JP2020527851A5 - - Google Patents
Info
- Publication number
- JP2020527851A5 JP2020527851A5 JP2019567975A JP2019567975A JP2020527851A5 JP 2020527851 A5 JP2020527851 A5 JP 2020527851A5 JP 2019567975 A JP2019567975 A JP 2019567975A JP 2019567975 A JP2019567975 A JP 2019567975A JP 2020527851 A5 JP2020527851 A5 JP 2020527851A5
- Authority
- JP
- Japan
- Prior art keywords
- slurry solution
- percompound
- oxidizing agent
- slurry
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/645,777 | 2017-07-10 | ||
| US15/645,777 US11078380B2 (en) | 2017-07-10 | 2017-07-10 | Hard abrasive particle-free polishing of hard materials |
| PCT/US2018/041428 WO2019014213A1 (en) | 2017-07-10 | 2018-07-10 | POLISHING WITHOUT HARD ABRASIVE PARTICLES OF HARD MATERIALS |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020527851A JP2020527851A (ja) | 2020-09-10 |
| JP2020527851A5 true JP2020527851A5 (https=) | 2022-12-15 |
| JP7254722B2 JP7254722B2 (ja) | 2023-04-10 |
Family
ID=63165459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019567975A Active JP7254722B2 (ja) | 2017-07-10 | 2018-07-10 | 硬質研磨粒子を用いない硬質材料研磨 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11078380B2 (https=) |
| EP (1) | EP3652260A1 (https=) |
| JP (1) | JP7254722B2 (https=) |
| KR (3) | KR20240013840A (https=) |
| CN (1) | CN111094482B (https=) |
| WO (1) | WO2019014213A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11078380B2 (en) | 2017-07-10 | 2021-08-03 | Entegris, Inc. | Hard abrasive particle-free polishing of hard materials |
| US10647887B2 (en) * | 2018-01-08 | 2020-05-12 | Cabot Microelectronics Corporation | Tungsten buff polishing compositions with improved topography |
| TWI861353B (zh) | 2020-01-31 | 2024-11-11 | 美商恩特葛瑞斯股份有限公司 | 用於研磨硬質材料之化學機械研磨(cmp)組合物 |
| IT202000016279A1 (it) * | 2020-07-06 | 2022-01-06 | St Microelectronics Srl | Procedimento di fabbricazione di un dispositivo semiconduttore in carburo di silicio con migliorate caratteristiche |
| WO2022240842A1 (en) | 2021-05-13 | 2022-11-17 | Araca, Inc. | Silicon carbide (sic) wafer polishing with slurry formulation and process |
| EP4363635A4 (en) | 2021-06-30 | 2025-04-30 | Entegris, Inc. | POLISHING TRANSITION METALS |
| WO2024004752A1 (ja) * | 2022-06-27 | 2024-01-04 | 三井金属鉱業株式会社 | ＳｉＣ基板の製造方法、及びＳｉＣ基板研磨用研磨材スラリー |
| JP2025539348A (ja) * | 2022-11-23 | 2025-12-05 | エンジス コーポレイション | 固定砥粒ナノ研削プレート、関連物品および関連方法 |
| WO2025141715A1 (ja) * | 2023-12-26 | 2025-07-03 | 三井金属鉱業株式会社 | 研磨材スラリー及びその研磨方法 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG90227A1 (en) | 2000-01-18 | 2002-07-23 | Praxair Technology Inc | Polishing slurry |
| US6299795B1 (en) | 2000-01-18 | 2001-10-09 | Praxair S.T. Technology, Inc. | Polishing slurry |
| GB2359558B (en) * | 2000-02-23 | 2002-01-23 | Fujimi America Inc | Polishing composition for a memory hard disk substrate |
| US7316603B2 (en) | 2002-01-22 | 2008-01-08 | Cabot Microelectronics Corporation | Compositions and methods for tantalum CMP |
| US6773873B2 (en) * | 2002-03-25 | 2004-08-10 | Advanced Technology Materials, Inc. | pH buffered compositions useful for cleaning residue from semiconductor substrates |
| US20040175942A1 (en) | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| JP2004247605A (ja) * | 2003-02-14 | 2004-09-02 | Toshiba Corp | Ｃｍｐ用スラリーおよび半導体装置の製造方法 |
| JP2006019358A (ja) * | 2004-06-30 | 2006-01-19 | Sumitomo Chemical Co Ltd | 化学機械研磨用水系分散体 |
| JP5065574B2 (ja) * | 2005-01-12 | 2012-11-07 | 住友電気工業株式会社 | ＧａＮ基板の研磨方法 |
