CN110520982A - 半导体布置 - Google Patents

半导体布置 Download PDF

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Publication number
CN110520982A
CN110520982A CN201880009069.7A CN201880009069A CN110520982A CN 110520982 A CN110520982 A CN 110520982A CN 201880009069 A CN201880009069 A CN 201880009069A CN 110520982 A CN110520982 A CN 110520982A
Authority
CN
China
Prior art keywords
inverter
module
semiconductor
bus
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880009069.7A
Other languages
English (en)
Chinese (zh)
Inventor
S·D·哈特
T·伍尔默
C·S·马拉姆
T·希尔曼
R·菲利普斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yasa Co Ltd
Original Assignee
Yasa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yasa Co Ltd filed Critical Yasa Co Ltd
Publication of CN110520982A publication Critical patent/CN110520982A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
CN201880009069.7A 2017-01-30 2018-01-30 半导体布置 Pending CN110520982A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1701487.9 2017-01-30
GB1701487.9A GB2563186A (en) 2017-01-30 2017-01-30 Semiconductor arrangement
PCT/GB2018/050258 WO2018138530A1 (en) 2017-01-30 2018-01-30 Semiconductor arrangement

Publications (1)

Publication Number Publication Date
CN110520982A true CN110520982A (zh) 2019-11-29

Family

ID=58462769

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880009069.7A Pending CN110520982A (zh) 2017-01-30 2018-01-30 半导体布置

Country Status (9)

Country Link
US (1) US11276622B2 (enExample)
EP (1) EP3574522B1 (enExample)
JP (1) JP7096255B2 (enExample)
KR (1) KR20190131013A (enExample)
CN (1) CN110520982A (enExample)
BR (1) BR112019011897A2 (enExample)
GB (1) GB2563186A (enExample)
RU (1) RU2019126805A (enExample)
WO (1) WO2018138530A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114285297A (zh) * 2020-09-27 2022-04-05 华为数字能源技术有限公司 逆变器、动力总成及电动车
CN114788432A (zh) * 2019-12-06 2022-07-22 艾思玛太阳能技术股份公司 具有紧凑结构的逆变器
CN115185342A (zh) * 2022-05-31 2022-10-14 超聚变数字技术有限公司 一种服务器及其相关设备

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GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement
DE102019200020A1 (de) 2019-01-03 2020-07-09 Zf Friedrichshafen Ag Busbaranordnung und Leistungselektronikanordnungen
DE102020106492A1 (de) 2019-04-12 2020-10-15 Infineon Technologies Ag Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung
EP4625781A2 (en) 2019-04-25 2025-10-01 American Axle & Manufacturing, Inc. Electric drive module
US11923716B2 (en) 2019-09-13 2024-03-05 Milwaukee Electric Tool Corporation Power converters with wide bandgap semiconductors
CN113141785B (zh) 2019-11-18 2022-10-18 华为数字能源技术有限公司 一种带围框的电子器件、带电子器件的电路板和电子设备
US12027975B2 (en) 2020-05-22 2024-07-02 Marel Power Solutions Packaged module with sintered switch
US12041759B2 (en) * 2020-07-31 2024-07-16 Smart Wires Inc. Scalable modular cooling unit having voltage isolation
CN111984098B (zh) * 2020-08-28 2022-06-07 苏州浪潮智能科技有限公司 一种计算机系统的散热方法、装置、设备及介质
GB2602340B (en) * 2020-12-23 2024-04-03 Yasa Ltd Semiconductor cooling arrangement with improved heatsink
GB2602341B (en) * 2020-12-23 2023-11-08 Yasa Ltd Semiconductor cooling arrangement with improved baffle
EP4309274A4 (en) 2021-03-15 2025-03-26 American Axle & Manufacturing, Inc. ELECTRIC DRIVE UNIT
DE102021203801A1 (de) * 2021-04-16 2022-10-20 Molabo Gmbh Gekühltes Hochstromsystem
DE102021122769A1 (de) 2021-09-02 2023-03-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Umrichter eines zumindest teilweise elektrisch angetriebenen Kraftfahrzeugs und Kraftfahrzeug
US12193202B2 (en) * 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
WO2023044384A1 (en) * 2021-09-15 2023-03-23 Marel Power Solutions, Inc. Compact power converter
DE102021128947A1 (de) 2021-11-08 2023-05-11 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Pulswechselrichter sowie Antriebsstrang
WO2023101925A1 (en) 2021-12-01 2023-06-08 American Axle & Manufacturing, Inc. Electric drive unit with motor assembly isolated from beaming loads transmitted through housing assembly
DE102022115995A1 (de) 2022-06-28 2023-12-28 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Vorrichtung mit einem Pulswechselrichter
KR102734589B1 (ko) * 2022-11-15 2024-11-25 전북대학교산학협력단 급속충전 전원장치용 전력반도체 방열판

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CN1525558A (zh) * 2003-02-24 2004-09-01 ������������ʽ���� 半导体元件的散热器
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114788432A (zh) * 2019-12-06 2022-07-22 艾思玛太阳能技术股份公司 具有紧凑结构的逆变器
CN114285297A (zh) * 2020-09-27 2022-04-05 华为数字能源技术有限公司 逆变器、动力总成及电动车
CN115185342A (zh) * 2022-05-31 2022-10-14 超聚变数字技术有限公司 一种服务器及其相关设备

Also Published As

Publication number Publication date
BR112019011897A2 (pt) 2019-10-22
JP7096255B2 (ja) 2022-07-05
US20200227334A1 (en) 2020-07-16
GB2563186A (en) 2018-12-12
GB201701487D0 (en) 2017-03-15
JP2020505900A (ja) 2020-02-20
US11276622B2 (en) 2022-03-15
EP3574522B1 (en) 2021-03-03
EP3574522A1 (en) 2019-12-04
KR20190131013A (ko) 2019-11-25
WO2018138530A1 (en) 2018-08-02
RU2019126805A (ru) 2021-03-01
RU2019126805A3 (enExample) 2021-03-19

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