JP2020061457A - リングフレームの保持機構 - Google Patents
リングフレームの保持機構 Download PDFInfo
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- JP2020061457A JP2020061457A JP2018191690A JP2018191690A JP2020061457A JP 2020061457 A JP2020061457 A JP 2020061457A JP 2018191690 A JP2018191690 A JP 2018191690A JP 2018191690 A JP2018191690 A JP 2018191690A JP 2020061457 A JP2020061457 A JP 2020061457A
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- ring frame
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- 230000014759 maintenance of location Effects 0.000 title abstract 2
- 230000000717 retained effect Effects 0.000 abstract 1
- 230000001629 suppression Effects 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B47/00—Suction cups for attaching purposes; Equivalent means using adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Supplying Of Containers To The Packaging Station (AREA)
- Golf Clubs (AREA)
- Load-Engaging Elements For Cranes (AREA)
Abstract
Description
位置決めされたリングフレームは、吸盤で保持される。少なくとも4つの吸盤が、位置決めされたリングフレームの中心を中心とし、等間隔に配設されている。
図1に示すように、リングフレーム1は、中央の開口部2、平行に向かい合った2つの第1の平坦面3,5、および、第1の平坦面3,5の向かい合う方向に対して直交する方向に向かい合った2つの第2の平坦面7,9を備えている。これら4つの平坦面3,5,7および9は、リングフレーム1の外周に備えられており、リングフレーム1を位置決めするための基準面となる。
吸盤機構33は、さらに、吸引源61に接続されている吸引用配管43、吸引用配管43に配設されている第1のバルブ45、エア供給源63に接続されているエア供給用配管47、エア供給用配管47に配設されている第2のバルブ49、および、共通路65を備えている。
(1)リングフレーム搬送工程
リングフレーム保持機構10の動作の開始前に、まず、図1に示したリングフレームが、リングフレーム保持機構10の所定位置に搬送される。この搬送に使用される搬送装置111は、図5に示すように、リングフレーム1を吸引保持する複数(たとえば4つ)の保持部材121、保持部材121の吸引源である搬送吸引源117、各保持部材121を支持する支持部116、駆動源(図示せず)に連結されたアーム部115、および、支持部116とアーム部115とを連結する連結部材119を備えている。
次に、リングフレーム1を目標位置に位置決めする。
図6に示すように、この工程では、第1のバルブ45が閉じられている状態で第2のバルブ49が開かれて、各吸盤部材40の吸盤41が、エア供給用配管47、共通路65および蛇腹筒42を介して、エア供給源63に連通される。これにより、吸盤41からエアが噴出されて、吸盤41の上端41aに載置されているリングフレーム1が、吸盤41から浮上する。
なお、図6および図7では、吸引用配管43、エア供給用配管47、共通路65および蛇腹筒42内におけるエアの流れを、矢印によって示している。
次に、リングフレーム1を、リングフレーム保持機構10によって吸着保持する。
図7に示すように、この工程では、第2のバルブ49が閉じられるとともに、第1のバルブ45が開かれて、各吸盤部材40の吸盤41が、吸引用配管43、共通路65および蛇腹筒42を介して、吸引源61に連通される。これにより、浮上していたリングフレーム1が、吸盤41の上端41aに載置される。そして、吸盤41が、その上端41aの開口部からエアを吸い込み、上端41aに載置されているリングフレーム1を吸着保持する。
10:リングフレーム保持機構、
11:テーブル、15:ウェーハ保持テーブル、
21:第1の固定位置決め部、23:第1の可動位置決め部、
25:第2の固定位置決め部、27:第2の可動位置決め部、
31:凹部、32:シリンダ機構、
33:吸盤機構、40:吸盤部材、41:吸盤、41a:上端、42:蛇腹筒、
43:吸引用配管、45:第1のバルブ、47:エア供給用配管、49:第2のバルブ、
51:第3の固定位置決め部、53:第3の可動位置決め部、
55:第4の固定位置決め部、57:第4の可動位置決め部、
61:吸引源、63:エア供給源、65:共通路、
71:貼着ローラ、
T:ダイシングテープ
Claims (2)
- 平行に向かい合った2つの第1の平坦面と該第1の平坦面に対して直交する方向で平行に向かい合った2つの第2の平坦面とからなる4つの平坦面を外周に有するリングフレームを、該第1および第2の平坦面の少なくとも一方を挟んで目標位置に位置決めする位置決め手段で位置決めされた該リングフレームの下面を吸引保持するリングフレームの保持機構であって、
テーブルと、該テーブルの上面に形成された開口を有する凹部に配置され可撓性を有する吸盤と、該吸盤を吸引源に連通する吸引路と、該吸引路に配設される第1のバルブと、該吸盤をエア供給源に連通するエア供給路と、該エア供給路に配設される第2のバルブとを備え、
該吸盤は、該テーブルの上面からとび出ており、下方向に押されることにより該凹部に収容されることの可能な上端を有しており、
該第2のバルブが開かれて該吸盤からエアが噴出されたとき、該テーブルの上面と該リングフレームの下面との間にエア層が形成され、該リングフレームと該吸盤とが非接触状態となるとともに、該エア層により該吸盤の上端が下方向に押されて、該吸盤の上端と該テーブルの上面とが面一になり、該位置決め手段が、該向かい合う平坦面を挟んで該リングフレームを目標位置に位置決めし、
該第2のバルブが閉じられるとともに該第1のバルブが開かれたとき、該吸盤が該リングフレームを吸引保持する、
リングフレームの保持機構。 - 該吸盤を支持する蛇腹筒をさらに備え、
該第1のバルブが開かれて該吸盤が該リングフレームを吸引保持したとき、該吸盤の上端が該リングフレームの下面によって下方に押されるとともに、該蛇腹筒内が負圧になり該蛇腹筒内と該蛇腹筒外の大気圧との圧力差が発生し、大気圧によって該蛇腹筒が収縮されることで、該吸盤が該凹部内に収容されて、該テーブルの上面が該リングフレームの下面を支持する、
請求項1記載のリングフレームの保持機構。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018191690A JP7140626B2 (ja) | 2018-10-10 | 2018-10-10 | リングフレームの保持機構 |
