JP2020505900A5 - - Google Patents
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- Publication number
- JP2020505900A5 JP2020505900A5 JP2019541259A JP2019541259A JP2020505900A5 JP 2020505900 A5 JP2020505900 A5 JP 2020505900A5 JP 2019541259 A JP2019541259 A JP 2019541259A JP 2019541259 A JP2019541259 A JP 2019541259A JP 2020505900 A5 JP2020505900 A5 JP 2020505900A5
- Authority
- JP
- Japan
- Prior art keywords
- showing
- heatsink
- busbar
- diagram illustrating
- illustrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 7
- 239000012809 cooling fluid Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1701487.9 | 2017-01-30 | ||
| GB1701487.9A GB2563186A (en) | 2017-01-30 | 2017-01-30 | Semiconductor arrangement |
| PCT/GB2018/050258 WO2018138530A1 (en) | 2017-01-30 | 2018-01-30 | Semiconductor arrangement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020505900A JP2020505900A (ja) | 2020-02-20 |
| JP2020505900A5 true JP2020505900A5 (enExample) | 2020-04-02 |
| JP7096255B2 JP7096255B2 (ja) | 2022-07-05 |
Family
ID=58462769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019541259A Active JP7096255B2 (ja) | 2017-01-30 | 2018-01-30 | 半導体構成 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11276622B2 (enExample) |
| EP (1) | EP3574522B1 (enExample) |
| JP (1) | JP7096255B2 (enExample) |
| KR (1) | KR20190131013A (enExample) |
| CN (1) | CN110520982A (enExample) |
| BR (1) | BR112019011897A2 (enExample) |
| GB (1) | GB2563186A (enExample) |
| RU (1) | RU2019126805A (enExample) |
| WO (1) | WO2018138530A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2559180B (en) | 2017-01-30 | 2020-09-09 | Yasa Ltd | Semiconductor cooling arrangement |
| DE102019200020A1 (de) | 2019-01-03 | 2020-07-09 | Zf Friedrichshafen Ag | Busbaranordnung und Leistungselektronikanordnungen |
| DE102020106492A1 (de) | 2019-04-12 | 2020-10-15 | Infineon Technologies Ag | Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung |
| EP4625781A2 (en) | 2019-04-25 | 2025-10-01 | American Axle & Manufacturing, Inc. | Electric drive module |
| US11923716B2 (en) | 2019-09-13 | 2024-03-05 | Milwaukee Electric Tool Corporation | Power converters with wide bandgap semiconductors |
| CN113141785B (zh) | 2019-11-18 | 2022-10-18 | 华为数字能源技术有限公司 | 一种带围框的电子器件、带电子器件的电路板和电子设备 |
| DE102019133377B4 (de) * | 2019-12-06 | 2023-08-31 | Sma Solar Technology Ag | Wechselrichter mit kompakter bauform |
| US12027975B2 (en) | 2020-05-22 | 2024-07-02 | Marel Power Solutions | Packaged module with sintered switch |
| US12041759B2 (en) * | 2020-07-31 | 2024-07-16 | Smart Wires Inc. | Scalable modular cooling unit having voltage isolation |
| CN111984098B (zh) * | 2020-08-28 | 2022-06-07 | 苏州浪潮智能科技有限公司 | 一种计算机系统的散热方法、装置、设备及介质 |
| CN114285297A (zh) * | 2020-09-27 | 2022-04-05 | 华为数字能源技术有限公司 | 逆变器、动力总成及电动车 |
| GB2602340B (en) * | 2020-12-23 | 2024-04-03 | Yasa Ltd | Semiconductor cooling arrangement with improved heatsink |
| GB2602341B (en) * | 2020-12-23 | 2023-11-08 | Yasa Ltd | Semiconductor cooling arrangement with improved baffle |
| EP4309274A4 (en) | 2021-03-15 | 2025-03-26 | American Axle & Manufacturing, Inc. | ELECTRIC DRIVE UNIT |
