CN114746988A - 包括微图案并使用部分固化以粘附管芯的电路 - Google Patents

包括微图案并使用部分固化以粘附管芯的电路 Download PDF

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Publication number
CN114746988A
CN114746988A CN202080082293.6A CN202080082293A CN114746988A CN 114746988 A CN114746988 A CN 114746988A CN 202080082293 A CN202080082293 A CN 202080082293A CN 114746988 A CN114746988 A CN 114746988A
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region
layer
adhesive material
curable adhesive
curing
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CN202080082293.6A
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Inventor
特雷莎·M·格代尔
安基特·马哈詹
米哈伊尔·L·佩库罗夫斯基
撒格尔·A·沙
卡拉·A·迈耶斯
克里斯托弗·G·瓦尔克
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN114746988A publication Critical patent/CN114746988A/zh
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Abstract

本发明提供了一种方法，该方法包括：在基底(2)上提供可固化粘合剂材料层(4)；在该可固化粘合剂材料层(4)上形成微结构(321)的图案；以第一水平固化该可固化粘合剂材料层(4)的第一区域(42)，以大于该第一水平的第二水平固化该可固化粘合剂材料层(4)的第二区域(44)；提供固体电路管芯(6)以直接附接到该可固化粘合剂材料层(4)的该第一区域(42)的主表面；以及进一步固化该可固化粘合剂材料层(4)的该第一区域(42)，以通过在两者间形成粘合剂结合来将该固体电路管芯(6)锚固在该第一区域(42)上。该微结构(321)的图案可包括一个或多个微通道(321)，该方法还包括在该微通道(321)中形成一个或多个导电迹线，特别是通过毛细力和任选地在压力下使含有传导性颗粒的液体(8)流动。该至少一个微通道(321)可从该第二区域(44)延伸到该第一区域(42)，并且具有位于该固体电路管芯(6)下方的部分。该固体电路管芯(6)可具有设置在该第一区域(42)的周边内的至少一个边缘，在其之间具有间隙。固体电路管芯(6)可在其底表面上具有至少一个接触垫(72)，其中该至少一个接触垫(72)可与该微通道(321)中的导电迹线中的至少一个导电迹线直接接触。形成该微结构(321)的图案可包括使印模(3)的主表面与该可固化粘合剂材料层(4)接触，该主表面在其上具有凸起特征(32)的图案。该可固化粘合剂材料(4)可通过诸如紫外(UV)光源(7,7’)等ac光化光源固化，其中可提供掩模，以至少部分地阻挡该可固化粘合剂材料层(4)的该第一区域(42)固化。该印模(3)可定位成与该可固化粘合剂材料(4)接触，以复制该凸起特征(32)的图案，从而形成该微结构(321)，同时该可固化粘合剂材料(4)被诸如该紫外(UV)光源(7)等该光化光源选择性地固化。该可固化粘合剂材料层(4)的该第一区域(42)可以该第一水平固化，以允许该固体电路管芯(6)的底表面被该第一区域(42)的该主表面流体密封。该可固化粘合剂材料层(4)的该第二区域可以该第二水平固化，使得该第二区域(44)完全固化。该进一步固化可为任何合适的固化，诸如热固化、辐射固化(例如，通过光化辐射，诸如紫外(UV)辐射)或在室温下不使用热固化源或辐射固化源的自固化。

Description

包括微图案并使用部分固化以粘附管芯的电路
背景技术
固体半导体管芯与印刷技术的集成将半导体技术的计算技能与基于幅材的方法的高吞吐量和形状因数柔性结合起来。柔性混合电子器件制造要求半导体管芯可靠且准确地与移动的幅材上的印刷迹线配准。适合于基于晶片的半导体器件的对准机构可能无法容易转用于基于幅材的方法。
发明内容
简而言之，一方面，本公开描述了一种方法，该方法包括在基底上提供可固化粘合剂材料层，在该可固化粘合剂材料层上形成微结构的图案，以第一水平固化该层的第一区域，以大于该第一水平的第二水平固化该层的第二区域，提供固体电路管芯，以直接附接到该第一区域的主表面，以及进一步固化该层的该第一区域，以通过在两者间形成粘合剂结合来将该固体电路管芯锚固在该第一区域上。
