JP2020120125A - 特定用途向け電子機器パッケージングシステム、方法及びデバイス - Google Patents
特定用途向け電子機器パッケージングシステム、方法及びデバイス Download PDFInfo
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/082—Modifications for protecting switching circuit against overcurrent or overvoltage by feedback from the output to the control circuit
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- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
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- H05K2201/01—Dielectrics
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- H05K2201/09—Shape and layout
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
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- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
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- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
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- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
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- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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Abstract
Description
本出願は、2015年6月29日に出願された米国仮出願第62/186,102号、2015年11月12日に出願された米国仮出願第62/254,574号、2015年11月17日に出願された米国仮出願第62/256,477号、及び2016年4月22日に出願された米国仮出願第62/326,539号に対する優先権を主張し、それらの全ては、その全体を参照することによって本明細書に組み込まれる。
Claims (20)
- 電子デバイスを製造する方法であって、
導電性材料から形成された連続したキャリアを形成することと、
複数の非伝導性基板を前記キャリアの上に成形することと、
前記基板上にトレースを形成することと、
該トレースを電気めっきすることと、
構成要素を前記トレースに電気的に取設して、複数のデバイスを形成することと、
前記キャリアの残りから前記デバイスのうちの1つを単体化することと、を含む、方法。 - 前記トレースを形成することが、
レーザで前記基板をアブレーションすることと、
アブレーションされた表面上にインクを堆積させることと、
該インクを焼結することと、を含む、請求項1に記載の方法。 - 前記キャリアの部分が露出されるように、ポケットが、前記基板の中に成形される、請求項1に記載の方法。
- 単体化されたキャリア部分と、
該単体化されたキャリア部分の上に成形された基板と、
該基板上のシード層トレースと、
該シード層トレース上のめっきされた金属トレースと、
少なくとも1つのめっきされた金属トレースに電気的に取設された構成要素と、を備える、デバイス。 - 前記デバイスが、プリント回路基板、フレックス回路、コネクタ、熱管理特徴部、EMIシールド、高電流導体、RFID装置、アンテナ、無線電力デバイス、センサ、MEMS装置、LEDデバイス、マイクロプロセッサ、メモリデバイス、ASIC、受動デバイス、インピーダンス制御デバイス、及び電気機械式装置のうちの少なくとも1つを備える、請求項4に記載のデバイス。
- 前記構成要素が、前記基板に形成されたポケット内に着座する、請求項4に記載のデバイス。
- 前記単体化されたキャリア部分の一部分が露出されるように、前記ポケットが、前記基板の中に形成される、請求項6に記載のデバイス。
- 前記単体化されたキャリア部分が、金属を備える、請求項4に記載のデバイス。
- 前記単体化されたキャリア部分が、フレックス材料を備える、請求項4に記載のデバイス。
- 前記フレックス材料が、ポリイミドフレックス材料を備える、請求項9に記載のデバイス。
- 前記めっきされた金属トレースが、電気めっきでめっきされた金属トレースを備える、請求項4に記載のデバイス。
- 前記シード層トレースが、焼結されたインクを備える、請求項4に記載のデバイス。
- 前記シード層トレースが、焼結されたペーストを備える、請求項4に記載のデバイス。
- 単体化されたキャリア部分と、
該単体化されたキャリア部分の上に成形された基板と、
レーザ及び電気めっきを用いて前記基板上に形成された伝導性のトレースと、
該伝導性のトレースの少なくとも1つに電気的に結合された構成要素と、を備える、デバイス。 - 前記デバイスが、プリント回路基板、フレックス回路、コネクタ、熱管理特徴部、EMIシールド、高電流導体、RFID装置、アンテナ、無線電力デバイス、センサ、MEMS装置、LEDデバイス、マイクロプロセッサ、メモリデバイス、ASIC、受動デバイス、インピーダンス制御デバイス、及び電気機械式装置のうちの少なくとも1つを備える、請求項14に記載のデバイス。
- 前記構成要素が、前記基板に形成されたポケット内に着座する、請求項14に記載のデバイス。
- 前記単体化されたキャリア部分の一部分が露出されるように、前記ポケットが、前記基板の中に形成される、請求項16に記載のデバイス。
- 前記単体化されたキャリア部分が、金属を備える、請求項14に記載のデバイス。
- 前記単体化されたキャリア部分が、フレックス材料を備える、請求項14に記載のデバイス。
- 前記フレックス材料が、ポリイミドフレックス材料を備える、請求項19に記載のデバイス。
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