JP2020102532A - 多段式ハンドおよびこれを備える搬送ロボット - Google Patents
多段式ハンドおよびこれを備える搬送ロボット Download PDFInfo
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- JP2020102532A JP2020102532A JP2018239743A JP2018239743A JP2020102532A JP 2020102532 A JP2020102532 A JP 2020102532A JP 2018239743 A JP2018239743 A JP 2018239743A JP 2018239743 A JP2018239743 A JP 2018239743A JP 2020102532 A JP2020102532 A JP 2020102532A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0019—End effectors other than grippers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (8)
- それぞれがハンド体と当該ハンド体をその基部において支持する支持体とを有し、上下方向に重なるように配置された複数のハンドと、
上記複数のハンドをそれらの姿勢を維持しつつ、上下方向に移動可能にガイドするガイド手段と、
上記複数のハンドの最大ピッチ間隔を規制するハンド間ピッチ規制手段と、を有し、
上記複数のハンドは、1つおきに位置する第1群のハンドと、それ以外の第2群のハンドとからなり、上記ハンド間ピッチ規制手段は、上下に隣り合う第1群のハンドと第2群のハンド間の最大ピッチ間隔を規制することを特徴とする、多段式ハンド。 - 上位に位置する第1群のハンドとその直ぐ下位に位置する第2群のハンド間は、当該第1群のハンドに設けた上向き当接部と、当該第2群のハンドに設けた下向き当接部とが相互に当接することにより両者間の最大ピッチ間隔が規制され、上位に位置する第2群のハンドとその直ぐ下位に位置する第1群のハンド間は、当該第2群のハンドに設けた上向き当接部と、当該第1群のハンドに設けた下向き当接部とが相互に当接することにより両者間の最大ピッチ間隔が規制される、請求項1に記載の多段式ハンド。
- 上記第1群のハンドの上向き当接部と上記第2群のハンドの下向き当接部の組は、第1の平面位置において、上下方向に重なって位置しており、上記第2群のハンドの上向き当接部と上記第1群のハンドの下向き当接部の組は、上記第1の平面位置とは異なる第2の平面位置において、上下方向に重なって位置している、請求項2に記載の多段式ハンド。
- 上記下向き当接部は、各ハンドから側方に延出する側方延出部と、当該側方延出部から上方に延出する上方延出部と、当該上方延出部からハンドに近づくように延びる折り返し延出部とを有するブロックにおける上記折り返し延出部の下面に形成されているとともに、上記上向き当接部は、各ハンドの側方に延出する規制片の上面に形成されており、上記第1の平面位置および上記第2の平面位置において、上記ブロックが上下に積み重なるように当接して、上記複数のハンドの最小ピッチ間隔が規制される、請求項3に記載の多段式ハンド。
- 上記ハンドの上記支持体は、略矩形仮想領域を有しており、上記第1の平面位置と上記第2の平面位置は、上記略矩形仮想領域の幅方向両側に対向して位置している、請求項4に記載の多段式ハンド。
- 上記ガイド手段は、上記第1の平面位置にある複数の上記ブロックと、上記第2の平面位置にある複数の上記ブロックを、それぞれガイドする、請求項4または5に記載の多段式ハンド。
- 最上位の上記ハンドを昇降させる昇降機構をさらに備える、請求項1ないし6のいずれかに記載の多段式ハンド。
- 請求項1ないし7のいずれかに記載の多段式ハンドを備える、搬送ロボット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018239743A JP7149837B2 (ja) | 2018-12-21 | 2018-12-21 | 多段式ハンドおよびこれを備える搬送ロボット |
TW108140618A TWI812807B (zh) | 2018-12-21 | 2019-11-08 | 多段式手臂及具有此手臂之搬運機器人 |
KR1020190167219A KR20200078355A (ko) | 2018-12-21 | 2019-12-13 | 다단식 핸드 및 이를 구비하는 반송 로봇 |
US16/717,257 US11224973B2 (en) | 2018-12-21 | 2019-12-17 | Multi-level hand apparatus and conveying robot provided with the same |
CN201911314567.5A CN111347449B (zh) | 2018-12-21 | 2019-12-18 | 多层式托手以及具备其的搬运机器人 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018239743A JP7149837B2 (ja) | 2018-12-21 | 2018-12-21 | 多段式ハンドおよびこれを備える搬送ロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020102532A true JP2020102532A (ja) | 2020-07-02 |
JP7149837B2 JP7149837B2 (ja) | 2022-10-07 |
Family
ID=71098042
