JP2020178140A - 半導体パッケージ用基板及び半導体パッケージ用基板の製造方法 - Google Patents
半導体パッケージ用基板及び半導体パッケージ用基板の製造方法 Download PDFInfo
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- JP2020178140A JP2020178140A JP2020124359A JP2020124359A JP2020178140A JP 2020178140 A JP2020178140 A JP 2020178140A JP 2020124359 A JP2020124359 A JP 2020124359A JP 2020124359 A JP2020124359 A JP 2020124359A JP 2020178140 A JP2020178140 A JP 2020178140A
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Abstract
Description
図11(a),(b)に示される測定評価用試料を以下のようにして作製した。まず、厚さ150mmのシリコンウェハ51に厚さ5μmの感光性絶縁樹脂フィルム52を貼り付けた。この感光性絶縁樹脂フィルム52は、以下のようにして形成した。まず、クレゾールノボラック樹脂(旭有機材工業株式会社製、商品名:TR−4020G、100質量部)と、1,3,4,6−テトラキス(メトキシメチル)グリコールウリル(30質量部)と、トリメチロールプロパントリグリシジルエーテル(40質量部)と、トリアリールスルホニウム塩(サンアプロ株式会社製、商品名:CPI−310B、8質量部)と、メチルエチルケトン(100質量部)とを配合し、感光性絶縁組成物を得た。次に、得られた感光性絶縁組成物をポリエチレンテレフタレートフィルム(帝人デュポンフィルム株式会社製、商品名:A−53)に塗布し、90℃のオーブンで10分間乾燥することによって、厚さ5μmの感光性絶縁樹脂フィルム52を得た。
ライン幅L及びスペース幅Sを5μmに設定したこと以外は実施例1と同様にして測定評価用試料50を形成し、上述した高加速度寿命試験を行った。実施例2の高加速度寿命試験の結果を、下記表1に示す。
ライン幅L及びスペース幅Sを2μmに設定したこと以外は実施例1と同様にして測定評価用試料50を形成し、上述した高加速度寿命試験を行った。実施例3の高加速度寿命試験の結果を、下記表1に示す。
感光性絶縁樹脂フィルム57として、ソルダーレジストフィルム(日立化成株式会社製、商品名:FZ−2700GA、厚さ30μm)としたこと以外は実施例2と同様にして測定評価用試料50を形成した。この測定評価用試料50に対して上述した高加速度寿命試験を行った。実施例4の高加速度寿命試験の結果を、下記表1に示す。
感光性絶縁樹脂フィルム57として、ソルダーレジストフィルム(日立化成株式会社製、商品名:FZ−2700GA、厚さ30μm)としたこと以外は実施例3と同様にして測定評価用試料50を形成した。この測定評価用試料50に対して上述した高加速度寿命試験を行った。実施例5の高加速度寿命試験の結果を、下記表1に示す。
図12(a),(b)に示されるように、バリア金属膜56を第1の配線55a上、第2の配線55b上、第1の接続配線55c上、及び第2の接続配線55d上に設けなかったこと以外は実施例1と同様にして測定評価用試料50Aを形成した。すなわち、第1の配線55a、第2の配線55b、第1の接続配線55c、及び第2の接続配線55dが感光性絶縁樹脂フィルム57に接するように測定評価用試料50Aを形成した。この測定評価用試料50Aに対して上述した高加速度寿命試験を行った。比較例1の高加速度寿命試験の結果を、下記表1に示す。
バリア金属膜56を第1の配線55a上、第2の配線55b上、第1の接続配線55c上、及び第2の接続配線55d上に設けなかったこと以外は実施例2と同様にして測定評価用試料50Aを形成した。この測定評価用試料50Aに対して上述した高加速度寿命試験を行った。比較例2の高加速度寿命試験の結果を、下記表1に示す。
