Ltd. | Vertical type transistor, inverter including the same, and vertical type semiconductor device including the same |
US20200227525A1 (en) * | 2020-03-26 | 2020-07-16 | Intel Corporation | Vertical string driver with channel field management structure |
US20200227429A1 (en) * | 2020-03-26 | 2020-07-16 | Intel Corporation | Vertical string driver with extended gate junction structure |
US11158367B1 (en) | 2020-04-10 | 2021-10-26 | Micron Technology, Inc. | Semiconductor device protection circuits for protecting a semiconductor device during processing thereof, and associated methods, devices, and systems |
US11653488B2 (en) * | 2020-05-07 | 2023-05-16 | Micron Technology, Inc. | Apparatuses including transistors, and related methods, memory devices, and electronic systems |
US11430895B2 (en) * | 2020-06-03 | 2022-08-30 | Micron Technology, Inc. | Transistors including oxide semiconductive materials, and related microelectronic devices, memory devices, electronic systems, and methods |
US11482538B2 (en) | 2020-10-02 | 2022-10-25 | Micron Technology, Inc. | Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems |
US20220190030A1 (en) * | 2020-12-10 | 2022-06-16 | Intel Corporation | Pillar select transistor for 3-dimensional cross point memory |
WO2022192362A1 (en) * | 2021-03-11 | 2022-09-15 | Tokyo Electron Limited | 3d device with a plurality of core wiring layout architecture |
US20230008902A1 (en) * | 2021-07-08 | 2023-01-12 | Taiwan Semiconductor Msnufacturing Company Limited | Vertical transistors and methods for forming the same |
WO2023000222A1 (zh) * | 2021-07-21 | 2023-01-26 | 华为技术有限公司 | 一种包含垂直晶体管的芯片及其制备方法、终端 |
US11839071B2 (en) * | 2021-07-22 | 2023-12-05 | Taiwan Semiconductor Manufacturing Company Limited | Vertical access transistors and methods for forming the same |
US20230132576A1 (en) * | 2021-10-29 | 2023-05-04 | Micron Technology, Inc. | Appraratus and method including memory device having 2-transistor vertical memory cell |
US11935930B2 (en) * | 2021-11-30 | 2024-03-19 | International Business Machines Corporation | Wrap-around-contact for 2D-channel gate-all-around field-effect-transistors |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006013481A (ja) * | 2004-05-28 | 2006-01-12 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
JP2011023543A (ja) * | 2009-07-15 | 2011-02-03 | Renesas Electronics Corp | 半導体装置及び半導体装置の製造方法 |
WO2012091126A1 (ja) * | 2010-12-28 | 2012-07-05 | 株式会社神戸製鋼所 | 薄膜トランジスタの半導体層用酸化物およびスパッタリングターゲット、並びに薄膜トランジスタ |
JP2017059607A (ja) * | 2015-09-15 | 2017-03-23 | 株式会社東芝 | 半導体装置 |
JP2017073550A (ja) * | 2015-10-09 | 2017-04-13 | 株式会社半導体エネルギー研究所 | 撮像装置、モジュール、および電子機器 |
JP2017120910A (ja) * | 2015-12-31 | 2017-07-06 | エルジー ディスプレイ カンパニー リミテッド | 薄膜トランジスタ、薄膜トランジスタを有する表示装置、及び薄膜トランジスタの製造方法 |
WO2017130073A1 (ja) * | 2016-01-29 | 2017-08-03 | 株式会社半導体エネルギー研究所 | 半導体装置、及び該半導体装置を有する表示装置 |
JP2017143255A (ja) * | 2016-02-05 | 2017-08-17 | 株式会社半導体エネルギー研究所 | 半導体装置、電子機器 |
Family Cites Families (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4636822A (en) * | 1984-08-27 | 1987-01-13 | International Business Machines Corporation | GaAs short channel lightly doped drain MESFET structure and fabrication |