另一方面，本公开描述了一种包括紫外(UV)固化粘合剂材料层的制品。该层包括第一区域和至少部分地围绕该第一区域的第二区域，该层从该第一区域连续地延伸到该第二区域。固体电路管芯，该固体电路管芯经由粘合剂结合直接粘附到该第一区域的主表面。微通道的图案，该微通道的图案形成在该紫外(UV)固化粘合剂材料层上。一个或多个导电迹线形成在该微通道中。
在本公开的示例性实施方案中获取各种意料不到的结果和优点。本公开的示例性实施方案的一个此类优点是，固体电路管芯可直接附接到微通道层的部分固化或未固化区域，该微通道层包括被选择性地阻挡固化并且具有湿表面的可固化粘合剂材料。此湿表面可流体密封固体电路管芯的底表面和边缘，并防止流体从微通道泄漏。通过避免使用附加的粘合剂将固体电路管芯附接到微通道层，这还减少了制造此类装置所需的工艺步骤的数量，该附加的粘合剂可能回流到微通道中并阻挡微通道。
已总结本公开的示例性实施方案的各种方面和优点。上面的发明内容并非旨在描述本公开的当前某些示例性实施方案的每个例示的实施方案或每种实施方式。下面的附图和具体实施方式更具体地举例说明了使用本文所公开的原理的某些优选实施方案。
附图说明
结合附图考虑到以下对本公开的各种实施方案的详细说明可以更全面地理解本公开，其中：
图1是根据一个实施方案的设置在基底上的可固化粘合剂材料层的剖视图。
图2是根据一个实施方案，通过将印模放置在图1的可固化粘合剂材料的顶部的制品的剖视图。
图3是根据一个实施方案，通过部分地固化图1的可固化粘合剂材料层的制品的平面图。
图4是根据一个实施方案，从图3的可固化粘合剂材料移除印模之后的制品的剖视图。
图5A是根据一个实施方案，通过将固体电路管芯放置在粘合剂材料上的制品的剖视图。
图5B是图5A的制品的一部分的顶视图。
图6是根据一个实施方案，通过进一步固化可固化粘合剂材料层的制品的剖视图。
图7是根据一个实施方案的图6的制品的剖视图，其中施加了传导性油墨。
图8是图7的制品的剖视图，其中传导性油墨被凝固以形成导电迹线。
在附图中，相似的附图标号指示相似的元件。虽然可不按比例绘制的上文标识的附图阐述了本公开的各种实施方案，但还可设想如在具体实施方式中所提到的其他实施方案。在所有情况下，本公开以示例性实施方案的表示的方式而非通过表述限制来描述当前所公开的公开内容。应当理解，本领域的技术人员可想出许多其他修改和实施方案，这些修改和实施方案落在本公开的范围和实质内。
具体实施方式
对于以下定义术语的术语表，除非在权利要求书或说明书中的别处提供不同的定义，否则整个申请应以这些定义为准。
术语表
在整个说明书和权利要求书中使用某些术语，虽然大部分为人们所熟知，但仍可需要作出一些解释。应当理解：
如本文所用，术语“固化(cure)”、“固化(curing)”或“固化(cured)”是指诸如通过暴露于呈任何形式的辐射、加热、或使其经历导致材料硬化或粘度增加的化学反应(例如，在环境温度或加热条件下)而进行的化学交联。
通过所公开的涂覆制品中的各种元件的位置使用取向术语诸如“在...顶上”、“在...上”、“在...之上”“覆盖”、“最上方”、“在...下面”等，我们指元件相对于水平设置的、面向上方的基底的相对位置。然而，除非另外指明，否则本发明并非旨在基底或制品在制造期间或在制造后应具有任何特定的空间取向。
关于数值或形状的术语“约”或“大约”意指该数值或特性或特征的+/-5％，但明确地包括确切的数值。例如，“约”1Pa-sec的粘度是指从0.95Pa-sec至1.05Pa-sec的粘度，但也明确地包括恰好1Pa-sec的粘度。类似地，“基本上正方形”的周边旨在描述具有四条侧棱的几何形状，其中每条侧棱的长度为任何其他侧棱的长度的95％至105％，但也包括其中每条侧棱恰好具有相同长度的几何形状。
关于特性或特征的术语“基本上”是指该特性或特征表现出的程度大于该特性或特征的相对面表现出的程度。例如，“基本上”透明的基底是指与不透射(例如，吸收和反射)相比透射更多辐射(例如，可见光)的基底。因此，透射多于50％的入射在其表面上的可见光的基底是基本上透明的，但透射50％或更少的入射在其表面上的可见光的基底不是基本上透明的。
如本说明书和所附实施方案中所用，除非内容清楚指示其他含义，否则单数形式“一个”、“一种”和“该/所述”包括多个指代物。因此，例如，提及包含“一种化合物”的细纤维包括两种或更多种化合物的混合物。如本说明书和所附实施方案中所用的，除非所述内容明确地另有规定，否则术语“或”通常以其包括“和/或”的含义使用。
如本说明书中所用的，通过端点表述的数值范围包括该范围内所包括的所有数值(例如，1至5包括1、1.5、2、2.75、3、3.8、4和5)。
除非另外指明，否则本说明书和实施方案中所使用的表达量或成分、特性测量等的所有数字在所有情况下均应理解成由术语“约”来修饰。因此，除非有相反的说明，否则在上述说明书和所附实施方案列表中示出的数值参数可根据本领域的技术人员利用本公开的教导内容寻求获得的期望特性而变化。最低程度上说，并且在不试图将等同原则的应用限制到受权利要求书保护的实施方案的范围内的情况下，每个数值参数应至少根据所报告的有效位数并通过应用惯常的四舍五入法来解释。
