TWI807544B - 顯示面板及其製造方法 - Google Patents
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- 229910052751 metal Inorganic materials 0.000 claims description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 239000002096 quantum dot Substances 0.000 claims description 9
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- 150000002739 metals Chemical class 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
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- 239000010949 copper Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
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Abstract
一種顯示面板及其製造方法。顯示面板包括基板、第一子畫素及第二子畫素。第一子畫素設置於基板上。第一子畫素具有第一指向特性,且第一子畫素與基板之間具有第一接著材料。第二子畫素設置於基板上。第二子畫素具有第二指向特性,且第二子畫素與基板之間距有第二接著材料。第一指向特性與第二指向特性不同,第一接著材料與第二接著材料不同。
Description
本發明是有關於一種面板及方法,且特別是有關於一種顯示面板及其製造方法。
隨著顯示面板尺寸的增加,如何快速且有效率地針對顯示面板中具有缺陷的畫素進行修補,已成為了本領域中待解決的重要課題之一。
本發明提供一種顯示面板及其製造方法,以有效率地顯示面板中具有缺陷的畫素進行修補。
本發明的顯示面板包括基板、第一子畫素及第二子畫素。第一子畫素設置於基板上。第一子畫素具有第一指向特性,且第一子畫素與基板之間具有第一接著材料。第二子畫素設置於基板上。第二子畫素具有第二指向特性,且第二子畫素與基板之間距有第二接著材料。第一指向特性與第二指向特性不同,第一接著
材料與第二接著材料不同。
本發明的顯示面板的製造方法,包括:提供基板;於基板上設置第一子畫素,其中第一子畫素具有第一指向特性,且第一子畫素與基板之間具有第一接著材料;以及於基板上設置第二子畫素,第二子畫素具有第二指向特性,且第二子畫素與基板之間具有第二接著材料,其中第一指向特性與第二指向特性不同,第一接著材料與第二接著材料不同。
基於上述,本發明的顯示面板及其製造方法可透過相對簡單的硬體裝置及相對短的操作流程,來修補顯示面板上的缺陷,以改善顯示面板的顯示效果。
1:顯示面板
10:第一畫素
10R、10G、10B:子畫素
11:第二畫素
11R、11G、11B、111、112、113:子畫素
PX2、PX3、PX5a、PX5b、PX5c、PX5d、PX6A~PX6E、PX6F1、PX6F2、PX6G1、PX6G2:畫素
ST:轉置元件頭
12:基板
AD2:第二接著材料
D1:第一方向
D2:第二方向
PD1~PD6:接墊
RA:顯示畫素區
RB:主畫素區
RC:備用畫素區
圖1為本發明實施例一顯示面板的俯視示意圖。
圖2A~2F為本發明實施例中一顯示面板中一畫素的製造流程的俯視示意圖。
圖3A~3E、3G為本發明實施例中另一顯示面板中一畫素的製造流程的俯視示意圖。
圖3F為圖3E中轉置元件頭ST抓取子畫素進行按壓的側視示意圖。
圖4A~4C為本發明實施例用來替換的子畫素的示意圖。