US5759901A (en) * | 1995-04-06 | 1998-06-02 | Vlsi Technology, Inc. | Fabrication method for sub-half micron CMOS transistor |
JP3127874B2 (ja) * | 1998-02-12 | 2001-01-29 | 日本電気株式会社 | 電界効果トランジスタ及びその製造方法 |
US6259138B1 (en) * | 1998-12-18 | 2001-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having multilayered gate electrode and impurity regions overlapping therewith |
DE69942442D1 (de) * | 1999-01-11 | 2010-07-15 | Semiconductor Energy Lab | Halbleiteranordnung mit Treiber-TFT und Pixel-TFT auf einem Substrat |
JP2002185080A (ja) * | 2000-12-15 | 2002-06-28 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JP2002246601A (ja) * | 2001-02-16 | 2002-08-30 | Seiko Epson Corp | 半導体装置及び半導体装置の製造方法 |
JP4570811B2 (ja) * | 2001-04-27 | 2010-10-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US6804062B2 (en) * | 2001-10-09 | 2004-10-12 | California Institute Of Technology | Nonimaging concentrator lens arrays and microfabrication of the same |
US6761116B2 (en) * | 2001-10-17 | 2004-07-13 | Textron Sytems Corporation | Constant output high-precision microcapillary pyrotechnic initiator |
JP4108537B2 (ja) * | 2003-05-28 | 2008-06-25 | 富士雄 舛岡 | 半導体装置 |
US10374120B2 (en) * | 2005-02-18 | 2019-08-06 | Koninklijke Philips N.V. | High efficiency solar cells utilizing wafer bonding and layer transfer to integrate non-lattice matched materials |
US20090224263A1 (en) * | 2008-03-06 | 2009-09-10 | Toshiba America Electronic Components, Inc. | Generating Stress in a Field Effect Transistor |
US7724577B2 (en) * | 2008-05-08 | 2010-05-25 | Micron Technology, Inc. | NAND with back biased operation |
US7964490B2 (en) * | 2008-12-31 | 2011-06-21 | Intel Corporation | Methods of forming nickel sulfide film on a semiconductor device |
US20100213458A1 (en) | 2009-02-23 | 2010-08-26 | Micron Technology, Inc. | Rigid semiconductor memory having amorphous metal oxide semiconductor channels |
JP5330027B2 (ja) * | 2009-02-25 | 2013-10-30 | 株式会社東芝 | 不揮発性半導体記憶装置、及びその製造方法 |
CN101853882B (zh) * | 2009-04-01 | 2016-03-23 | 台湾积体电路制造股份有限公司 | 具有改进的开关电流比的高迁移率多面栅晶体管 |
JP4415062B1 (ja) * | 2009-06-22 | 2010-02-17 | 富士フイルム株式会社 | 薄膜トランジスタ及び薄膜トランジスタの製造方法 |
US20110133266A1 (en) | 2009-12-03 | 2011-06-09 | Sanh Tang | Flash Memory Having a Floating Gate in the Shape of a Curved Section |
US8102712B2 (en) | 2009-12-22 | 2012-01-24 | Intel Corporation | NAND programming technique |
US8792260B2 (en) * | 2010-09-27 | 2014-07-29 | Semiconductor Energy Laboratory Co., Ltd. | Rectifier circuit and semiconductor device using the same |
US8431961B2 (en) | 2011-02-03 | 2013-04-30 | Micron Technology, Inc. | Memory devices with a connecting region having a band gap lower than a band gap of a body region |
US8445347B2 (en) * | 2011-04-11 | 2013-05-21 | Sandisk Technologies Inc. | 3D vertical NAND and method of making thereof by front and back side processing |
WO2012154675A1 (en) * | 2011-05-06 | 2012-11-15 | Alliance For Sustainable Energy, Llc | Photovoltaic device |
JP6013685B2 (ja) * | 2011-07-22 | 2016-10-25 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9177872B2 (en) * | 2011-09-16 | 2015-11-03 | Micron Technology, Inc. | Memory cells, semiconductor devices, systems including such cells, and methods of fabrication |