在不脱离本公开实质和范围的情况下，可对本公开的示例性实施方案进行各种修改和更改。因此，应当理解，本公开的实施方案并不限于以下所述的示例性实施方案，而应受权利要求书及其任何等同物中示出的限制因素的控制。现在将具体参考附图对本公开的各种示例性实施方案进行描述。
图1是根据一个实施方案的设置在基底2上的可固化粘合剂材料层4的剖视图。该可固化粘合剂材料可包括任何合适的可固化粘合剂材料，从而在固化之后，将固体电路管芯黏附地结合到其主粘合剂表面41上。通常，在完全固化之前，本文所使用的粘合剂材料可提供湿表面，以浸湿设置在其上的固体电路管芯的底表面和边缘。在进一步固化时，可形成足够强的粘附来锚固固体电路管芯，使得该管芯在随后的处理期间无法容易地从其原始位置中移位。可固化粘合剂材料还能够维持其结构，例如，在其被设置在基底2上之后不会在基底2上回流。示例性粘合剂可包括结构粘合剂、丙烯酸粘合剂、环氧树脂粘合剂、聚氨酯粘合剂、光学粘合剂、硅酮基粘合剂等。
在一些实施方案中，可施加两级可固化结构粘合剂。合适的两级结构粘合剂可经历第一固化步骤，该第一固化步骤引发或催化反应，并实现一些可重新定位性，之后进行第二固化步骤，该第二固化步骤完成反应。
在本公开中，许多实施方案利用诸如紫外或UV光等光化辐射来固化粘合剂材料。一类可用的光化光源使用发光二极管(“LED”)。基于LED的UV源可为有利的，因为与诸如黑光和汞灯等其他UV光源相比，其可在更窄的波长范围内生成UV光。此类LED源是可商购获得的，例如，购自马萨诸塞州沃尔瑟姆(Waltham,Mass.)的埃赛力达科技公司(ExcelitasTechnologies)的AC系列365nm或395nm LED固化系统。
本文所描述的合适的UV可固化粘合剂材料可包含粘合剂组合物，该粘合剂组合物在暴露于UV光时可开始固化，这可能需要或可能不需要加热来固化。加热可用于加速UV可固化粘合剂材料的固化速率。例如，UV可固化粘合剂材料可包括单体组分和光引发剂，其可用活化UV辐射照射以使单体组分聚合。
当粘合剂材料例如经由UV光完全固化时，该粘合剂材料可形成非粘性的、尺寸稳定的固体块。当粘合剂材料未固化或仅部分固化时，粘合剂材料可具有湿表面。当固体电路管芯附接到未完全固化粘合剂材料的湿表面时，该湿表面可浸湿固体电路管芯的底表面和边缘。
示例性的UV活化的粘合剂可使用已知方法中的任何方法由多种树脂组分和添加剂的混合物制成。在一些实施方案中，可使用热熔法来制备粘合剂，这避免了使用挥发性溶剂。由于与这些组分的采购、处理和处置相关的成本，挥发性溶剂通常是不期望的。热熔法可使用分批或连续工艺进行，以使粘合剂组分充分混合。
UV可固化粘合剂可包括各种组分，包括例如可自由基聚合的树脂、烯键式不饱和单体、环氧树脂、乙烯基醚、多元醇、聚合物树脂(诸如聚酯)等。美国专利申请公开号2018/0371298(Schmid等人)、2018/0155575(Anderson等人)和2018/0127625(Shafer等人)中描述了UV可固化粘合剂的各种组分及其制备方法，这些美国专利申请以引用方式并入本文。
另一示例性的UV可固化粘合剂可以商品名NOA73从新泽西州克兰伯里的诺兰产品公司(Norland Products Inc.,Cranbury,NJ)商购获得。NOA73是一种光学透明的液体粘合剂，其在暴露在长波长紫外光下时会快速固化。NOA73可通过紫外光固化，最大吸收介于350纳米与380纳米之间。完全固化所需的典型能量约为4焦耳/平方厘米的长波长UV光。氧气不会抑制固化，并且因此任何与空气接触的区域都可完全固化到非粘性状态。
对于本文所描述的一些UV可固化粘合剂材料，固化可分两步完成。首先，使用短暴露或预固化。预固化可充分固化粘合剂材料以允许其被处理。在一些实施方案中，UV可固化粘合剂材料可被预固化，并且然后被施加到基底上。在一些实施方案中，UV可固化粘合剂材料可设置在基底上，之后进行预固化。完全固化可通过在固化时间的剩余部分内进行暴露来完成。使用相同强度的光源，完全固化可花费例如10倍至30倍的预固化时间。
基底2可包括任何柔性材料，诸如例如聚氨酯、橡胶、环氧树脂、聚对苯二甲酸乙二醇酯(PET)、聚乙烯、聚苯乙烯、硅酮弹性体(例如，PDMS)等。在本公开中制备的一个示例中，聚氨酯膜用作柔性基底，其可以商品名COTRAN 9701从明尼苏达州圣保罗的3M公司(3MCompany St.Paul,MN)商购获得。应当理解，在一些实施方案中，基底2的一部分可以是刚性的，而基底2整体可以是柔性的。
在许多实施方案中，基底2可为连续幅材的一部分。可在高速辊到辊制造工艺中，使用幅材来电连接电路部件，以快速产生用于电子装置的低成本电路，包括例如射频识别(RFID)标签、近场通信(NFC)电路、蓝牙电路、Wi-Fi电路、微处理器芯片、裸管芯、电容器、加速度计等。
可固化粘合剂材料层4可通过任何合适的方法施加在基底2上，包括例如刷涂、丝网印刷、辊涂、转印、熔融加工、分配或通过物理施加。层4可具有湿厚度，例如在10微米至10mm的范围内。应当理解，层4可根据期望的应用具有任何期望的厚度。