圖5A~5C為本發明實施例一畫素的排列示意圖。
圖6A~6G為本發明實施例一畫素的排列示意圖。
圖1為本發明實施例一顯示面板1的俯視示意圖。顯示面板1中包括多個第一畫素10、多個第二畫素11以及基板12。基板12被區分為多個顯示畫素區RA,而第一畫素10及第二畫素11設置在基板12,且分別被設置在對應的顯示畫素區RA中。具體來說,第一畫素10會具有第一指向特性,且第二畫素11會具有第二指向特性,而第一指向特性與第二指向特性不同。
在一些實施例中,第一畫素10及第二畫素11可為透過相同的轉置元件頭,但透過不同的轉置程序所設置的。舉例來說,轉置元件頭可先將各個第一畫素10設置於基板12上的各個顯示畫素區RA中,並進行檢查以移除其中具有缺陷的第一畫素10之後,再透過相同的轉置元件頭將第二畫素11填補至空缺的顯示畫素區RA中。如此一來,修補或替換整體顯示面板1中具有缺陷的第一畫素10的操作,可透過相同的轉置元件頭來完成,不需切換硬體裝置。故整體操作流程可為相對簡單,且避免額外硬體配置的成本。
在一些實施例中,由於第一畫素10及第二畫素11是轉置元件頭由不同晶圓上所拿取的,因此設置在基板12上的第一畫素10及第二畫素11會具有不同的指向特性。指向特性可例如包含有各個畫素與其對應的顯示畫素區RA之間的位置偏移量以及
角度偏移量。舉例來說,在圖1中的每個第一畫素10會具有一致的位置偏移量與角度偏移量,且每個第二畫素也會具有一致的位置偏移量與角度偏移量。更具體來說,各個第一畫素10相較於其個別對應的顯示畫素區RA,每個第一畫素10皆會貼齊在對應顯示畫素區RA的左上角而設置,且每個第一畫素10的設置方向皆會平行於對應顯示畫素區RA的延伸方向(及第二方向D2)也就是每個第一畫素10與顯示畫素區RA之間會具有為零的角度偏移量。相較之下,每個第二畫素11與其對應顯示畫素區RA的左上角之間,在第一方向D1及/或第二方向D2上的會具有位置偏移量,使第二畫素11不貼齊其所對應顯示畫素區RA,且第二畫素11的設置方向與顯示畫素區RA的延伸方向之間不為平行,也就是每個第二畫素11與顯示畫素區RA之間會具有不為零的角度偏移量。
因此,第一畫素10彼此之間會具有相同的第一指向特性,而第二畫素11彼此之間會具有相同的第二指向特性。而在第一指向特性及第二指向特性中,第一畫素10的位置偏移量及第二畫素11的位置偏移量不同,及/或第一畫素10的角度偏移量及第二畫素11的角度偏移量不同。
另一方面,在一些實施例中,轉置元件頭在設置第一畫素10時是透過第一接著材料,以將第一畫素10固定於基板12上的各個顯示畫素區RA中。而為了在透過轉置元件頭設置第二畫素11時,能夠選擇性地將第二畫素11設置在空缺的顯示畫素區RA中,在轉置元件頭設置第二畫素11之間,會先將具有黏著性的第
二接著材料塗佈於空缺的顯示畫素區RA中。如此一來,當轉置元件頭拿取第二畫素11並按壓於基板12上時,第二畫素11可被第二接著材料黏置在原先為空缺的顯示畫素區RA中,進而完成第一顯示畫素10的替換。
在一些實施例中,第一畫素10及第二畫素11可例如是發光二極體、有機發光二極體(organic light emitting diode,OLED)、次毫米發光二極體(mini LED)、微發光二極體(micro LED)或量子點發光二極體(quantum dot,QD,可例如為QLED、QDLED)或其他適合之畫素或材料。在一些實施例中,第一接著材料與第二接著材料不同。第一接著材料可例如是焊錫。第二接著材料可例如包含有金屬、光阻、樹脂、膠體、黑色遮光層,彩色濾光片、量子點或其他適合的材料。進一步,金屬可例如為金、銀、銅、錫或其他適合的金屬。
圖2A~2F為本發明實施例中一顯示面板中一畫素PX2的製造流程的俯視示意圖。
