JP2020096003A5 - - Google Patents

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JP2020096003A5
JP2020096003A5 JP2018230703A JP2018230703A JP2020096003A5 JP 2020096003 A5 JP2020096003 A5 JP 2020096003A5 JP 2018230703 A JP2018230703 A JP 2018230703A JP 2018230703 A JP2018230703 A JP 2018230703A JP 2020096003 A5 JP2020096003 A5 JP 2020096003A5
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Japan
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electrode
region
crystal member
crystal
semiconductor
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JP2018230703A
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English (en)
Japanese (ja)
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JP7021063B2 (ja
JP2020096003A (ja
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Priority to US16/568,490 priority patent/US11075262B2/en
Publication of JP2020096003A publication Critical patent/JP2020096003A/ja
Publication of JP2020096003A5 publication Critical patent/JP2020096003A5/ja
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JP2018230703A 2018-12-10 2018-12-10 半導体装置 Active JP7021063B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018230703A JP7021063B2 (ja) 2018-12-10 2018-12-10 半導体装置
US16/568,490 US11075262B2 (en) 2018-12-10 2019-09-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018230703A JP7021063B2 (ja) 2018-12-10 2018-12-10 半導体装置

Publications (3)

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JP2020096003A JP2020096003A (ja) 2020-06-18
JP2020096003A5 true JP2020096003A5 (enExample) 2021-02-18
JP7021063B2 JP7021063B2 (ja) 2022-02-16

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JP2018230703A Active JP7021063B2 (ja) 2018-12-10 2018-12-10 半導体装置

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US (1) US11075262B2 (enExample)
JP (1) JP7021063B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7021063B2 (ja) * 2018-12-10 2022-02-16 株式会社東芝 半導体装置
CN117317001A (zh) * 2019-04-12 2023-12-29 广东致能科技有限公司 一种半导体器件及其制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344759A (ja) * 2005-06-08 2006-12-21 Sharp Corp トレンチ型mosfet及びその製造方法
JP2007103727A (ja) 2005-10-05 2007-04-19 Toyota Motor Corp 炭化珪素半導体装置及びその製造方法
JP2006086548A (ja) * 2005-12-12 2006-03-30 Nissan Motor Co Ltd 電界効果トランジスタ
CN103219375A (zh) * 2006-11-20 2013-07-24 松下电器产业株式会社 半导体装置
JP4793390B2 (ja) * 2008-02-13 2011-10-12 株式会社デンソー 炭化珪素半導体装置およびその製造方法
JP5207874B2 (ja) 2008-08-08 2013-06-12 親夫 木村 半導体装置およびその製造方法
CN105393359B (zh) * 2013-07-15 2018-12-14 Hrl实验室有限责任公司 Hemt器件和方法
JP2016058648A (ja) 2014-09-11 2016-04-21 株式会社東芝 半導体装置
US9601610B1 (en) * 2015-06-18 2017-03-21 Hrl Laboratories, Llc Vertical super junction III/nitride HEMT with vertically formed two dimensional electron gas
CN106611781A (zh) * 2015-10-27 2017-05-03 上海新昇半导体科技有限公司 量子阱器件及其形成方法
US20170345905A1 (en) * 2016-05-24 2017-11-30 Infineon Technologies Ag Wide-Bandgap Semiconductor Device with Trench Gate Structures
JP2018010995A (ja) * 2016-07-14 2018-01-18 株式会社豊田中央研究所 炭化珪素半導体装置とその製造方法
US20210028303A1 (en) * 2018-03-29 2021-01-28 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device and method for fabricating the same
JP6903604B2 (ja) 2018-05-14 2021-07-14 株式会社東芝 半導体装置
JP6924166B2 (ja) 2018-05-14 2021-08-25 株式会社東芝 半導体装置
JP7021063B2 (ja) * 2018-12-10 2022-02-16 株式会社東芝 半導体装置

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