JP7096255B2 - 半導体構成 - Google Patents

半導体構成 Download PDF

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Publication number
JP7096255B2
JP7096255B2 JP2019541259A JP2019541259A JP7096255B2 JP 7096255 B2 JP7096255 B2 JP 7096255B2 JP 2019541259 A JP2019541259 A JP 2019541259A JP 2019541259 A JP2019541259 A JP 2019541259A JP 7096255 B2 JP7096255 B2 JP 7096255B2
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Prior art keywords
inverter
modules
semiconductor
heat sink
pcb
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JP2020505900A5 (enExample
JP2020505900A (ja
Inventor
デイビッド ハート サイモン
ウールマー ティム
スチュアート マラム クリストファー
ヒルマン トム
フィリップス リチャード
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ヤサ リミテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/115—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D the devices being arranged next to each other
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Inverter Devices (AREA)
JP2019541259A 2017-01-30 2018-01-30 半導体構成 Active JP7096255B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1701487.9 2017-01-30
GB1701487.9A GB2563186A (en) 2017-01-30 2017-01-30 Semiconductor arrangement
PCT/GB2018/050258 WO2018138530A1 (en) 2017-01-30 2018-01-30 Semiconductor arrangement

Publications (3)

Publication Number Publication Date
JP2020505900A JP2020505900A (ja) 2020-02-20
JP2020505900A5 JP2020505900A5 (enExample) 2020-04-02
JP7096255B2 true JP7096255B2 (ja) 2022-07-05

Family

ID=58462769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019541259A Active JP7096255B2 (ja) 2017-01-30 2018-01-30 半導体構成

Country Status (9)

Country Link
US (1) US11276622B2 (enExample)
EP (1) EP3574522B1 (enExample)
JP (1) JP7096255B2 (enExample)
KR (1) KR20190131013A (enExample)
CN (1) CN110520982A (enExample)
BR (1) BR112019011897A2 (enExample)
GB (1) GB2563186A (enExample)
RU (1) RU2019126805A (enExample)
WO (1) WO2018138530A1 (enExample)

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GB2559180B (en) 2017-01-30 2020-09-09 Yasa Ltd Semiconductor cooling arrangement
DE102019200020A1 (de) 2019-01-03 2020-07-09 Zf Friedrichshafen Ag Busbaranordnung und Leistungselektronikanordnungen
DE102020106492A1 (de) 2019-04-12 2020-10-15 Infineon Technologies Ag Chip -package, verfahren zum bilden eines chip -packages, halbleitervorrichtung, halbleiteranordnung, dreiphasensystem, verfahren zum bilden einer halbleitervorrichtung und verfahren zum bilden einer halbleiteranordnung
EP4625781A2 (en) 2019-04-25 2025-10-01 American Axle & Manufacturing, Inc. Electric drive module
US11923716B2 (en) 2019-09-13 2024-03-05 Milwaukee Electric Tool Corporation Power converters with wide bandgap semiconductors
CN113141785B (zh) 2019-11-18 2022-10-18 华为数字能源技术有限公司 一种带围框的电子器件、带电子器件的电路板和电子设备
DE102019133377B4 (de) * 2019-12-06 2023-08-31 Sma Solar Technology Ag Wechselrichter mit kompakter bauform
US12027975B2 (en) 2020-05-22 2024-07-02 Marel Power Solutions Packaged module with sintered switch
US12041759B2 (en) * 2020-07-31 2024-07-16 Smart Wires Inc. Scalable modular cooling unit having voltage isolation
CN111984098B (zh) * 2020-08-28 2022-06-07 苏州浪潮智能科技有限公司 一种计算机系统的散热方法、装置、设备及介质
CN114285297A (zh) * 2020-09-27 2022-04-05 华为数字能源技术有限公司 逆变器、动力总成及电动车
GB2602340B (en) * 2020-12-23 2024-04-03 Yasa Ltd Semiconductor cooling arrangement with improved heatsink
GB2602341B (en) * 2020-12-23 2023-11-08 Yasa Ltd Semiconductor cooling arrangement with improved baffle
EP4309274A4 (en) 2021-03-15 2025-03-26 American Axle & Manufacturing, Inc. ELECTRIC DRIVE UNIT
DE102021203801A1 (de) * 2021-04-16 2022-10-20 Molabo Gmbh Gekühltes Hochstromsystem
DE102021122769A1 (de) 2021-09-02 2023-03-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Umrichter eines zumindest teilweise elektrisch angetriebenen Kraftfahrzeugs und Kraftfahrzeug
US12193202B2 (en) * 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
WO2023044384A1 (en) * 2021-09-15 2023-03-23 Marel Power Solutions, Inc. Compact power converter
DE102021128947A1 (de) 2021-11-08 2023-05-11 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Pulswechselrichter sowie Antriebsstrang
WO2023101925A1 (en) 2021-12-01 2023-06-08 American Axle & Manufacturing, Inc. Electric drive unit with motor assembly isolated from beaming loads transmitted through housing assembly
CN115185342B (zh) * 2022-05-31 2025-09-16 超聚变数字技术有限公司 一种服务器及其相关设备
DE102022115995A1 (de) 2022-06-28 2023-12-28 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Vorrichtung mit einem Pulswechselrichter
KR102734589B1 (ko) * 2022-11-15 2024-11-25 전북대학교산학협력단 급속충전 전원장치용 전력반도체 방열판

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Also Published As

Publication number Publication date
BR112019011897A2 (pt) 2019-10-22
US20200227334A1 (en) 2020-07-16
GB2563186A (en) 2018-12-12
GB201701487D0 (en) 2017-03-15
JP2020505900A (ja) 2020-02-20
US11276622B2 (en) 2022-03-15
CN110520982A (zh) 2019-11-29
EP3574522B1 (en) 2021-03-03
EP3574522A1 (en) 2019-12-04
KR20190131013A (ko) 2019-11-25
WO2018138530A1 (en) 2018-08-02
RU2019126805A (ru) 2021-03-01
RU2019126805A3 (enExample) 2021-03-19

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