JP2020526030A5 - - Google Patents
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- Publication number
- JP2020526030A5 JP2020526030A5 JP2019572152A JP2019572152A JP2020526030A5 JP 2020526030 A5 JP2020526030 A5 JP 2020526030A5 JP 2019572152 A JP2019572152 A JP 2019572152A JP 2019572152 A JP2019572152 A JP 2019572152A JP 2020526030 A5 JP2020526030 A5 JP 2020526030A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- source
- substrate
- target substrate
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 32
- 238000000034 method Methods 0.000 claims 23
- 238000004519 manufacturing process Methods 0.000 claims 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims 1
- 229910052733 gallium Inorganic materials 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762525105P | 2017-06-26 | 2017-06-26 | |
| US62/525,105 | 2017-06-26 | ||
| PCT/US2018/039533 WO2019005818A1 (en) | 2017-06-26 | 2018-06-26 | LIGHT EMITTING DIODE (LED) MASS TRANSFER APPARATUS AND METHOD FOR MANUFACTURING THE SAME |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020526030A JP2020526030A (ja) | 2020-08-27 |
| JP2020526030A5 true JP2020526030A5 (enExample) | 2021-07-26 |
Family
ID=64693505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019572152A Pending JP2020526030A (ja) | 2017-06-26 | 2018-06-26 | 発光ダイオード(led)のマストランスファー装置および製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10978429B2 (enExample) |
| EP (1) | EP3646384A4 (enExample) |
| JP (1) | JP2020526030A (enExample) |
| KR (1) | KR20200013068A (enExample) |
| CN (1) | CN111052386A (enExample) |
| TW (1) | TW201917811A (enExample) |
| WO (1) | WO2019005818A1 (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10720098B2 (en) * | 2017-11-15 | 2020-07-21 | Facebook Technologies, Llc | Pulse-width-modulation control of micro LED |
| JP6650547B1 (ja) * | 2018-12-28 | 2020-02-19 | 信越エンジニアリング株式会社 | 検査装置及び検査方法 |
| US11430830B2 (en) * | 2019-04-05 | 2022-08-30 | Nanosys, Inc. | White light emitting diode (LED) and method of repairing light emitting device using same |
| US11246251B2 (en) | 2019-05-02 | 2022-02-08 | Seagate Technology Llc | Micro-component transfer systems, methods, and devices |
| US10923378B2 (en) | 2019-05-13 | 2021-02-16 | Seagate Technology Llc | Micro-component batch transfer systems, methods, and devices |
| WO2020248201A1 (zh) * | 2019-06-13 | 2020-12-17 | 京东方科技集团股份有限公司 | 微型发光二极管的巨量转移方法及系统 |
| DE102019118270B4 (de) * | 2019-07-05 | 2021-10-07 | X-Fab Semiconductor Foundries Gmbh | Verfahren zur Herstellung von Halbleiterbauelementen zur Ausbeutesteigerung beim Mikrotransferdruck |
| KR20210019323A (ko) * | 2019-08-12 | 2021-02-22 | 삼성전자주식회사 | 마이크로 엘이디 디스플레이 및 이의 제작 방법 |
| WO2021065918A1 (ja) * | 2019-10-01 | 2021-04-08 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| TWI733226B (zh) * | 2019-10-25 | 2021-07-11 | 台灣愛司帝科技股份有限公司 | 發光二極體晶圓以及發光二極體晶圓檢測裝置與方法 |
| KR102297791B1 (ko) * | 2019-11-13 | 2021-09-03 | 한국광기술원 | 레이저를 이용하여 전사 대상물을 분리하고 전사하는 장치 및 방법 |
| KR102163570B1 (ko) * | 2019-11-21 | 2020-10-12 | 엔엠시스코(주) | u-LED Panel to Panel 전사 방식을 이용한 u-LED 글라스 Panel의 LED 소자 공백 확인 및 이를 보충하기 위한 LED 소자 수리 공정 |
| JP7377092B2 (ja) * | 2019-12-16 | 2023-11-09 | Towa株式会社 | 統計データ生成方法、切断装置及びシステム |
| CN111341766B (zh) * | 2020-02-27 | 2023-12-22 | 惠州中京电子科技有限公司 | 一种mini LED主板制作方法 |
| WO2021183644A1 (en) * | 2020-03-10 | 2021-09-16 | Lumileds Llc | Method of manufacturing an augmented led array assembly |
| JP7463153B2 (ja) * | 2020-03-23 | 2024-04-08 | 東レエンジニアリング株式会社 | 実装方法および実装装置 |
| JP2022115687A (ja) * | 2021-01-28 | 2022-08-09 | 東レエンジニアリング株式会社 | 転写装置 |
| WO2021193135A1 (ja) * | 2020-03-23 | 2021-09-30 | 東レエンジニアリング株式会社 | 実装方法、実装装置、および転写装置 |
| CN112992665B (zh) * | 2020-05-22 | 2022-02-25 | 重庆康佳光电技术研究院有限公司 | 巨量转移装置、系统及其控制方法 |
| TWI752595B (zh) * | 2020-08-18 | 2022-01-11 | 東捷科技股份有限公司 | 自發光畫素裝置 |
| CN112768572B (zh) * | 2021-01-07 | 2022-10-11 | 武汉理工大学 | 基于高速扫描激光转印的微型led巨量转移方法及装置 |
| CN116190257A (zh) * | 2021-11-26 | 2023-05-30 | 群创光电股份有限公司 | 电子装置的制造方法 |
| TWI807544B (zh) * | 2021-12-17 | 2023-07-01 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
| WO2023182625A1 (ko) * | 2022-03-22 | 2023-09-28 | 엘지전자 주식회사 | 불량 검사용 기판, 반도체 발광 소자 및 디스플레이 장치 |