| DE102021203801A1 (de) * | 2021-04-16 | 2022-10-20 | Molabo Gmbh | Gekühltes Hochstromsystem |
| DE102021122769A1 (de) | 2021-09-02 | 2023-03-02 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Umrichter eines zumindest teilweise elektrisch angetriebenen Kraftfahrzeugs und Kraftfahrzeug |
| US12193202B2 (en) * | 2021-09-15 | 2025-01-07 | Marel Power Solutions, Inc. | Air cooled compact power systems |
| WO2023044384A1 (en) * | 2021-09-15 | 2023-03-23 | Marel Power Solutions, Inc. | Compact power converter |
| DE102021128947A1 (de) | 2021-11-08 | 2023-05-11 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Pulswechselrichter sowie Antriebsstrang |
| WO2023101925A1 (en) | 2021-12-01 | 2023-06-08 | American Axle & Manufacturing, Inc. | Electric drive unit with motor assembly isolated from beaming loads transmitted through housing assembly |
| CN115185342B (zh) * | 2022-05-31 | 2025-09-16 | 超聚变数字技术有限公司 | 一种服务器及其相关设备 |
| DE102022115995A1 (de) | 2022-06-28 | 2023-12-28 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Vorrichtung mit einem Pulswechselrichter |
| KR102734589B1 (ko) * | 2022-11-15 | 2024-11-25 | 전북대학교산학협력단 | 급속충전 전원장치용 전력반도체 방열판 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4010489A (en) | 1975-05-19 | 1977-03-01 | General Motors Corporation | High power semiconductor device cooling apparatus and method |
| US4399484A (en) | 1981-03-10 | 1983-08-16 | The United States Of America As Represented By The Secretary Of The Air Force | Integral electric module and assembly jet cooling system |
| US5003376A (en) * | 1989-03-28 | 1991-03-26 | Coriolis Corporation | Cooling of large high power semi-conductors |
| US5099884A (en) | 1991-05-24 | 1992-03-31 | Ntn Technical Center (U.S.A.), Inc. | Electrorheological fluid plate valve |
| US5380956A (en) | 1993-07-06 | 1995-01-10 | Sun Microsystems, Inc. | Multi-chip cooling module and method |
| US5841634A (en) | 1997-03-12 | 1998-11-24 | Delco Electronics Corporation | Liquid-cooled baffle series/parallel heat sink |
| FR2786655B1 (fr) | 1998-11-27 | 2001-11-23 | Alstom Technology | Dispositif electronique de puissance |
| JP4009056B2 (ja) | 2000-05-25 | 2007-11-14 | 三菱電機株式会社 | パワーモジュール |
| JP3501134B2 (ja) * | 2001-03-13 | 2004-03-02 | 松下電器産業株式会社 | 高周波加熱装置用スイッチング電源 |
| GB2403354B (en) * | 2002-06-10 | 2005-03-23 | Visteon Global Tech Inc | Machine integrated power |
| JP3858834B2 (ja) * | 2003-02-24 | 2006-12-20 | オンキヨー株式会社 | 半導体素子の放熱器 |
| EP1683403B1 (en) | 2003-11-14 | 2011-02-09 | DET International Holding Limited | Power supply with improved cooling |
| US8125781B2 (en) * | 2004-11-11 | 2012-02-28 | Denso Corporation | Semiconductor device |
| JP4225310B2 (ja) | 2004-11-11 | 2009-02-18 | 株式会社デンソー | 半導体装置 |
| JP4729336B2 (ja) * | 2005-04-27 | 2011-07-20 | 株式会社豊田自動織機 | パワーモジュール用基板 |
| US7450378B2 (en) | 2006-10-25 | 2008-11-11 | Gm Global Technology Operations, Inc. | Power module having self-contained cooling system |
| JP5227532B2 (ja) | 2007-04-02 | 2013-07-03 | 日立オートモティブシステムズ株式会社 | インバータ回路用の半導体モジュール |
| DE502007003871D1 (de) * | 2007-09-28 | 2010-07-01 | Eberspaecher Controls Gmbh & C | Stromschiene mit Wärmeableitung |