JP6051524B2 (ja) * | 2012-01-18 | 2016-12-27 | セイコーエプソン株式会社 | 半導体基板及び半導体基板の製造方法 |
JP6001308B2 (ja) * | 2012-04-17 | 2016-10-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US8609536B1 (en) * | 2012-07-06 | 2013-12-17 | Micron Technology, Inc. | Stair step formation using at least two masks |
KR101925012B1 (ko) * | 2012-07-17 | 2018-12-05 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그의 제조 방법 |
US8614126B1 (en) | 2012-08-15 | 2013-12-24 | Sandisk Technologies Inc. | Method of making a three-dimensional memory array with etch stop |
US9064577B2 (en) | 2012-12-06 | 2015-06-23 | Micron Technology, Inc. | Apparatuses and methods to control body potential in memory operations |
US9024376B2 (en) * | 2013-01-25 | 2015-05-05 | Unisantis Electronics Singapore Pte. Ltd. | Vertical transistor with dielectrically-isolated work-function metal electrodes surrounding the semiconductor pillar |
US9111591B2 (en) | 2013-02-22 | 2015-08-18 | Micron Technology, Inc. | Interconnections for 3D memory |
KR20140106903A (ko) * | 2013-02-27 | 2014-09-04 | 에스케이하이닉스 주식회사 | 트랜지스터, 이를 구비하는 가변 저항 메모리 장치 및 그의 제조방법 |
US9007860B2 (en) | 2013-02-28 | 2015-04-14 | Micron Technology, Inc. | Sub-block disabling in 3D memory |
US9411722B2 (en) * | 2013-03-04 | 2016-08-09 | Sandisk Technologies Llc | Asynchronous FIFO buffer for memory access |
US9129859B2 (en) | 2013-03-06 | 2015-09-08 | Intel Corporation | Three dimensional memory structure |
US9515080B2 (en) | 2013-03-12 | 2016-12-06 | Sandisk Technologies Llc | Vertical NAND and method of making thereof using sequential stack etching and landing pad |
US9666702B2 (en) * | 2013-03-15 | 2017-05-30 | Matthew H. Kim | Advanced heterojunction devices and methods of manufacturing advanced heterojunction devices |
US9281044B2 (en) | 2013-05-17 | 2016-03-08 | Micron Technology, Inc. | Apparatuses having a ferroelectric field-effect transistor memory array and related method |
EP2808897B1 (en) * | 2013-05-30 | 2021-06-30 | IMEC vzw | Tunnel field effect transistor and method for making thereof |
US9337210B2 (en) * | 2013-08-12 | 2016-05-10 | Micron Technology, Inc. | Vertical ferroelectric field effect transistor constructions, constructions comprising a pair of vertical ferroelectric field effect transistors, vertical strings of ferroelectric field effect transistors, and vertical strings of laterally opposing pairs of vertical ferroelectric field effect transistors |
US9231055B2 (en) * | 2013-08-19 | 2016-01-05 | SK Hynix Inc. | Semiconductor device having fin gate, resistive memory device including the same, and method of manufacturing the same |
US9240420B2 (en) * | 2013-09-06 | 2016-01-19 | Sandisk Technologies Inc. | 3D non-volatile storage with wide band gap transistor decoder |
US9105468B2 (en) | 2013-09-06 | 2015-08-11 | Sandisk 3D Llc | Vertical bit line wide band gap TFT decoder |
US9437604B2 (en) | 2013-11-01 | 2016-09-06 | Micron Technology, Inc. | Methods and apparatuses having strings of memory cells including a metal source |
KR20150070819A (ko) * | 2013-12-17 | 2015-06-25 | 에스케이하이닉스 주식회사 | 반도체 메모리 소자 및 그 제조방법 |
