JP2020522025A5 - - Google Patents

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Publication number
JP2020522025A5
JP2020522025A5 JP2019566815A JP2019566815A JP2020522025A5 JP 2020522025 A5 JP2020522025 A5 JP 2020522025A5 JP 2019566815 A JP2019566815 A JP 2019566815A JP 2019566815 A JP2019566815 A JP 2019566815A JP 2020522025 A5 JP2020522025 A5 JP 2020522025A5
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JP
Japan
Prior art keywords
substrate
layer
mask
etch
zone
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JP2019566815A
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English (en)
Japanese (ja)
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JP7017196B2 (ja
JP2020522025A (ja
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Priority claimed from FI20175505A external-priority patent/FI128629B/en
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Publication of JP2020522025A5 publication Critical patent/JP2020522025A5/ja
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Publication of JP7017196B2 publication Critical patent/JP7017196B2/ja
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JP2019566815A 2017-06-02 2018-05-22 マスタープレートの製造方法及びマスタープレート Active JP7017196B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20175505A FI128629B (en) 2017-06-02 2017-06-02 Method for making a master plate and a master plate
FI20175505 2017-06-02
PCT/FI2018/050384 WO2018220272A1 (en) 2017-06-02 2018-05-22 Method of manufacturing a master plate and a master plate

Publications (3)

Publication Number Publication Date
JP2020522025A JP2020522025A (ja) 2020-07-27
JP2020522025A5 true JP2020522025A5 (enExample) 2020-12-17
JP7017196B2 JP7017196B2 (ja) 2022-02-08

Family

ID=64455230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019566815A Active JP7017196B2 (ja) 2017-06-02 2018-05-22 マスタープレートの製造方法及びマスタープレート

Country Status (7)

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US (1) US20210157042A1 (enExample)
EP (1) EP3631538B8 (enExample)
JP (1) JP7017196B2 (enExample)
CN (1) CN110998375A (enExample)
ES (1) ES2938898T3 (enExample)
FI (1) FI128629B (enExample)
WO (1) WO2018220272A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020131317A1 (en) 2018-12-17 2020-06-25 Applied Materials, Inc. Methods for controlling etch depth by localized heating
WO2020232136A1 (en) * 2019-05-15 2020-11-19 Applied Materials, Inc. Methods of forming variable-depth device structures
US20220082739A1 (en) * 2020-09-17 2022-03-17 Facebook Technologies, Llc Techniques for manufacturing variable etch depth gratings using gray-tone lithography
EP4217772A4 (en) * 2020-09-23 2025-02-19 Applied Materials, Inc. FABRICATION OF A DIFFRACTIVE OPTICAL ELEMENT HAVING A VARIABLE REFRACTIVE INDEX PROFILE BY INKJET PRINTING DEPOSITION
US12259552B2 (en) * 2020-12-17 2025-03-25 Google Llc Spatial variance along waveguide incoupler
US12652976B2 (en) * 2021-07-22 2026-06-09 Lawrence Livermore National Security, Llc Systems and methods for silicon microstructures fabricated via greyscale DRIE with SOI release
BE1030607B1 (nl) * 2022-06-10 2024-01-16 Flooring Ind Ltd Sarl Perselement en werkwijze voor het vervaardigen van perselementen
EP4393692A3 (en) * 2021-12-02 2024-10-09 Unilin, BV Press element and method for manufacturing press elements
DE102022116428A1 (de) * 2022-06-30 2024-01-04 Hueck Rheinische Gmbh Verfahren zur Bearbeitung einer Oberfläche eines Presswerkzeugs, sowie Vorrichtung zur Bearbeitung einer Oberfläche eines Presswerkzeugs

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103310A (ja) * 1983-11-11 1985-06-07 Pioneer Electronic Corp マイクロフレネルレンズの製造方法
JPS6415705A (en) * 1987-07-09 1989-01-19 Matsushita Electric Industrial Co Ltd Production of fine element
JPH06258510A (ja) * 1993-03-09 1994-09-16 Canon Inc 回折格子製作用成形型およびその製造方法
JP3576885B2 (ja) * 1998-09-18 2004-10-13 キヤノン株式会社 素子の製造方法
JP2001004821A (ja) * 1999-06-24 2001-01-12 Canon Inc 回折光学素子及びその製造方法
US6905618B2 (en) * 2002-07-30 2005-06-14 Agilent Technologies, Inc. Diffractive optical elements and methods of making the same
EP1547132A1 (en) * 2002-09-18 2005-06-29 Tokyo University of Science Surface processing method
JP2006017788A (ja) * 2004-06-30 2006-01-19 Sumitomo Heavy Ind Ltd 階段状表面を有する部材の製造方法及びその部材
WO2006120720A1 (ja) * 2005-05-02 2006-11-16 Oki Electric Industry Co., Ltd. 回折光学素子の製造方法
JP2007057622A (ja) * 2005-08-22 2007-03-08 Ricoh Co Ltd 光学素子及びその製造方法、光学素子用形状転写型の製造方法及び光学素子用転写型
EP1930776A4 (en) * 2005-09-09 2008-11-26 Univ Tokyo Sci Educ Found PROCESS FOR PRODUCING A THREE-DIMENSIONAL FORM, PROCESS FOR MANUFACTURING A MICROFABRICATION PRODUCT, PROCESS FOR PRODUCING A MICROSTRUCTURE FORMULATION, THREE-DIMENSIONAL FORM, MICROFABRICATION PRODUCT, MICROSTRUCTURE FORMING AND OPTICAL DEVICE
JP2007328096A (ja) * 2006-06-07 2007-12-20 Ricoh Co Ltd 回折光学素子とその作製方法および光学モジュール
JP2008089923A (ja) * 2006-09-29 2008-04-17 Oki Electric Ind Co Ltd 光学素子の製造方法
TWI438500B (zh) * 2008-10-20 2014-05-21 United Microelectronics Corp 一種形成相位光柵的方法
WO2018026412A1 (en) * 2016-08-02 2018-02-08 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Naval Research Laboratory Fabrication method for digital etching of nanometer-scale level structures
US10649141B1 (en) * 2018-04-23 2020-05-12 Facebook Technologies, Llc Gratings with variable etch heights for waveguide displays
US10845609B2 (en) * 2018-06-28 2020-11-24 Intel Corporation Diffractive optical elements for wide field-of-view virtual reality devices and methods of manufacturing the same

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