JP2021524671A - 回路ダイを含む極薄でフレキシブルなデバイス - Google Patents
回路ダイを含む極薄でフレキシブルなデバイス Download PDFInfo
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- JP2021524671A JP2021524671A JP2020565322A JP2020565322A JP2021524671A JP 2021524671 A JP2021524671 A JP 2021524671A JP 2020565322 A JP2020565322 A JP 2020565322A JP 2020565322 A JP2020565322 A JP 2020565322A JP 2021524671 A JP2021524671 A JP 2021524671A
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- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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Abstract
Description
ある特定の用語が、本明細書及び特許請求の範囲の全体を通して使用されており、これらの大部分については周知であるが、何らかの説明が必要とされる場合もある。以下を理解されたい:
用語「回路ダイ」は、その上に所与の機能回路が作製されている任意の好適な基板を指す。場合によっては、回路ダイは、ポリマー基板上に作製された薄いフレキシブルチップであり得る。フレキシブル回路ダイは、例えば、約5マイクロメートル〜約1mm、約10マイクロメートル〜約500マイクロメートル、又は約20マイクロメートル〜約200マイクロメートルの範囲内の厚さを有してもよい。
実施形態1〜10及び11〜21はいずれも組み合わせることができることを理解されたい。
主表面を有する基板と、
基板の主表面の位置合わせ領域上に配置された回路ダイと、
基板の主表面上に配置され、位置合わせ領域内に延び、回路ダイの底面の下側の部分を有する1つ以上のチャネルと、
1つ以上のチャネル内に形成され回路ダイの底面に直接接触している1つ以上の導電性トレースと、を備える電気デバイスである。
主表面を有する基板を供給することであって、基板は主表面上に1つ以上のチャネルを有する、供給することと、
基板の主表面の位置合わせ領域上に回路ダイを配置することであって、チャネルは、位置合わせ領域内に延びており回路ダイの底面の下側の部分を有する、配置することと、
導電性液体をチャネル内に配置することと、
導電性液体をチャネル内に流して、回路ダイの底面と直接接触させることと、
導電性液体を固化させて、回路ダイの底面に直接接触する1つ以上の導電性トレースを形成することと、を含む方法である。
Claims (17)
- 主表面を有する基板と、
前記基板の前記主表面の位置合わせ領域上に配置された回路ダイと、
前記基板の前記主表面上に配置され、前記位置合わせ領域内に延び、前記回路ダイの底面の下側の部分を有する1つ以上のチャネルと、
前記1つ以上のチャネル内に形成され、前記回路ダイの前記底面に直接接触している1つ以上の導電性トレースと、
を備える電気デバイス。 - 前記チャネルは、入口チャネルと出口チャネルとを備え、前記入口チャネルと前記出口チャネルは、流体的に接続されて内部チャネルを形成し、前記内部チャネルの少なくとも一部分は、前記回路ダイの前記底面の下側にある、請求項1に記載の物品。
- 前記回路ダイは、薄い誘電体層と、前記薄い誘電体層を挟む上部電極及び底部電極とを含む電気コンデンサチップである、請求項1に記載の物品。
- 前記回路ダイは、ポリマー基板と、前記ポリマー基板の底面上にコーティングされた抵抗層とを含む電気抵抗器である、請求項1に記載の物品。
- 前記回路ダイは、絶縁基板と、螺旋形状の電気トレースとを含むインダクタである、請求項1に記載の物品。
- 前記位置合わせ領域は、前記回路ダイを受け入れるためのポケットを備える、請求項1に記載の物品。
- 前記チャネルを埋め戻し、前記回路ダイと、前記回路ダイに直接接触する前記導電性トレースとを保護する封入材を更に含む、請求項1に記載の物品。
- 前記基板は、不定長ポリマー材料のウェブを含むフレキシブル基板である、請求項1に記載の物品。
- 前記回路ダイは、約10マイクロメートル〜約500マイクロメートルの範囲の厚さを有するフレキシブルダイである、請求項1に記載の物品。
- 電気デバイスを製造する方法であって、
主表面を有する基板を供給することであって、前記基板は前記主表面上に1つ以上のチャネルを有する、供給することと、
前記基板の前記主表面の位置合わせ領域上に回路ダイを配置することであって、前記チャネルは、前記位置合わせ領域内に延びており前記回路ダイの底面の下側の部分を有する、配置することと、
導電性液体を前記チャネル内に配置することと、
前記導電性液体を前記チャネル内に流して、前記回路ダイの前記底面と直接接触させることと、
前記導電性液体を固化させて、前記回路ダイの前記底面と直接接触する1つ以上の導電性トレースを形成することと、を含む方法。 - 前記チャネルは、流体的に接続された入口チャネルと出口チャネルとを備え、前記導電性液体は前記入口チャネルに流入する、請求項10に記載の方法。
- 前記回路ダイは、薄い誘電体層と、前記薄い誘電体層を挟む上部電極及び底部電極とを含むコンデンサチップである、請求項10に記載の方法。
- 前記導電性トレースは、前記コンデンサチップの前記上部電極及び前記底部電極に電気的に接続している、請求項12に記載の方法。
- 前記回路ダイは、ポリマー基板と、前記ポリマー基板の底面上にコーティングされた抵抗層とを含む電気抵抗器チップである、請求項10に記載の方法。
- 前記導電性トレースは、前記抵抗器の前記抵抗層に直接接触している、請求項14に記載の方法。
- 前記回路ダイは、絶縁基板と、螺旋形状の電気トレースとを含むインダクタチップである、請求項10に記載の方法。
- 前記導電性トレースのうちの少なくとも1つは、前記電気トレースに直接接触している、請求項16に記載の方法。
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PCT/IB2019/054083 WO2019224670A1 (en) | 2018-05-21 | 2019-05-16 | Ultrathin and flexible devices including circuit dies |
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