US9722049B2 (en) * | 2013-12-23 | 2017-08-01 | Intermolecular, Inc. | Methods for forming crystalline IGZO with a seed layer |
US9209199B2 (en) | 2014-03-21 | 2015-12-08 | Intel Corporation | Stacked thin channels for boost and leakage improvement |
US9502518B2 (en) | 2014-06-23 | 2016-11-22 | Stmicroelectronics, Inc. | Multi-channel gate-all-around FET |
KR20160000294A (ko) * | 2014-06-24 | 2016-01-04 | 에스케이하이닉스 주식회사 | 수직 채널을 갖는 반도체 장치, 그를 포함하는 저항 메모리 장치 및 그 제조방법 |
JP2016058769A (ja) * | 2014-09-05 | 2016-04-21 | 株式会社東芝 | 出力回路および光結合装置 |
US9418743B1 (en) * | 2015-02-17 | 2016-08-16 | Macronix International Co., Ltd. | 3D NAND memory with decoder and local word line drivers |
US9583615B2 (en) * | 2015-02-17 | 2017-02-28 | Sandisk Technologies Llc | Vertical transistor and local interconnect structure |
US9424936B1 (en) | 2015-03-23 | 2016-08-23 | Intel Corporation | Current leakage reduction in 3D NAND memory |
JP6592961B2 (ja) * | 2015-05-19 | 2019-10-23 | セイコーエプソン株式会社 | 炭化ケイ素基板および炭化ケイ素基板の製造方法 |
EP3262687B1 (en) * | 2015-06-08 | 2021-04-07 | SanDisk Technologies LLC | Three-dimensional memory device having a heterostructure quantum well channel |
US9761599B2 (en) | 2015-08-17 | 2017-09-12 | Micron Technology, Inc. | Integrated structures containing vertically-stacked memory cells |
US20170104000A1 (en) * | 2015-10-13 | 2017-04-13 | Joo-Hee PARK | Vertical memory devices |
US9793404B2 (en) * | 2015-11-30 | 2017-10-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Silicon germanium p-channel FinFET stressor structure and method of making same |
-
2018
- 2018-08-23 US US16/110,217 patent/US11018255B2/en active Active
- 2018-08-23 CN CN201880061883.3A patent/CN111183521B/zh active Active
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-
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- 2021-05-11 US US17/316,943 patent/US20210265499A1/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006013481A (ja) * | 2004-05-28 | 2006-01-12 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
JP2011023543A (ja) * | 2009-07-15 | 2011-02-03 | Renesas Electronics Corp | 半導体装置及び半導体装置の製造方法 |
WO2012091126A1 (ja) * | 2010-12-28 | 2012-07-05 | 株式会社神戸製鋼所 | 薄膜トランジスタの半導体層用酸化物およびスパッタリングターゲット、並びに薄膜トランジスタ |
JP2017059607A (ja) * | 2015-09-15 | 2017-03-23 | 株式会社東芝 | 半導体装置 |
JP2017073550A (ja) * | 2015-10-09 | 2017-04-13 | 株式会社半導体エネルギー研究所 | 撮像装置、モジュール、および電子機器 |
JP2017120910A (ja) * | 2015-12-31 | 2017-07-06 | エルジー ディスプレイ カンパニー リミテッド | 薄膜トランジスタ、薄膜トランジスタを有する表示装置、及び薄膜トランジスタの製造方法 |
WO2017130073A1 (ja) * | 2016-01-29 | 2017-08-03 | 株式会社半導体エネルギー研究所 | 半導体装置、及び該半導体装置を有する表示装置 |
JP2017143255A (ja) * | 2016-02-05 | 2017-08-17 | 株式会社半導体エネルギー研究所 | 半導体装置、電子機器 |
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CN111183521A (zh) | 2020-05-19 |
KR20200035323A (ko) | 2020-04-02 |
KR102331218B1 (ko) | 2021-12-02 |
EP3676873A4 (en) | 2021-05-26 |
WO2019046106A1 (en) | 2019-03-07 |
US20210265499A1 (en) | 2021-08-26 |
KR102463483B1 (ko) | 2022-11-04 |
EP3676873A1 (en) | 2020-07-08 |
US20190067475A1 (en) | 2019-02-28 |
US11018255B2 (en) | 2021-05-25 |
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