JP2020504438A5 - - Google Patents
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- Publication number
- JP2020504438A5 JP2020504438A5 JP2019527215A JP2019527215A JP2020504438A5 JP 2020504438 A5 JP2020504438 A5 JP 2020504438A5 JP 2019527215 A JP2019527215 A JP 2019527215A JP 2019527215 A JP2019527215 A JP 2019527215A JP 2020504438 A5 JP2020504438 A5 JP 2020504438A5
- Authority
- JP
- Japan
- Prior art keywords
- channels
- circuit die
- solid circuit
- article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 5
- 239000007788 liquid Substances 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662424686P | 2016-11-21 | 2016-11-21 | |
| US62/424,686 | 2016-11-21 | ||
| US201762584223P | 2017-11-10 | 2017-11-10 | |
| US62/584,223 | 2017-11-10 | ||
| PCT/US2017/062030 WO2018094057A1 (en) | 2016-11-21 | 2017-11-16 | Automatic registration between circuit dies and interconnects |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020504438A JP2020504438A (ja) | 2020-02-06 |
| JP2020504438A5 true JP2020504438A5 (enExample) | 2020-12-24 |
| JP7190430B2 JP7190430B2 (ja) | 2022-12-15 |
Family
ID=62146802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019527215A Active JP7190430B2 (ja) | 2016-11-21 | 2017-11-16 | 回路ダイと相互接続部との間の自動位置合せ |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10971468B2 (enExample) |
| EP (1) | EP3542398A4 (enExample) |
| JP (1) | JP7190430B2 (enExample) |
| CN (1) | CN110024120A (enExample) |
| WO (1) | WO2018094057A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7402824B2 (ja) * | 2018-05-22 | 2023-12-21 | スリーエム イノベイティブ プロパティズ カンパニー | 光制御端部を有する光学フィルム |
| US11503720B2 (en) | 2018-09-17 | 2022-11-15 | 3M Innovative Properties Company | Flexible device including conductive traces with enhanced stretchability |
| WO2020141407A1 (en) | 2018-12-31 | 2020-07-09 | 3M Innovative Properties Company | Flexible circuits on soft substrates |
| CN113273319B (zh) * | 2018-12-31 | 2024-12-27 | 3M创新有限公司 | 使用毛细管微流控形成电互连 |
| CN113748506A (zh) | 2019-04-29 | 2021-12-03 | 3M创新有限公司 | 用于使电路管芯与电互连件配准的方法 |
| CN114746988A (zh) | 2019-12-04 | 2022-07-12 | 3M创新有限公司 | 包括微图案并使用部分固化以粘附管芯的电路 |
| US12156343B2 (en) | 2020-01-24 | 2024-11-26 | 3M Innovative Properties Company | Electrical connections to embedded electronic components |
| EP3905861A1 (de) * | 2020-04-30 | 2021-11-03 | ZKW Group GmbH | Barriere gegen verschwimmen von smt-bauteilen |
| US11911814B2 (en) * | 2020-08-04 | 2024-02-27 | Xtpl S.A. | Method of forming an elongate electrical connection feature traversing a microscopic step |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52149066A (en) * | 1976-06-04 | 1977-12-10 | Hitachi Ltd | Connecting method of silicon semiconductor chip to ceramic substrate |
| JPH0438522Y2 (enExample) * | 1986-08-01 | 1992-09-09 | ||
| JPH06350233A (ja) * | 1993-06-10 | 1994-12-22 | Sankyo Seiki Mfg Co Ltd | 回路基板 |
| US5842275A (en) * | 1995-09-05 | 1998-12-01 | Ford Motor Company | Reflow soldering to mounting pads with vent channels to avoid skewing |
| JP4117807B2 (ja) * | 1997-06-24 | 2008-07-16 | 松下電工株式会社 | 電子部品のハンダ付け方法 |