バリア金属膜56を第1の配線55a上、第2の配線55b上、第1の接続配線55c上、及び第2の接続配線55d上に設けなかったこと以外は実施例3と同様にして測定評価用試料50Aを形成した。この測定評価用試料50Aに対して上述した高加速度寿命試験を行った。比較例3の高加速度寿命試験の結果を、下記表1に示す。
バリア金属膜56を第1の配線55a上、第2の配線55b上、第1の接続配線55c上、及び第2の接続配線55d上に設けなかったこと以外は実施例4と同様にして測定評価用試料50Aを形成した。この測定評価用試料50Aに対して上述した高加速度寿命試験を行った。比較例4の高加速度寿命試験の結果を、下記表1に示す。
バリア金属膜56を第1の配線55a上、第2の配線55b上、第1の接続配線55c上、及び第2の接続配線55d上に設けなかったこと以外は実施例5と同様にして測定評価用試料50Aを形成した。この測定評価用試料50Aに対して上述した高加速度寿命試験を行った。比較例5の高加速度寿命試験の結果を、下記表1に示す。
Claims (15)
- 複数の有機絶縁層を含んでなる有機絶縁積層体と、
前記有機絶縁積層体内に配列された複数の配線と、を備え、
前記配線と前記有機絶縁層とがバリア金属膜によって仕切られている、有機インターポーザ。 - 前記有機絶縁積層体は、
前記配線が配置された複数の溝部を有する第1の有機絶縁層と、
前記配線を埋め込むように前記第1の有機絶縁層に積層された第2の有機絶縁層と、を含む、請求項1記載の有機インターポーザ。 - 前記バリア金属膜は、
前記配線と前記溝部の内面との間に設けられた第1のバリア金属膜と、
前記配線と前記第2の有機絶縁層との間に設けられた第2のバリア金属膜と、を含む、請求項2記載の有機インターポーザ。 - 前記第1のバリア金属膜は、チタン、ニッケル、パラジウム、クロム、タンタル、タングステン、及び金の少なくとも一つを含む、請求項3記載の有機インターポーザ。
- 前記第2のバリア金属膜は、めっき膜である、請求項3又は4記載の有機インターポーザ。
- 前記第2のバリア金属膜は、ニッケルめっき膜である、請求項5記載の有機インターポーザ。
- 前記第2のバリア金属膜は、パラジウムめっき膜である、請求項5記載の有機インターポーザ。
- 前記第2のバリア金属膜の厚さは、0.001μm以上1μm以下である、請求項3〜7のいずれか一項記載の有機インターポーザ。
- 前記第2のバリア金属膜の表面粗さは、0.01μm以上1μm以下である、請求項3〜8のいずれか一項記載の有機インターポーザ。
- 前記第1の有機絶縁層の厚さは、1μm以上10μm以下である、請求項2〜9のいずれか一項記載の有機インターポーザ。
- 前記第1の有機絶縁層は、光酸発生剤、フェノール性水酸基を有する化合物、及び熱硬化性樹脂を含む感光性の有機絶縁樹脂が硬化してなる硬化膜である、請求項2〜10のいずれか一項記載の有機インターポーザ。
- 第1の有機絶縁層に複数の溝部を形成する第1工程と、
前記溝部の内面を覆うように前記第1の有機絶縁層上に第1のバリア金属膜を形成する第2工程と、
前記溝部を埋めるように前記第1のバリア金属膜上に配線層を形成する第3工程と、
前記第1の有機絶縁層が露出するように前記配線層を薄化する第4工程と、
前記溝部内の前記配線層を覆うように第2のバリア金属膜を形成する第5工程と、
前記第1の有機絶縁層上及び前記第2のバリア金属膜上に第2の有機絶縁層を形成する第6工程と、を備える有機インターポーザの製造方法。 - 前記第3工程では、前記第1のバリア金属膜をシード層としためっき法によって前記配線層を形成する、請求項12記載の有機インターポーザの製造方法。
- 前記第5工程では、前記配線層をシード層としためっき法によって前記第2のバリア金属膜を形成する、請求項12又は13記載の有機インターポーザの製造方法。
- 前記第4工程では、前記溝部内の前記配線層の一部を除去し、
前記第5工程では、前記溝部を埋めるように前記第2のバリア金属膜を形成する、請求項14記載の有機インターポーザの製造方法。
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