在圖2A中,首先在基板12上會提供畫素PX2,畫素PX2中具有子畫素10R、10G、10B。子畫素10R、10G、10B可分別用來顯示例如紅綠藍的顏色。每個畫素PX2可被設置在對應的顯示畫素區中,在此實施例中,畫素PX2的顯示畫素區可被區分為三個主畫素區RB及三個備用畫素區RC。子畫素10R、10G、10B被分別設置在對應的主畫素區RB中。而每個主畫素RB旁設置有相鄰的備用畫素區RC。
雖然未繪示於圖2A,子畫素10R、10G、10B與基板12之間設置有第一接著材料,子畫素10R、10G、10B可透過第一接著材料被固定於基板12上。第一接著材料可例如是焊錫。
在圖2B中,畫素PX2上個每個子畫素10R、10G、10B會被個別檢查其是否具有缺陷。在此實施例中,左上角的畫素PX2的子畫素10R經過檢查後,其被判斷出是具有缺陷的子畫素10R。
在圖2C中,具有缺陷的子畫素10R可由左上角的畫素PX2中被移除。因此,在左上角的畫素PX2中,由於原先設置的子畫素10R即被移除,故主畫素區RB中為空置的。
在圖2D中,在左上角的畫素PX2中,針對原先設置有子畫素10R的主畫素區RB,可在其相鄰的備用畫素區RC上塗佈上與第一接著材料不同的第二接著材料。
在一些實施例中,第二接著材料可透過以噴墨印刷(ink jet printing,IJP)的方式被塗佈上備用畫素區RC。而第二接著材料可例如為導體或非導體的接著材料,其具有黏性。在此實施例中,第二接著材料可包括例如包含有金屬、光阻、樹脂、膠體、黑色遮光層(black matrix,BM),彩色濾光片(color filter,CF)、量子點或其他適合的材料。金屬可例如包括金、銀、銅、錫或其他適合的金屬。
在一些實施例中第二接著材料可例如是光阻材料。第二接著材料在塗佈上備用畫素區RC之後,可再以雷射直寫(laser direct imaging,LDI)對第二接著材料進行曝光。而曝光後的第二
接著材料會產生黏性。在此實施例中,第二接著材料可例如包含有金屬、光阻、樹脂、膠體、黑色遮光層,彩色濾光片、量子點或其他適合的材料。金屬可例如包括金、銀、銅、錫或其他適合的金屬。
在圖2E中,轉置元件頭可由備用晶圓(未繪示於圖2A~2F中)上抓取多個子畫素11R,並於子畫素11R上施加適當壓力於備用畫素區RC所形成的列上。更具體來說,轉置元件頭可將子畫素11R按置在備用畫素區RC,而被按置的備用畫素區RC旁邊即為設置有子畫素10R的主畫素區RB。
在一些實施例中,當第二接著材料為導體時,轉置元件頭可以將子畫素11R按壓於第二接著材料上,使其被第二接著材料黏著即可。在一些實施例中,當第二接著材料為非導體時,轉置元件頭可以較大的壓力以將子畫素11R按壓於基板12上,使子畫素11R可穿透第二接著材料,直接接觸並電性連接於基板12上的佈線。
在圖2F中,當轉置元件頭離開基板12上時,由於第二接著材料的緣故,僅有左上角的畫素PX2中的子畫素11R會被留下,其他畫素PX2中由於並未塗佈有第二接著材料,故子畫素11R並不會被留置在其他畫素的備用畫素區RC中。
因此,透過塗佈具有黏著性的第二接著材料,使基板12在備用畫素區RC上可選擇性地由轉置元件頭上黏取需要的子畫素11R,並保持其他不需要設置的備用畫素區RC為空置。如此一
來,在每個畫素PX2中,其所設置的子畫素數量總和為相等。故每個畫素PX2中的子畫素數量並不會因為替換掉具有缺陷的子畫素而有所不同,可有效保持整體顯示面板的亮度均勻,並降低無謂的消耗功率。
另一方面,在一些實施例中,在圖2A中的子畫素10R、10G、10B亦可是透過與圖2E中設置子畫素11R相同的轉置元件頭來設置。在圖2A的步驟中設置完子畫素10R、10G、10B後,在圖2E的步驟中即可透過相同的轉置元件頭來替換掉具有缺陷的子畫素,避免替換轉置元件頭的操作時間,即可有效節省整體的硬體成本及操作時間成本。
圖3A~3F為本發明實施例中另一顯示面板中一畫素PX3的製造流程的俯視示意圖。圖3A~3F中所繪示的畫素PX3可相似於圖2A~2F中所繪示的畫素PX2,只是在畫素PX3中僅設置有主畫素區RB,且未設置有備用畫素區。