| JP2002198638A (ja) * | 2000-12-27 | 2002-07-12 | Shinko Electric Ind Co Ltd | チップ部品の実装用基板及びその製造方法並びに実装構造及び実装方法 |
| GR1004106B (el) | 2002-01-24 | 2003-01-13 | Εκεφε "Δημοκριτος" Ινστιτουτο Μικροηλεκτρονικης | Ολοκληρωμενοι θερμικοι αισθητηρες πυριτιου χαμηλης ισχυος και διαταξεις μικρο-ροης βασισμενοι στην χρηση τεχνολογιας κοιλοτητας αερα σφραγισμενης με μεμβρανη πορωδους πυριτιου ή τεχνολογιας μικρο-καναλιων |
| US7276802B2 (en) * | 2002-04-15 | 2007-10-02 | Micron Technology, Inc. | Semiconductor integrated circuit package having electrically disconnected solder balls for mounting |
| US6902260B2 (en) * | 2003-07-24 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Fluid ejection device adherence |
| JP2006332615A (ja) | 2005-04-25 | 2006-12-07 | Brother Ind Ltd | パターン形成方法 |
| EP1720389B1 (en) | 2005-04-25 | 2019-07-03 | Brother Kogyo Kabushiki Kaisha | Method for forming pattern and a wired board |
| JP4611800B2 (ja) | 2005-05-17 | 2011-01-12 | 信越ポリマー株式会社 | 導電性回路及びその形成方法 |
| CN101238060A (zh) * | 2005-08-11 | 2008-08-06 | 皇家飞利浦电子股份有限公司 | 制造包括硅mems传声器的微电子封装的方法 |
| JP2008211150A (ja) | 2007-02-28 | 2008-09-11 | Seiko Instruments Inc | ３次元構造体部品、及びその製造方法 |
| US7696013B2 (en) * | 2007-04-19 | 2010-04-13 | Eastman Kodak Company | Connecting microsized devices using ablative films |
| JP5282423B2 (ja) | 2008-03-14 | 2013-09-04 | コニカミノルタ株式会社 | 金属パターン形成用インクジェットインクおよび金属パターン形成方法 |
| US9113547B2 (en) * | 2008-10-24 | 2015-08-18 | Intel Corporation | Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP) |
| KR20130091794A (ko) * | 2009-01-27 | 2013-08-19 | 파나소닉 주식회사 | 반도체 칩의 실장 방법, 그 방법을 이용하여 얻어진 반도체 장치 및 반도체 칩의 접속 방법, 및, 표면에 배선이 설치된 입체 구조물 및 그 제법 |
| JP2011249357A (ja) | 2010-05-21 | 2011-12-08 | Panasonic Electric Works Co Ltd | 回路基板および回路基板の製造方法 |
| TW201342538A (zh) * | 2012-04-13 | 2013-10-16 | 日月光半導體製造股份有限公司 | 半導體封裝結構及其製造方法 |
| US9754869B2 (en) * | 2013-01-16 | 2017-09-05 | 3M Innovative Properties Company | Light emitting semiconductor device and substrate therefore |
| KR20140115021A (ko) * | 2013-03-20 | 2014-09-30 | 에스케이하이닉스 주식회사 | 반도체 패키지 및 그 제조방법 |
| FR3003689B1 (fr) * | 2013-03-25 | 2016-11-25 | Commissariat Energie Atomique | Support pour auto-assemblage capillaire avec stabilisation horizontale, procede de fabrication et utilisation |
| US9401306B2 (en) | 2013-11-11 | 2016-07-26 | Regents Of The University Of Minnesota | Self-aligned capillarity-assisted microfabrication |
| AT517203B1 (de) * | 2015-07-06 | 2016-12-15 | Zkw Group Gmbh | Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte |
| US20180190614A1 (en) * | 2016-12-05 | 2018-07-05 | Ananda H. Kumar | Massively parallel transfer of microLED devices |
-
2017
- 2017-11-16 EP EP17872717.8A patent/EP3542398A4/en not_active Withdrawn
- 2017-11-16 CN CN201780072072.9A patent/CN110024120A/zh not_active Withdrawn
- 2017-11-16 WO PCT/US2017/062030 patent/WO2018094057A1/en not_active Ceased
- 2017-11-16 US US16/461,015 patent/US10971468B2/en active Active
- 2017-11-16 JP JP2019527215A patent/JP7190430B2/ja active Active