| JP4792802B2 (ja) * | 2005-04-26 | 2011-10-12 | 住友電気工業株式会社 | Ｉｉｉ族窒化物結晶の表面処理方法 |
| JP2007075928A (ja) * | 2005-09-13 | 2007-03-29 | Toray Ind Inc | 研磨パッドおよび研磨装置 |
| TW200724633A (en) | 2005-09-30 | 2007-07-01 | Saint Gobain Ceramics | Polishing slurries and methods for utilizing same |
| WO2008102672A1 (ja) * | 2007-02-20 | 2008-08-28 | Sumitomo Electric Industries, Ltd. | 研磨スラリーおよびその製造方法、ならびに窒化物結晶体およびその表面研磨方法 |
| JP5317436B2 (ja) * | 2007-06-26 | 2013-10-16 | 富士フイルム株式会社 | 金属用研磨液及びそれを用いた研磨方法 |
| US9090885B2 (en) * | 2007-07-26 | 2015-07-28 | The University Of Chicago | Co-incubating confined microbial communities |
| US9368367B2 (en) | 2009-04-13 | 2016-06-14 | Sinmat, Inc. | Chemical mechanical polishing of silicon carbide comprising surfaces |
| WO2010137339A1 (ja) | 2009-05-28 | 2010-12-02 | パナソニック株式会社 | メモリセルアレイ、不揮発性記憶装置、メモリセル、およびメモリセルアレイの製造方法 |
| JP4787891B2 (ja) * | 2009-06-09 | 2011-10-05 | 住友電気工業株式会社 | エピタキシャル層形成用ｉｉｉ族窒化物結晶基板、エピタキシャル層付ｉｉｉ族窒化物結晶基板および半導体デバイス |
| US8828874B2 (en) | 2011-03-28 | 2014-09-09 | Sinmat, Inc. | Chemical mechanical polishing of group III-nitride surfaces |
| WO2013054883A1 (ja) * | 2011-10-13 | 2013-04-18 | 三井金属鉱業株式会社 | 研摩材スラリー及び研摩方法 |
| CN104137232A (zh) * | 2012-02-21 | 2014-11-05 | 日立化成株式会社 | 研磨剂、研磨剂组和基体的研磨方法 |
| US9259818B2 (en) * | 2012-11-06 | 2016-02-16 | Sinmat, Inc. | Smooth diamond surfaces and CMP method for forming |
| US9982180B2 (en) | 2013-02-13 | 2018-05-29 | Honeywell International Inc. | Heat transfer compositions and methods |
| GB201307480D0 (en) | 2013-04-25 | 2013-06-12 | Element Six Ltd | Post-synthesis processing of diamond and related super-hard materials |
| JP2014168067A (ja) * | 2014-03-25 | 2014-09-11 | Asahi Glass Co Ltd | 非酸化物単結晶基板の研磨方法 |
| WO2015193726A1 (es) * | 2014-06-20 | 2015-12-23 | Avalos-García Juan Jesús | Sistema de generación de vapor de agua sobrecalentado usando peróxido de hidrógeno |
| US9567492B2 (en) | 2014-08-28 | 2017-02-14 | Sinmat, Inc. | Polishing of hard substrates with soft-core composite particles |
| JP6611485B2 (ja) | 2014-11-07 | 2019-11-27 | 株式会社フジミインコーポレーテッド | 研磨方法およびポリシング用組成物 |
| JP6744295B2 (ja) * | 2015-04-01 | 2020-08-19 | 三井金属鉱業株式会社 | 研摩材および研摩スラリー |
| WO2018061365A1 (ja) | 2016-09-28 | 2018-04-05 | 株式会社フジミインコーポレーテッド | 表面処理組成物 |
| US20180085888A1 (en) | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads having a consistent pad surface microtexture |
| KR102337333B1 (ko) | 2017-05-25 | 2021-12-13 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 세라믹 재료의 화학기계적 연마를 위한 산화 유체 |
| US11078380B2 (en) | 2017-07-10 | 2021-08-03 | Entegris, Inc. | Hard abrasive particle-free polishing of hard materials |
-
2017
- 2017-07-10 US US15/645,777 patent/US11078380B2/en active Active
-
2018
- 2018-07-10 KR KR1020247000707A patent/KR20240013840A/ko active Pending
- 2018-07-10 WO PCT/US2018/041428 patent/WO2019014213A1/en not_active Ceased
- 2018-07-10 EP EP18752904.5A patent/EP3652260A1/en active Pending
- 2018-07-10 KR KR1020207003213A patent/KR20200026937A/ko not_active Ceased
- 2018-07-10 KR KR1020227015416A patent/KR20220065087A/ko not_active Ceased
- 2018-07-10 JP JP2019567975A patent/JP7254722B2/ja active Active
- 2018-07-10 CN CN201880046086.8A patent/CN111094482B/zh active Active
-
2019
- 2019-12-04 US US16/702,680 patent/US20200102479A1/en not_active Abandoned
-
2021
- 2021-07-01 US US17/365,916 patent/US11820918B2/en active Active
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