| US7641490B2 (en) * | 2007-12-18 | 2010-01-05 | Gm Global Technology Operations, Inc. | Liquid-cooled inverter assembly |
| US7916480B2 (en) * | 2007-12-19 | 2011-03-29 | GM Global Technology Operations LLC | Busbar assembly with integrated cooling |
| US20100038774A1 (en) | 2008-08-18 | 2010-02-18 | General Electric Company | Advanced and integrated cooling for press-packages |
| US7916483B2 (en) | 2008-10-23 | 2011-03-29 | International Business Machines Corporation | Open flow cold plate for liquid cooled electronic packages |
| US20100147492A1 (en) * | 2008-12-10 | 2010-06-17 | Ronald David Conry | IGBT cooling method |
| DE102008061489A1 (de) | 2008-12-10 | 2010-06-17 | Siemens Aktiengesellschaft | Stromrichtermodul mit gekühlter Verschienung |
| GB0902394D0 (en) | 2009-02-13 | 2009-04-01 | Isis Innovation | Electric machine- cooling |
| US7952875B2 (en) * | 2009-05-29 | 2011-05-31 | GM Global Technology Operations LLC | Stacked busbar assembly with integrated cooling |
| JP2011050197A (ja) | 2009-08-28 | 2011-03-10 | Hitachi Ltd | 電力変換装置 |
| US8169779B2 (en) | 2009-12-15 | 2012-05-01 | GM Global Technology Operations LLC | Power electronics substrate for direct substrate cooling |
| JP5551808B2 (ja) | 2010-03-05 | 2014-07-16 | 日立オートモティブシステムズ株式会社 | 半導体モジュール及びこれを備えた電力変換装置 |
| JP2012016095A (ja) * | 2010-06-29 | 2012-01-19 | Denso Corp | 電力変換装置 |
| US8659896B2 (en) | 2010-09-13 | 2014-02-25 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling apparatuses and power electronics modules |
| JP2012239337A (ja) | 2011-05-13 | 2012-12-06 | Denso Corp | 電力変換装置 |
| US9247672B2 (en) | 2013-01-21 | 2016-01-26 | Parker-Hannifin Corporation | Passively controlled smart microjet cooling array |
| WO2014147963A1 (ja) * | 2013-03-19 | 2014-09-25 | 富士電機株式会社 | 冷却装置及びこれを備えた電力変換装置 |
| US9414520B2 (en) * | 2013-05-28 | 2016-08-09 | Hamilton Sundstrand Corporation | Immersion cooled motor controller |
| WO2016008509A1 (en) | 2014-07-15 | 2016-01-21 | Abb Technology Ltd | Electric module for improved thermal management in electrical equipments |
| JP2016158358A (ja) * | 2015-02-24 | 2016-09-01 | 株式会社デンソー | 半導体モジュール |
| CN106340513B (zh) | 2015-07-09 | 2019-03-15 | 台达电子工业股份有限公司 | 一种集成控制电路的功率模块 |
| JP2017163065A (ja) | 2016-03-11 | 2017-09-14 | 富士通株式会社 | 電子機器 |
| GB2559180B (en) | 2017-01-30 | 2020-09-09 | Yasa Ltd | Semiconductor cooling arrangement |
-
2017
- 2017-01-30 GB GB1701487.9A patent/GB2563186A/en not_active Withdrawn
-
2018
- 2018-01-30 EP EP18702555.6A patent/EP3574522B1/en active Active
- 2018-01-30 CN CN201880009069.7A patent/CN110520982A/zh active Pending
- 2018-01-30 BR BR112019011897A patent/BR112019011897A2/pt not_active IP Right Cessation
- 2018-01-30 KR KR1020197017720A patent/KR20190131013A/ko not_active Withdrawn
- 2018-01-30 US US16/482,140 patent/US11276622B2/en active Active
- 2018-01-30 RU RU2019126805A patent/RU2019126805A/ru not_active Application Discontinuation
- 2018-01-30 JP JP2019541259A patent/JP7096255B2/ja active Active
- 2018-01-30 WO PCT/GB2018/050258 patent/WO2018138530A1/en not_active Ceased
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