JP2020504438A5 - - Google Patents

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Publication number
JP2020504438A5
JP2020504438A5 JP2019527215A JP2019527215A JP2020504438A5 JP 2020504438 A5 JP2020504438 A5 JP 2020504438A5 JP 2019527215 A JP2019527215 A JP 2019527215A JP 2019527215 A JP2019527215 A JP 2019527215A JP 2020504438 A5 JP2020504438 A5 JP 2020504438A5
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JP
Japan
Prior art keywords
channels
circuit die
pocket
solid circuit
article
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Application number
JP2019527215A
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English (en)
Japanese (ja)
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JP2020504438A (ja
JP7190430B2 (ja
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Priority claimed from PCT/US2017/062030 external-priority patent/WO2018094057A1/en
Publication of JP2020504438A publication Critical patent/JP2020504438A/ja
Publication of JP2020504438A5 publication Critical patent/JP2020504438A5/ja
Application granted granted Critical
Publication of JP7190430B2 publication Critical patent/JP7190430B2/ja
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JP2019527215A 2016-11-21 2017-11-16 回路ダイと相互接続部との間の自動位置合せ Active JP7190430B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662424686P 2016-11-21 2016-11-21
US62/424,686 2016-11-21
US201762584223P 2017-11-10 2017-11-10
US62/584,223 2017-11-10
PCT/US2017/062030 WO2018094057A1 (en) 2016-11-21 2017-11-16 Automatic registration between circuit dies and interconnects

Publications (3)

Publication Number Publication Date
JP2020504438A JP2020504438A (ja) 2020-02-06
JP2020504438A5 true JP2020504438A5 (enExample) 2020-12-24
JP7190430B2 JP7190430B2 (ja) 2022-12-15

Family

ID=62146802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019527215A Active JP7190430B2 (ja) 2016-11-21 2017-11-16 回路ダイと相互接続部との間の自動位置合せ

Country Status (5)

Country Link
US (1) US10971468B2 (enExample)
EP (1) EP3542398A4 (enExample)
JP (1) JP7190430B2 (enExample)
CN (1) CN110024120A (enExample)
WO (1) WO2018094057A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11906759B2 (en) * 2018-05-22 2024-02-20 3M Innovative Properties Company Optical film with light control edge
EP3853894A4 (en) * 2018-09-17 2023-03-08 3M Innovative Properties Company FLEXIBLE DEVICE WITH CONDUCTOR TRACKS WITH IMPROVED EXTENSIBILITY
EP3906759A4 (en) 2018-12-31 2022-10-12 3M Innovative Properties Company Flexible circuits on soft substrates
WO2020141445A1 (en) * 2018-12-31 2020-07-09 3M Innovative Properties Company Forming electrical interconnections using capillary microfluidics
EP3963627A1 (en) 2019-04-29 2022-03-09 3M Innovative Properties Company Methods for registration of circuit dies and electrical interconnects
CN114746988A (zh) 2019-12-04 2022-07-12 3M创新有限公司 包括微图案并使用部分固化以粘附管芯的电路
WO2021149009A1 (en) 2020-01-24 2021-07-29 3M Innovative Properties Company Electrical connections to embedded electronic components
EP3905861A1 (de) * 2020-04-30 2021-11-03 ZKW Group GmbH Barriere gegen verschwimmen von smt-bauteilen
US11911814B2 (en) * 2020-08-04 2024-02-27 Xtpl S.A. Method of forming an elongate electrical connection feature traversing a microscopic step

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JPH0438522Y2 (enExample) 1986-08-01 1992-09-09
JPH06350233A (ja) * 1993-06-10 1994-12-22 Sankyo Seiki Mfg Co Ltd 回路基板
US5842275A (en) * 1995-09-05 1998-12-01 Ford Motor Company Reflow soldering to mounting pads with vent channels to avoid skewing
JP4117807B2 (ja) 1997-06-24 2008-07-16 松下電工株式会社 電子部品のハンダ付け方法
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GR1004106B (el) 2002-01-24 2003-01-13 Εκεφε "Δημοκριτος" Ινστιτουτο Μικροηλεκτρονικης Ολοκληρωμενοι θερμικοι αισθητηρες πυριτιου χαμηλης ισχυος και διαταξεις μικρο-ροης βασισμενοι στην χρηση τεχνολογιας κοιλοτητας αερα σφραγισμενης με μεμβρανη πορωδους πυριτιου ή τεχνολογιας μικρο-καναλιων
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US20180190614A1 (en) * 2016-12-05 2018-07-05 Ananda H. Kumar Massively parallel transfer of microLED devices

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