| DE102022204077A1 (de) * | 2022-04-27 | 2023-11-02 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zum Ermitteln einer Abpickreihenfolge für eine Halbleiter-Bestückungseinrichtung |
| DE102022114646A1 (de) * | 2022-06-10 | 2023-12-21 | Trumpf Laser Gmbh | Verfahren und Vorrichtung zum Verarbeiten mindestens eines Teilbereichs eines Schichtsystems |
| EP4507477A4 (en) * | 2022-12-15 | 2025-09-03 | Boe Technology Group Co Ltd | BILLBOARD AND DISPLAY APPARATUS |
| CN118841358B (zh) * | 2024-06-28 | 2025-11-21 | 天马新型显示技术研究院(厦门)有限公司 | 发光元件转移板,修补方法和显示面板 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4860296A (en) * | 1983-12-30 | 1989-08-22 | American Telephone And Telegraph Company, At&T Bell Laboratories | Laser controlled by a multiple-layer heterostructure |
| US5634267A (en) * | 1991-06-04 | 1997-06-03 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
| JP2819369B2 (ja) * | 1992-11-30 | 1998-10-30 | 京セラ株式会社 | 画像ヘッドの組立方法 |
| JP2002314053A (ja) * | 2001-04-19 | 2002-10-25 | Sony Corp | チップ部品の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法 |
| EP1455394B1 (en) * | 2001-07-24 | 2018-04-11 | Samsung Electronics Co., Ltd. | Transfer method |
| US7744770B2 (en) * | 2004-06-23 | 2010-06-29 | Sony Corporation | Device transfer method |
| US7378288B2 (en) | 2005-01-11 | 2008-05-27 | Semileds Corporation | Systems and methods for producing light emitting diode array |
| US20060225273A1 (en) * | 2005-03-29 | 2006-10-12 | Symbol Technologies, Inc. | Transferring die(s) from an intermediate surface to a substrate |
| JP2010050344A (ja) * | 2008-08-22 | 2010-03-04 | Fujinon Corp | リワーク装置 |
| JP2010080863A (ja) * | 2008-09-29 | 2010-04-08 | Nikon Corp | 転写装置及びデバイス製造方法 |
| US8334152B2 (en) * | 2009-12-18 | 2012-12-18 | Cooledge Lighting, Inc. | Method of manufacturing transferable elements incorporating radiation enabled lift off for allowing transfer from host substrate |
| JP5883250B2 (ja) * | 2011-07-29 | 2016-03-09 | リンテック株式会社 | 転写装置および転写方法 |
| JP5996254B2 (ja) * | 2012-04-26 | 2016-09-21 | 株式会社ディスコ | リフトオフ方法 |
| US8748202B2 (en) * | 2012-09-14 | 2014-06-10 | Bridgelux, Inc. | Substrate free LED package |
| US9331230B2 (en) | 2012-10-30 | 2016-05-03 | Cbrite Inc. | LED die dispersal in displays and light panels with preserving neighboring relationship |
| JP2014186868A (ja) * | 2013-03-22 | 2014-10-02 | Toray Ind Inc | 転写装置、転写方法、及びデバイス製造方法 |
| US9871350B2 (en) * | 2014-02-10 | 2018-01-16 | Soraa Laser Diode, Inc. | Manufacturable RGB laser diode source |
| US9620436B2 (en) | 2014-04-09 | 2017-04-11 | Invensas Corporation | Light emitting diode device with reconstituted LED components on substrate |
| US9653445B2 (en) | 2014-10-24 | 2017-05-16 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of fabricating 3D package with short cycle time and high yield |
| US9397001B2 (en) * | 2014-12-11 | 2016-07-19 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing electronic device comprising a resin substrate and an electronic component |
| US9418895B1 (en) * | 2015-03-14 | 2016-08-16 | International Business Machines Corporation | Dies for RFID devices and sensor applications |
| US9633883B2 (en) * | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
| JP2017013092A (ja) * | 2015-07-01 | 2017-01-19 | イビデン株式会社 | プリント配線板の製造装置とプリント配線板の製造方法 |
| JP6488921B2 (ja) * | 2015-07-02 | 2019-03-27 | 富士通株式会社 | リワーク装置及びリワーク方法 |
| CN108352143B (zh) | 2015-09-02 | 2021-04-16 | 脸谱科技有限责任公司 | 半导体器件的组装 |
| WO2017066921A1 (en) * | 2015-10-20 | 2017-04-27 | Goertek.Inc | Transferring method, manufacturing method, device and electronic apparatus of micro-led |
| KR101809252B1 (ko) * | 2017-02-24 | 2017-12-14 | 서울대학교산학협력단 | 반도체 적층 구조, 이를 이용한 질화물 반도체층 분리방법 및 장치 |
-
2018
- 2018-06-25 TW TW107121749A patent/TW201917811A/zh unknown
- 2018-06-26 KR KR1020207002145A patent/KR20200013068A/ko not_active Ceased
- 2018-06-26 US US16/019,012 patent/US10978429B2/en active Active
- 2018-06-26 EP EP18825387.6A patent/EP3646384A4/en not_active Withdrawn
- 2018-06-26 JP JP2019572152A patent/JP2020526030A/ja active Pending
- 2018-06-26 CN CN201880055587.2A patent/CN111052386A/zh active Pending
- 2018-06-26 WO PCT/US2018/039533 patent/WO2019005818A1/en not_active Ceased
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