在圖3A中,首先在基板12上會提供畫素PX3,畫素PX3中具有子畫素10R、10G、10B。而子畫素10R、10G、10B可分別被設置在對應的主畫素區RB中。
雖然未繪示於圖3A,子畫素10R、10G、10B與基板12之間設置有第一接著材料,子畫素10R、10G、10B可透過第一接著材料被固定於基板12上。第一接著材料可例如是焊錫。
在圖3B中,畫素PX3上個每個子畫素10R、10G、10B會被個別檢查其是否具有缺陷。在此實施例中,左上角的畫素PX3
的子畫素10G經過檢查後,其被判斷出是具有缺陷的子畫素10G。
在圖3C中,具有缺陷的子畫素10G可由左上角的畫素PX3中被移除。因此,在左上角的畫素PX3中,由於原先設置的子畫素10G即被移除,故主畫素區RB中為空置的。
在圖3D中,在左上角的畫素PX3中,與第一接著材料不同的第二接著材料可被塗佈在原先設置有子畫素10G的主畫素區RB上。
在一些實施例中,第二接著材料可透過以噴墨印刷(ink jet printing,IJP)的方式被塗佈上備用畫素區RC。而第二接著材料可例如為導體或非導體的接著材料,其具有黏性。在此實施例中,第二接著材料可包括例如包含有金屬、光阻、樹脂、膠體、黑色遮光層、彩色濾光層、量子點或其他適合的材料。金屬可例如為金、銀、銅、錫或其他適合的金屬。
在一些實施例中第二接著材料可例如是光阻材料。第二接著材料在塗佈上備用畫素區RC之後,可再以雷射直寫(laser direct imaging,LDI)對第二接著材料進行曝光。而曝光後的第二接著材料會產生黏性。在此實施例中,第二接著材料可例如包含金屬、光阻、樹脂、膠體、黑色遮光層、彩色濾光層、量子點或其他適合的材料。金屬可例如為金、銀、銅、錫或其他適合的金屬。
在圖3E中,轉置元件頭可由備用晶圓(未繪示於圖3A~3F中)上抓取多個子畫素11G,並將子畫素11G以適當壓力按
壓於主畫素區RB所形成的列上。更具體來說,轉置元件頭可將其中一個子畫素11G按置在被移除掉子畫素10G的主畫素區RB上,而其他的子畫素11G則是被按置在未移除掉子畫素RB上。
關於圖3E的操作細節請進一步參考圖3F。圖3F為圖3E中,轉置元件頭ST抓取子畫素11G進行按壓的側視圖。圖3F中為了方便說明,部分元件(例如是子畫素10R、10B)被省略了。
詳細來說,當轉置元件頭ST抓取子畫素11G進行按壓時,轉置元件頭ST會將子畫素11G按壓於原先被移除掉子畫素10G的主畫素區RB的上方。另一方面,轉置元件頭ST由於是陣列式的結構,轉置元件頭ST也會將子畫素11G按壓在其他畫素PX3的子畫素10G上方。進一步,為了使子畫素11G可較佳地被第二材料AD2黏附,轉置元件頭ST可以適當的壓力按壓,在不傷及其他子畫素10G的情況下將子畫素11G按壓在原先被移除掉子畫素10G的主畫素區RB的上方。
在圖3G中,當轉置元件頭ST離開基板12上時,由於第二接著材料AD2的緣故,僅有左上角的畫素PX3中的子畫素11G會被留下,故可替換掉具有缺陷的子畫素10G。另外,在替換完成的畫素PX3中,子畫素11G設置在基板12上的設置高度可較子畫素10R、10B的設置高度為高。
圖4A~4C為本發明實施例用來替換的子畫素111~113的示意圖。
在圖4A中,用來替換的子畫素111可例如是具有橫向
(lateral)結構的晶片,且子畫素111在上方設置有兩接墊PD1、PD2。如此一來,子畫素111在放置時可在子畫素111與基板之間透過非導體的第二接著材料黏著,並在子畫素111的上方透過氧化銦錫(Indium Tin Oxide,ITO)與接墊PD1、PD2進行電性連接。