图2是图1的可固化粘合剂材料层4的剖视图，其中印模3放置在顶部上。印模3包括在其主表面上以图案布置的凸起特征32。当印模3接触可固化粘合剂材料层4时，凸起特征32可压入粘合剂表面41，以将特征图案复制到粘合剂表面41上。
聚二甲基硅氧烷(PDMS)特别可用作印模材料，因为其为弹性体的，并且具有低表面能(这使得易于从大多数基底除去印模)。可用的可商购获得的制剂可以商品名Sylgard184PDMS从密歇根州米德兰的道康宁公司(Dow Corning,Midland,MI)获得。通过例如把未交联的PDMS聚合物分配到图案化模具里或者对照图案化模具进行分配，然后固化，由此可以形成PDMS印模。模制弹性体压模的母模可使用本领域已知的照相平版印刷技术形成。弹性体印模可通过将未固化PDMS施加至母模然后固化来对着母模进行模铸。
在图2所描绘的实施方案中，在印模3上的与凸起特征32相对的一侧上提供掩模5。当提供光化光源7来固化可固化粘合剂材料4时，如图3所示，掩模5可至少部分地阻挡来自光化光源7的光化辐射暴露至可固化粘合剂材料4的第一区域42。第一区域42由掩模5的占用空间限定，如虚线51所指示的。掩模5可由任何合适的材料制成，以至少部分阻挡光化辐射。一个示例性的掩模可由黑色不透明材料制成，该黑色不透明材料可以商品名ScotchPhotographic Tape 235从明尼苏达州圣保罗的3M公司商购获得。
如图3所示，第二区域44中的粘合剂组合物接收待固化的足够量的光化辐射以形成非粘性的、尺寸稳定的固体块。由掩模5阻挡光化辐射的第一区域42比第二区域44固化得更少。第一区域42中较少固化的粘合剂组合物的表面可保持潮湿和/或发粘。在一些实施方案中，由第一区域42接收的光化辐射量可小于第二区域44接收的光化辐射量的50％、小于40％、小于30％、小于20％或小于10％。
在图3所描绘的实施方案中，掩模5设置在印模3的与凸起特征32相对的一侧上。应当理解，掩模5可设置在任何合适的位置，以阻挡来自光化光源7的光化辐射。在一些实施方案中，掩模5可设置在印模3的与凸起特征32相同的一侧上。
在图3所描绘的实施方案中，光化光源7和掩模5设置在可固化粘合剂材料层4的与印模3相同的一侧上。应当理解，光化光源7和掩模5可设置在基底2的与印模3相对的一侧上。掩模5可附接到光化光源7的头灯，以至少部分地阻挡光化光接近第一区域42，同时光化光可透射基底2以完全固化第二区域44。
如图4所示，微结构32’的图案形成在可固化粘合剂材料4的主表面41上。通过使印模3与可固化粘合剂材料4的主表面41接触，从印模3的凸起特征32复制微结构32’的图案。微结构32’可包括例如通道、局部孔、通孔、空腔、凹坑等。微结构32’基本上形成在可固化粘合剂材料的第二区域44上。
在各种实施方案中，微结构32’可具有例如500微米或更小、300微米或更小、100微米或更小、50微米或更小、或者10微米或更小的最小尺寸(例如，长度或宽度/厚度中的任一者)。一个示例性微通道可具有约50微米至约500微米的宽度和约10微米至100微米的深度。
在图3所描绘的实施方案中，印模3定位成与可固化粘合剂材料4接触，以复制微结构32的图案，同时可固化粘合剂材料4被光化光源7选择性地固化。然后将印模3从可固化粘合剂材料4上移除，以显示其上的微结构32’的图案。应当理解，微结构32’的图案的形成和可固化粘合剂材料4的选择性固化可以各种顺序或次序进行。
在一些实施方案中，可固化粘合剂材料4可被光化光源7预固化至印模3的凸起特征32仍可压入主表面41以复制其上的图案的水平。然后将印模3定位成与可固化粘合剂材料4的主表面41接触，同时光化光源7继续完全固化第二区域44。然后将印模3从可固化粘合剂材料4上移除，以显示微结构32’的图案。
如图5A至图5B所示，在印模3从可固化粘合剂材料4上移除之后，固体电路管芯6被附接到第一区域42的表面421上。如上文所讨论的，第一区域42已经被掩模5至少部分地阻挡了光化辐射，并且比第二区域44固化得更少。换句话说，第一区域42未被固化或仅部分固化，其固化量使得其表面421可浸湿固体电路管芯6的底表面，使得(i)在固体电路管芯6与表面421之间没有大量的空气或连续的空气路径；(ii)固体电路管芯6的边缘可被表面421流体密封；(iii)固体电路管芯6下面的微结构的边缘(例如，图5B中的微通道321的边缘)可被流体密封；以及(iv)在第一区域42进一步固化时，与固体电路管芯6的底表面的良好粘附。
在图5B所描绘的实施方案中，微结构32’主要形成在围绕第一区域42的第二区域44上。第二区域44可以第二水平固化，使得微结构32’可在移除印模后机械地维持。主表面41上的微通道32’中的至少一个微通道延伸到第一区域42中，以接近设置在第一区域42上的固体电路管芯的底表面。固体电路管芯6在其底表面上具有一个或多个接触垫72。固体电路管芯6与可固化粘合剂材料的主表面41对准，使得接触垫72面向在接触垫72下方延伸的微通道32’的一部分321。应当理解，由可固化粘合剂材料形成的固体电路管芯6和微结构(例如，微通道32’、通孔31、空腔、凹坑等)可具有用于所期望的应用的各种配置和布置。