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018239743A Active JP7149837B2 (ja) | 2018-12-21 | 2018-12-21 | 多段式ハンドおよびこれを備える搬送ロボット |
Country Status (5)
Country | Link |
---|---|
US (1) | US11224973B2 (ja) |
JP (1) | JP7149837B2 (ja) |
KR (1) | KR20200078355A (ja) |
CN (1) | CN111347449B (ja) |
TW (1) | TWI812807B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI707753B (zh) * | 2020-05-07 | 2020-10-21 | 鈦昇科技股份有限公司 | 自動化手臂更換機構 |
JP2022051282A (ja) * | 2020-09-18 | 2022-03-31 | 日本電産サンキョー株式会社 | 産業用ロボット |
TWI744078B (zh) * | 2020-11-06 | 2021-10-21 | 三和技研股份有限公司 | 控制複數承接件間距之機械手臂 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6379341A (ja) * | 1986-09-22 | 1988-04-09 | Nec Corp | ウエハ−移載装置 |
JPH11130254A (ja) * | 1997-10-24 | 1999-05-18 | Sharp Corp | 基板搬送カセット |
JP2001291759A (ja) * | 2000-04-07 | 2001-10-19 | Mitsubishi Electric Corp | 配列ピッチ変換装置 |
JP2018125388A (ja) * | 2017-01-31 | 2018-08-09 | 川崎重工業株式会社 | 基板把持ハンド及び基板搬送装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040013503A1 (en) * | 2002-07-22 | 2004-01-22 | Jaswant Sandhu | Robotic hand with multi-wafer end effector |
TWI476855B (zh) * | 2006-05-03 | 2015-03-11 | Gen Co Ltd | 基板傳輸設備、和使用該設備的高速基板處理系統 |
CN101092034A (zh) * | 2006-06-20 | 2007-12-26 | 力晶半导体股份有限公司 | 晶片搬运设备的校正装置与晶片搬运设备的校正方法 |
JP5081567B2 (ja) * | 2007-10-12 | 2012-11-28 | エスペック株式会社 | ロボット用ハンド |
JP5592710B2 (ja) * | 2010-06-17 | 2014-09-17 | セイコーインスツル株式会社 | ピッチ変換装置 |
KR101311616B1 (ko) * | 2011-08-12 | 2013-09-26 | 시바우라 메카트로닉스 가부시끼가이샤 | 처리 시스템 및 처리 방법 |
JP6018379B2 (ja) | 2011-12-27 | 2016-11-02 | 川崎重工業株式会社 | 基板保持装置 |
-
2018
- 2018-12-21 JP JP2018239743A patent/JP7149837B2/ja active Active
-
2019
- 2019-11-08 TW TW108140618A patent/TWI812807B/zh active
- 2019-12-13 KR KR1020190167219A patent/KR20200078355A/ko not_active Application Discontinuation
- 2019-12-17 US US16/717,257 patent/US11224973B2/en active Active
- 2019-12-18 CN CN201911314567.5A patent/CN111347449B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6379341A (ja) * | 1986-09-22 | 1988-04-09 | Nec Corp | ウエハ−移載装置 |
JPH11130254A (ja) * | 1997-10-24 | 1999-05-18 | Sharp Corp | 基板搬送カセット |
JP2001291759A (ja) * | 2000-04-07 | 2001-10-19 | Mitsubishi Electric Corp | 配列ピッチ変換装置 |
JP2018125388A (ja) * | 2017-01-31 | 2018-08-09 | 川崎重工業株式会社 | 基板把持ハンド及び基板搬送装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111347449B (zh) | 2024-05-24 |
CN111347449A (zh) | 2020-06-30 |
TWI812807B (zh) | 2023-08-21 |
KR20200078355A (ko) | 2020-07-01 |
JP7149837B2 (ja) | 2022-10-07 |
TW202023769A (zh) | 2020-07-01 |
US20200198156A1 (en) | 2020-06-25 |
US11224973B2 (en) | 2022-01-18 |
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