在圖4B中,用來替換的子畫素112可例如是覆晶技術(flip chip)所製造結構的晶片,且子畫素112在下方設置有兩接墊PD3、PD4。如此一來,子畫素112在放置時可在子畫素112與基板之間透過導體的第二接著材料黏著,進而與接墊PD3、PD4進行電性連接。又或者是,子畫素112在放置時可在子畫素112與基板之間透過非導體的第二接著材料黏著,並透過轉置元件頭施加適當的壓力,使子畫素112的接墊PD3、PD4可與基板直接接觸並進行電性連接。
在圖4C中,用來替換的子畫素113可例如是具有垂直(vertical)結構的晶片,且子畫素113在其上方及下方分別設置有接墊PD5、PD6。如此一來,子畫素113在放置時可在子畫素111與基板之間透過導體的第二接著材料黏著,進而與接墊PD6進行電性連接。
圖5A~5C為本發明實施例中一顯示面板中畫素PX5a~PX5d的製造流程的俯視示意圖。在本實施例中,畫素PX5a~PX5d中可以被區分有三個主畫素區RB以及僅一個備用畫素區RC。
在圖5A中,畫素PX5a左上角的子畫素10R、畫素PX5b右上角的子畫素10G、畫素PX5d左下角的子畫素10B經檢查後可
被判斷為具有缺陷的子畫素。
在圖5B中,將第二接著材料塗佈在畫素PX5a的備用畫素區RC中,以及轉置元件頭抓取子畫素11R放置於基板上之後,子畫素11R可被設置於子畫素PX5a的備用畫素區RC中。
在圖5C中,經過重複圖4B的操作,子畫素11G及11B可分別被設置在畫素PX5b、PX5d的備用畫素區RC中。並且,畫素PX5a、PX5b、PX5d中具有缺陷的子畫素10R、10G、10B亦可被移除。
雖然在圖2A~2F及圖3A~3G所繪示的製造流程中,具有缺陷的子畫素是先被移除之後,再放置替換的子畫素,但在具有備用畫素區的情況下,移除具有缺陷的子畫素的步驟當然可以彈性地調整。例如是在放置替換的子畫素之後,再移除具有缺陷的子畫素,亦應屬於本發明實施例的範疇中。
圖6A~6G為本發明實施例一畫素的排列示意圖。由於本領域具通常知識者當然可依據不同的設計需求來調整顯示畫素區中備用畫素區的數量,或顯示畫素區中主畫素區與備用畫素區之間的排列方式,故圖6A~6G中示例性地繪示了不同畫素的排列示意圖。
在圖6A中,畫素PX6A中可被區分為三個主畫素區及三個備用畫素區,而每個主畫素區與對應的備用畫素區互相相鄰排列。
在圖6B中,畫素PX6B中可被區分為三個主畫素區及僅
有一個備用畫素區,主畫素區與備用畫素區可共同排列為矩形或方形,使每個主畫素區皆相鄰於該備用畫素區。
在圖6C中,畫素PX6C可被區分為三個主畫素區及僅有一個備用畫素區,主畫素區與備用畫素區可共同排列為T字型。更具體來說,主畫素區三者可共同排為一橫列,而備用畫素區則排在T字型的橫列下方。
在圖6D中,畫素PX6C可被區分為三個主畫素區及僅有一個備用畫素區,主畫素區與備用畫素區可共同排列為T字型。更具體來說,備用畫素區則排在T字型的橫列正中央,而主畫素區三者排列在T字形的三個頂端。
在圖6E中,畫素PX6C可被區分為三個主畫素區及僅有一個備用畫素區。主畫素區可為具有相同大小的矩形形狀,並且共同排唯一橫列。而備用畫素區則排列在主畫素區的橫列下方,使主畫素區及備用畫素區共同形成一矩形。
在圖6F的左側中,畫素PX6F1可具有兩個主畫素區及僅有一個備用畫素區。兩個主畫素區中可分別設置紅色及綠色的子畫素。進一步,在畫素PX6F1的右側可連接有畫素PX6F2,也具有兩個主畫素區及僅有一個備用畫素區。畫素PX6F2的主畫素區可分別設置有藍色及綠色的子畫素。因此,透過重複排列畫素PX6F1、PX6F2,顯示陣列中的畫素可被共同排列成圖6F右側的形式。
在圖6G的左側中,畫素PX6G1、PX6G2可共用一個備
用畫素區。詳細來說,畫素PX6G1、PX6G2可分別具有紅、綠、藍的子畫素,而六個子畫素共同環繞備用畫素區而設置。因此,透過重複排列畫素PX6G1、PX6G2,顯示陣列中的畫素可被共同排列成圖6G右側的形式。