固体电路管芯6可设置在第一区域42的湿表面421的周边内，该第一区域的湿表面比第二区域44固化得少。湿表面421的尺寸或面积可通过以下一项或多项来控制：(i)改变图2和图3的掩模5的尺寸或面积，(ii)掩模5、光化光源7和湿表面421的相对位置，或(iii)固化时间。如图5B所示，第一区域42至少部分地被阻挡固化，使得在表面421的边缘与固体电路管芯7的相邻边缘之间出现间隙d。这是为了防止管芯的边缘接触完全固化的区域(例如，第二区域44的非粘性表面)并且因此不被锚固到主表面41，这可能在制造装置的以下步骤中引起流体泄漏。间隙d可在例如从约0.1mm至约10mm的范围内。
本文描述的固体电路管芯可包括一个或多个电路芯片，该一个或多个电路芯片具有某些电路功能。在一些实施方案中，固体电路管芯可包括电路芯片，该电路芯片具有沿其表面布置的一个或多个接触垫、刚性半导体管芯、印刷电路板(PCB)、柔性印刷电路(FPC)、超薄芯片、射频识别装置(RFID)、近场通信(NFC)模块、表面安装装置等。在一些实施方案中，固体电路管芯可以是厚度为约2微米至约200微米、约5微米至约100微米或约10微米至约100微米的超薄芯片。
在一些实施方案中，固体电路管芯可包括刚性半导体管芯或柔性半导体管芯。在一些实施方案中，固体电路管芯可包括印刷电路板(PCB)。在一些实施方案中，固体电路管芯可包括柔性印刷电路(FPC)。在一些实施方案中，固体电路管芯可包括导电板或导电迹线。应当理解，本文描述的固体电路管芯可包括待设置在基底上的任何合适的电路。在一些实施方案中，固体电路管芯的一个或多个接触垫或固体电路管芯本身可被配准并连接到基底上的导电迹线。
当固体电路管芯6附接到第一区域42的粘性表面时，提供光化光源7’以进一步固化第一区域42，如图6所示。光化光源7’可与图3的光化光源7相同或不同。当第一区域42被光化光源7’完全固化时，形成完全固化粘合剂材料层4’，其中固体电路管芯6经由在其间形成粘合剂结合而被锚固到第一区域42。
在一些实施方案中，当固体电路管芯6对来自光化光源7’的光是至少部分地透明的时，光化光源7’可相对于该可固化粘合剂材料层4定位在固体电路管芯6的同一侧上。否则，光化光源7’可定位在基底2的侧面上，以固化可固化粘合剂材料的第一区域42。应当理解，第一区域42处的可固化粘合剂材料可通过诸如例如热固化、辐射固化等任何合适的固化方法进一步固化。在一些实施方案中，第一区域42可在室温下在不使用热固化源或辐射固化源的情况下自固化。
参考图7所示的制品，含有传导性颗粒的液体8被放置在微通道32’中并且沿微通道32’流动，以与电路管芯7的接触垫72直接接触(同样参见图5B)。在各种实施方案中，微通道32’可具有例如500微米或更小、300微米或更小、100微米或更小、50微米或更小、或者10微米或更小的最小尺寸(例如，长度或宽度/厚度中的任一者)。一个示例性微通道可具有约50微米至约500微米的宽度和约10微米至100微米的深度。
含有传导性颗粒的液体8可以是含有传导性颗粒的任何导电液体组合物，其可在微通道32’中流动或可使其流动。在一些实施方案中，含有传导性颗粒的液体8可被配制成允许主要通过毛细力沿微通道32’流动。
在各种实施方案中，含有传导性颗粒的液体8可以是在液态下导电(例如，金属)或者在液态下不导电或导电弱并且在凝固时变得导电的任何液体组合物。在一些实施方案中，含有传导性颗粒的液体8包括足够量的液体载体，以使含有传导性颗粒的液体主要通过毛细力可在微通道32’中流动。在一些实施方案中，通过将压力下的含有传导性颗粒的液体施加在压力下的微通道32’中以增强毛细流动，可使含有传导性颗粒的液体8在微通道22中流动。
含有传导性颗粒的液体8包括导电材料或可转化成导电材料的非导电材料，该材料通过使用例如涂布机或喷涂器分散在液体中以有利于更均匀地沉积到微通道32’中。用于含有传导性颗粒的液体8的合适的导电材料包括但不限于金属颗粒、纳米线、在室温下导电或在加热或以其他方式还原成金属时变得导电的金属盐、导电聚合物以及它们的混合物和组合。在一些实施方案中，含有传导性颗粒的液体8包括传导性油墨，该传导性油墨包括传导性金属，诸如银油墨、银纳米颗粒油墨、反应性银油墨、铜油墨和导电聚合物油墨，以及液体金属或合金(例如，在相对较低的温度下熔融并且在室温下凝固的金属或合金)等。在一些实施方案中，含有传导性颗粒的液体8是用光化辐射活化或固化的传导性油墨，诸如例如UV固化或活化油墨。
在一些实施方案中，含有传导性颗粒的液体8中的导电材料可以是银薄片或球体、碳/石墨颗粒的共混物或者银薄片/碳颗粒的共混物。粒度通常在例如直径为约0.5微米至约10.0微米的范围内。当这些薄片或颗粒悬浮于聚合物粘结剂中时，它们通过液体无规地间隔开。一旦溶剂蒸发，它们就凝聚，从而形成导电路径或电路。在导电材料中，银是电阻最小的并且最贵的，而碳/石墨提供低电阻和低价格的最佳组合。合适的传导性油墨可从以下公司获得：例如，威斯康星州新柏林市的Tekra公司(Tekra,Inc.,New Berlin,WI)；马萨诸塞州艾尔市的创意材料公司(Creative Materials,Inc.,Ayer,MA)；或得克萨斯州奧斯汀市的NovaCentrix公司(NovaCentrix,Austin,TX)。
导电材料可在其中形成稳定分散的任何非腐蚀性液体，该非腐蚀性液体可用于含有传导性颗粒的液体8中，并且液体载体的合适示例包括但不限于水、醇、酮、醚、烃或芳族溶剂(苯、甲苯、二甲苯等)。在一些实施方案中，载液是挥发性的，具有不超过200摄氏度(℃)、不超过150℃或不超过100℃的沸点。
此外，含有传导性颗粒的液体8可包含添加剂或粘结剂以控制导电材料的粘度、腐蚀、粘附和分散。合适的添加剂或粘结剂的示例包括但不限于羧甲基纤维素(CMC)、2-羟乙基纤维素(HEC)、羟丙基甲基纤维素(HPMC)、甲基纤维素(MC)、聚乙烯醇(PVA)、三丙二醇(TPG)和黄原胶(XG)；以及表面活性剂，诸如乙氧基化物、烷氧基化物、环氧乙烷和环氧丙烷以及它们的共聚物、磺酸盐、硫酸盐、二磺酸盐、磺基琥珀酸酯、磷酸酯和含氟表面活性剂(例如，以商品名Zonyl购自陶氏杜邦公司(DowDuPont)的那些)。
在一个示例中，含有传导性颗粒的液体或“油墨”包括按重量计0.0025％至0.1％的表面活性剂(例如，对于Zonyl FSO-100优选范围是0.0025％至0.05％)、0.02％至4％的粘度调节剂(例如，对于HPMC优选范围是0.02％至0.5％)、94.5％至99.0％的溶剂和0.05％至1.4％的传导性材料。合适的表面活性剂的代表性示例包括以商品名Zonyl FSN、ZonylFSO和Zonyl FSH购自特拉华州威尔明顿的陶氏杜邦公司(DowDuPont,Wilmington,DE)的那些、以商品名Triton(x100,x114,x45)购自密苏里州圣路易斯的默克密理博公司(Millipore Sigma,St.Louis,MO)的那些、以商品名Dynol(604,607)、n-dodecyl b-D-maltoside和Novek购自新泽西州帕西帕尼的赢创工业公司(Evonik Industries,Parsippany,NJ)的那些。合适的粘度调节剂的示例包括羟丙基甲基纤维素(HPMC)、甲基纤维素、黄原胶、聚乙烯醇、羧甲基纤维素、羟乙基纤维素。可能存在的合适溶剂的示例包括前述粘结剂或添加剂，包括水和异丙醇。
在另一个实施方案中，含有传导性颗粒的液体8可包括粘合剂，诸如例如溶解于诸如水丙酮、甲苯、甲乙酮(MEK)等液体溶剂中的粘合剂。
含有传导性颗粒的液体8可沿微通道32’在任何位置处递送。含有传导性颗粒的液体8可通过各种方法沉积在微通道32’中，这些方法包括例如浇注、漏斗、喷墨印刷、压电分配、针分配、微注射、丝网印刷、柔性版印刷、溅射、气相沉积等。
含有传导性颗粒的液体8可通过移除液体载体的至少一部分来固化、硬化或凝固，以留下导电材料的连续层，该导电材料的连续层在微通道32’中形成导电迹线。含有传导性颗粒的液体8可被固化和/或硬化或烧结。“固化或凝固”是指其中从含有传导性颗粒的液体8移除溶剂或液体载体以形成互连电路图案的工艺。合适的固化条件在本领域中是熟知的，包括例如加热、使用可见光或紫外(UV)光、电子束照射等等。另选地，“硬化或硬化的”可通过在干燥期间移除溶剂而(例如)未聚合或交联所引起。
如图8所示，含有传导性颗粒的液体被固化以在微通道32’中形成一个或多个导电迹线8’。所形成的装置包括紫外(UV)固化粘合剂材料层4’。层4’包括第一区域42和至少部分围绕该第一区域42的第二区域44。层4’从第一区域42连续延伸到第二区域44。固体电路管芯6经由粘合剂结合直接粘附到该第一区域42’的主表面。固体电路管芯6的占用空间可略微小于管芯6所附接的第一区域42’的主表面。微通道32’的图案形成在紫外(UV)固化粘合剂材料层4’上。在微通道中提供导电迹线8’以提供电连接。
将参照以下实施方案进一步描述本公开的操作。提供这些实施方案以进一步说明各种具体的和优选的实施方案和技术。然而，应当理解，可做出许多变型和修改而仍落在本公开的范围内。
示例性实施方案列表
应当理解，实施方案1至实施方案10、实施方案11至实施方案15和实施方案16至实施方案20中任一项可组合。
实施方案1为一种方法，所述方法包括：
在基底上提供可固化粘合剂材料层；
在所述可固化粘合剂材料层上形成微结构的图案；
以第一水平固化所述层的第一区域，以大于所述第一水平的第二水平固化所述层的第二区域；
提供固体电路管芯，以直接附接到所述层的所述第一区域的主表面；以及
进一步固化所述层的所述第一区域，以通过在两者间形成粘合剂结合来将所述固体电路管芯锚固在所述第一区域上。
实施方案2为根据实施方案1所述的方法，其中所述微结构的图案包括一个或多个微通道，所述方法还包括在所述微通道中形成一个或多个导电迹线。