綜上所述,本發明的顯示面板及其造方法透過第二接著材料選擇性地將第二畫素黏置於空缺的顯示畫素區中,使製造顯示面板的過程中,可透過相同的轉置元件頭來設置第一畫素及第二畫素,故可透過相對簡單的硬體裝置及相對短的操作流程,來修補顯示面板上的缺陷,以改善顯示面板的顯示效果。
1:顯示面板
10:第一畫素
11:第二畫素
12:基板
D1:第一方向
D2:第二方向
RA:顯示畫素區
Claims (14)
- 一種顯示面板,包括:一基板;多個第一子畫素,設置於該基板上,該些第一子畫素具有一第一指向特性,且該些第一子畫素與該基板之間具有一第一接著材料;以及多個第二子畫素,設置於該基板上,該些第二子畫素具有一第二指向特性,且該些第二子畫素與該基板之間距有一第二接著材料,其中該第一指向特性與該第二指向特性不同,該第一接著材料與該第二接著材料不同。
- 如請求項1所述的顯示面板,其中該些第一子畫素與該基板之間具有一第一高度,該些第二子畫素與該基板之間具有一第二高度,該第一高度及該第二高度不相同。
- 如請求項2所述的顯示面板,其中該第二高度大於該第一高度。
- 如請求項1所述的顯示面板,其中該些第一子畫素及該些第二子畫素分別被設置在對應的多個顯示畫素區中,該第一指向特性包括各該第一子畫素與對應的各該顯示畫素區之間的一第一位置偏移量及一第一角度偏移量,該第二指向特性包括各該第二子畫素與對應的各該顯示畫素區之間的一第二位置偏移量及一第二角度偏移量, 該第一位置偏移量及該第二位置偏移量不同,及/或該第一角度偏移量及該第一角度偏移量不同。
- 如請求項1所述的顯示面板,其中該第一接著材料或第二接著材料包含金屬、光阻、樹脂、膠體、黑色遮光層、彩色濾光層或量子點。
- 如請求項1所述的顯示面板,包括多個顯示畫素區,各該顯示畫素區包括一主畫素區及一備用畫素區,其中一子畫素被設置在該主畫素區及該備用畫素區的其中一者上。
- 一種顯示面板的製造方法,包括:提供一基板;於該基板上設置多個第一子畫素,其中該些第一子畫素具有一第一指向特性,且該些第一子畫素與該基板之間具有一第一接著材料;以及於該基板上設置多個第二子畫素,該些第二子畫素具有一第二指向特性,且該些第二子畫素與該基板之間具有一第二接著材料,其中該第一指向特性與該第二指向特性不同,該第一接著材料與該第二接著材料不同。
- 如請求項7所述的製造方法,包括:於設置該些第一子畫素之後,檢查該些第一子畫素以由該些第一子畫素中判斷出具有缺陷的多個第三子畫素;移除該些第三子畫素;以及 在該些第三子畫素被移除的多個標記顯示畫素區中,分別設置該些第二子畫素。
- 如請求項8所述的製造方法,其中在設置該些第三子畫素的該些標記顯示畫素區中,分別設置該些第二子畫素的步驟包括:在該些標記顯示畫素區中塗佈該第二接著材料之後,將該些第二子畫素設置於該些標記顯示畫素區中。
- 如請求項7所述的製造方法,其中該些第一子畫素與該基板之間具有一第一高度,該些第二子畫素與該基板之間具有一第二高度,該第一高度及該第二高度不相同。
- 如請求項10所述的製造方法,其中該第二高度大於該第一高度。
- 如請求項7所述的製造方法,其中該些第一子畫素及該些第二子畫素分別被設置在對應的多個顯示畫素區中,該第一指向特性包括各該第一子畫素與對應的各該顯示畫素區之間的一第一位置偏移量及一第一角度偏移量,該第二指向特性包括各該第二子畫素與對應的各該顯示畫素區之間的一第二位置偏移量及一第二角度偏移量,該第一位置偏移量及該第二位置偏移量不同,及/或該第一角度偏移量及該第一角度偏移量不同。
- 如請求項7所述的製造方法,其中該第一接著材料或第二接著材料包括金屬、光阻、樹脂、膠體、黑色遮光層、彩色濾光層或量子點。
- 如請求項7所述的製造方法,還包括提供多個顯示畫素區,且各該顯示畫素區包括一主畫素區及一備用畫素區,其中一子畫素被設置在該主畫素區及該備用畫素區的其中一者上。
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