实施方案3为根据实施方案1或2所述的方法，其中形成所述微结构的图案包括使印模的主表面与所述可固化粘合剂材料层接触，所述主表面在其上具有凸起特征的图案。
实施方案4为根据实施方案3所述的方法，其中所述印模在其所述主表面上包括聚二甲基硅氧烷(PDMS)。
实施方案5为根据实施方案1至4中任一项所述的方法，其中所述可固化粘合剂材料通过紫外(UV)光源固化。
实施方案6为根据实施方案5所述的方法，还包括提供掩模，以至少部分地阻挡所述层的所述第一区域固化。
实施方案7为根据实施方案6所述的方法，其中所述第一区域接收的UV光的量小于所述第二区域接收的UV光的量的50％。
实施方案8为根据实施方案1至7中任一项所述的方法，其中所述层的所述第一区域以所述第一水平固化，以允许所述固体电路管芯的底表面被所述第一区域的所述主表面流体密封。
实施方案9为根据实施方案1至8中任一项所述的方法，其中所述层的所述第二区域以所述第二水平固化，使得所述第二区域完全固化。
实施方案10为根据实施方案1至9中任一项所述的方法，其中所述固体电路管芯具有设置在所述第一区域的周边内的至少一个边缘，在其之间具有间隙。
实施方案11为一种制品，所述制品包括：
紫外(UV)固化粘合剂材料层，所述层包括第一区域和至少部分地围绕所述第一区域的第二区域，所述层从所述第一区域连续地延伸到所述第二区域；
固体电路管芯，所述固体电路管芯经由粘合剂结合直接粘附到所述第一区域的主表面；
微结构的图案，所述微结构的图案形成在所述紫外(UV)固化粘合剂材料层上；以及
一个或多个导电迹线，所述一个或多个导电迹线位于微通道中。
实施方案12为根据实施方案11所述的制品，其中所述微结构的图案包括从所述第二区域延伸到所述第一区域的至少一个微通道，并且具有位于所述固体电路管芯下方的部分。
实施方案13为根据实施方案11或12所述的制品，其中所述固体电路管芯在其底表面上具有至少一个接触垫。
实施方案14为根据实施方案13所述的制品，其中所述至少一个接触垫与所述微通道中的所述导电迹线中的至少一个导电迹线直接接触。
实施方案15为根据实施方案11至14中任一项所述的制品，其中所述微结构的图案基本上形成在所述第二区域上。
实施方案16为一种制品，所述制品包括：
粘合剂材料层，所述层包括第一区域和至少部分地围绕所述第一区域的第二区域，所述第一区域比所述第二区域固化得更少，所述层从所述第一区域连续地延伸到所述第二区域；
固体电路管芯，所述固体电路管芯直接附接到所述第一区域的主表面；
微结构的图案，所述微结构的图案主要形成在所述粘合剂材料的所述第二区域上；以及
一个或多个导电迹线，所述一个或多个导电迹线位于微通道中。
实施方案17为根据实施方案16所述的制品，其中所述微结构的图案包括从所述第二区域延伸到所述第一区域的至少一个微通道，并且具有位于所述固体电路管芯下方的部分。
实施方案18为根据实施方案16或17所述的制品，其中所述固体电路管芯在其底表面上具有至少一个接触垫。
实施方案19为根据实施方案18所述的制品，其中所述至少一个接触垫与所述微通道中的所述导电迹线中的至少一个导电迹线直接接触。
实施方案20为根据实施方案16至19中任一项所述的制品，其中所述第一区域的所述主表面与所述固体电路管芯的所述底表面形成流体密封。
本公开的操作将参照以下详述的实施例另外描述。提供这些实施例以另外说明各种具体和优选的实施方案和技术。然而，应当理解，可做出许多变型和修改而仍落在本公开的范围内。
实施例
这些实施例仅是为了例示性目的，且并非意在过度地限制所附权利要求书的范围。尽管示出本公开的广义范围的数值范围和参数为近似值，但尽可能精确地记录具体示例中示出的数值。然而，任何数值都固有地包含某些误差，其各自的测试测量中所存在的标准偏差必然会引起这种误差。最低程度上说，并且在不试图将等同原则的应用限制到权利要求书的范围内的前提下，至少应当根据所报告的有效位数并通过应用惯常的四舍五入法来解释每个数值参数。
除非另有说明，否则实施例及本说明书其余部分中的所有份数、百分比、比等均以重量计。另外，表1提供了下面的实施例中使用的所有材料的缩写和来源：
表1
Figure BDA0003665740490000191
使用图1至图8所示的方法制备实施例。使用由PDMS制成的印模。该印模在其接触表面上具有凸起特征。使用可以商品名CF2000从明尼苏达州霍普金斯(Hopkins,MN)的晶实技术公司(Clearstone Technologies)商购获得的UV光源。印模对于来自UV光源的UV光是透明的。掩模设置在印模的中心的与凸起特征相对的一侧上。该掩模是正方形的黑色不透明材料，该黑色不透明材料可以商品名Scotch Photographic Tape 235从3M商购获得。UV可固化粘合剂材料可以商品名NOA73从新泽西州克兰伯里的诺兰产品公司商购获得。使用配备有30cc注射器筒和口径21的不锈钢针的诺信EFD最佳流体分配系统，将粘合剂沉积在铜基底上。每图案沉积约50微升的NOA73。没有使用预固化或预处理。使用来自奥地利普伦斯塔滕(Premstaetten,Austria)AMS公司的固体电路管芯AS39513NFC传感器标签IC。管芯的尺寸约为2.4mm×2.3mm。管芯的厚度为300微米。结合垫的尺寸为80um×80um。
微通道的尺寸约为0.12mm×0.12mm×10mm。不是通过使用另外的NOA73液滴将固体电路管芯锚固到下面的NOA73上，而是使用部分固化方法。将掩模施加到印模的背(非特征)面，以防止干扰特征复制到NOA73中。该印模被定位成在NOA73上复制微通道的图案。在存在掩模的情况下，NOA73首先用功率为15W的固化单元在约385nm波长的光下进行约45秒至60秒的UV固化。
然后移除印模，使粘合剂NOA73的选定区域保持未固化，而包括其上的微通道的其他区域完全固化以防止翘曲或变形。接下来，将管芯放置在未完全固化粘合剂上，并且未固化部分的厚度将芯片锚固到基底上。完成后固化步骤，以用功率为15W的固化单元在约385nm波长的光下固化NOA73的其余部分约45秒至60秒。然后银油墨流动并在220℉烧结5分钟至10分钟，以在微通道中形成导电迹线。
本说明书中通篇提及的“一个实施方案”、“某些实施方案”、“一个或多个实施方案”或“实施方案”，无论在术语“实施方案”前是否包括术语“示例性的”都意指结合该实施方案描述的特定特征、结构、材料或特性包括在本公开的某些示例性实施方案中的至少一个实施方案中。因此，在本说明书通篇各处出现的短语诸如“在一个或多个实施方案中”、“在某些实施方案中”、“在一个实施方案中”或“在实施方案中”不一定是指本公开的某些示例性实施方案中的同一实施方案。此外，具体特征、结构、材料或特性可在一个或多个实施方案中以任何合适的方式组合。
虽然本说明书已经详细地描述了某些示例性实施方案，但是应当理解，本领域的技术人员在理解上述内容后，可很容易地想到这些实施方案的更改、变型和等同物。因此，应当理解，本公开不应不当地受限于以上示出的例示性实施方案。特别地，如本文所用，用端值表述的数值范围旨在包括该范围内所包含的所有数值(例如，1至5包括1、1.5、2、2.75、3、3.80、4和5)。另外，本文所用的所有数字都被认为是被术语“约”修饰。此外，本文引用的所有出版物和专利均以引用的方式全文并入本文中，如同各个单独的出版物或专利都特别地和单独地指出以引用方式并入一般。已对各个示例性实施方案进行了描述。这些实施方案以及其他实施方案均在以下权利要求书的范围内。

Claims (15)

1.一种方法，所述方法包括：
在基底上提供可固化粘合剂材料层；
在所述可固化粘合剂材料层上形成微结构的图案；
以第一水平固化所述层的第一区域，以大于所述第一水平的第二水平固化所述层的第二区域；
提供固体电路管芯，以直接附接到所述层的所述第一区域的主表面；以及
进一步固化所述层的所述第一区域，以通过在两者间形成粘合剂结合来将所述固体电路管芯锚固在所述第一区域上。
2.根据权利要求1所述的方法，其中所述微结构的图案包括一个或多个微通道，所述方法还包括在所述微通道中形成一个或多个导电迹线。
3.根据权利要求1所述的方法，其中形成所述微结构的图案包括使印模的主表面与所述可固化粘合剂材料层接触，所述主表面在其上具有凸起特征的图案。
4.根据权利要求3所述的方法，其中所述印模在其所述主表面上包括聚二甲基硅氧烷(PDMS)。
5.根据权利要求1所述的方法，其中所述可固化粘合剂材料通过紫外(UV)光源固化。
6.根据权利要求5所述的方法，还包括提供掩模，以至少部分地阻挡所述层的所述第一区域固化。
7.根据权利要求6所述的方法，其中所述第一区域接收的UV光的量小于所述第二区域接收的UV光的量的50％。
8.根据权利要求1所述的方法，其中所述层的所述第一区域以所述第一水平固化，以允许所述固体电路管芯的底表面被所述第一区域的所述主表面流体密封。
9.根据权利要求1所述的方法，其中所述层的所述第二区域以所述第二水平固化，使得所述第二区域完全固化。
10.根据权利要求1所述的方法，其中所述固体电路管芯具有设置在所述第一区域的周边内的至少一个边缘，在其之间具有间隙。
11.一种制品，所述制品包括：
紫外(UV)固化粘合剂材料层，所述层包括第一区域和至少部分地围绕所述第一区域的第二区域，所述层从所述第一区域连续地延伸到所述第二区域；
固体电路管芯，所述固体电路管芯经由粘合剂结合直接粘附到所述第一区域的主表面；
微结构的图案，所述微结构的图案形成在所述紫外(UV)固化粘合剂材料层上；以及
一个或多个导电迹线，所述一个或多个导电迹线位于微通道中。
12.根据权利要求11所述的制品，其中所述微结构的图案包括从所述第二区域延伸到所述第一区域的至少一个微通道，并且具有位于所述固体电路管芯下方的部分。
13.根据权利要求11所述的制品，其中所述固体电路管芯在其底表面上具有至少一个接触垫。
14.根据权利要求13所述的制品，其中所述至少一个接触垫与所述微通道中的所述导电迹线中的至少一个导电迹线直接接触。
15.根据权利要求11所述的制品，其中所述微结构的图案基本上形成在所述第二区域上。
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