TW108133337A TWI809192B (zh) | 2018-10-10 | 2019-09-17 | 環形框之保持機構 |
SG10201909280VA SG10201909280VA (en) | 2018-10-10 | 2019-10-03 | Ring frame holding mechanism |
US16/596,898 US11318625B2 (en) | 2018-10-10 | 2019-10-09 | Ring frame holding mechanism |
CN201910952513.5A CN111029253B (zh) | 2018-10-10 | 2019-10-09 | 环状框架的保持机构 |
KR1020190125455A KR102668030B1 (ko) | 2018-10-10 | 2019-10-10 | 링 프레임의 유지 기구 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018191690A JP7140626B2 (ja) | 2018-10-10 | 2018-10-10 | リングフレームの保持機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020061457A true JP2020061457A (ja) | 2020-04-16 |
JP7140626B2 JP7140626B2 (ja) | 2022-09-21 |
Family
ID=70162391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018191690A Active JP7140626B2 (ja) | 2018-10-10 | 2018-10-10 | リングフレームの保持機構 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11318625B2 (ja) |
JP (1) | JP7140626B2 (ja) |
KR (1) | KR102668030B1 (ja) |
CN (1) | CN111029253B (ja) |
SG (1) | SG10201909280VA (ja) |
TW (1) | TWI809192B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7493878B2 (ja) | 2020-07-08 | 2024-06-03 | 株式会社ディスコ | テープ貼着装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2021006B1 (en) | 2018-05-29 | 2019-12-04 | Suss Microtec Lithography Gmbh | Holding apparatus and method for holding a substrate |
JP7140626B2 (ja) * | 2018-10-10 | 2022-09-21 | 株式会社ディスコ | リングフレームの保持機構 |
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JP2004165643A (ja) * | 2002-10-25 | 2004-06-10 | Tokyo Electron Ltd | 基板アライメント装置及び基板処理装置及び基板搬送装置 |
JP2013082045A (ja) * | 2011-10-12 | 2013-05-09 | Disco Corp | 位置決め機構 |
JP2017050373A (ja) * | 2015-09-01 | 2017-03-09 | リンテック株式会社 | シート貼付装置およびシート貼付方法 |
JP2018139280A (ja) * | 2017-02-24 | 2018-09-06 | リンテック株式会社 | 位置決め装置および位置決め方法 |
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JP4471747B2 (ja) | 2004-06-24 | 2010-06-02 | アピックヤマダ株式会社 | 半導体装置の製造装置 |
JP5001133B2 (ja) * | 2007-12-26 | 2012-08-15 | 株式会社ディスコ | ウエーハの搬送装置 |
JP2011036968A (ja) | 2009-08-17 | 2011-02-24 | Disco Abrasive Syst Ltd | 位置決め機構および研削装置 |
JP5461104B2 (ja) * | 2009-08-20 | 2014-04-02 | 株式会社ディスコ | 保持テーブルおよび研削装置 |
JP2016009812A (ja) * | 2014-06-26 | 2016-01-18 | 株式会社ディスコ | テープ貼着用保持機構及びテープ貼着方法 |
JP6710050B2 (ja) * | 2016-01-19 | 2020-06-17 | 株式会社ディスコ | 搬送装置 |
JP6637831B2 (ja) * | 2016-04-28 | 2020-01-29 | 株式会社ディスコ | デバイスの製造方法及び研削装置 |
JP6920079B2 (ja) * | 2017-03-07 | 2021-08-18 | 株式会社ディスコ | チャックテーブル |
JP7037424B2 (ja) * | 2018-04-20 | 2022-03-16 | 株式会社ディスコ | ウェーハの加工方法 |
JP7140626B2 (ja) * | 2018-10-10 | 2022-09-21 | 株式会社ディスコ | リングフレームの保持機構 |
JP7282452B2 (ja) * | 2019-02-15 | 2023-05-29 | 株式会社ディスコ | ウェーハの加工方法 |
JP2020174100A (ja) * | 2019-04-10 | 2020-10-22 | 株式会社ディスコ | ウェーハの加工方法 |
JP7304775B2 (ja) * | 2019-08-29 | 2023-07-07 | 株式会社ディスコ | ウェーハの加工方法 |
JP7300938B2 (ja) * | 2019-09-02 | 2023-06-30 | 株式会社ディスコ | カーフの認識方法 |
JP2021044445A (ja) * | 2019-09-12 | 2021-03-18 | 株式会社ディスコ | リングフレームの保持機構 |
JP7301480B2 (ja) * | 2019-10-17 | 2023-07-03 | 株式会社ディスコ | ウェーハの加工方法 |
JP7384675B2 (ja) * | 2020-01-15 | 2023-11-21 | 株式会社ディスコ | 傾き調整機構 |
JP7339905B2 (ja) * | 2020-03-13 | 2023-09-06 | キオクシア株式会社 | 貼合装置および貼合方法 |
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2018
- 2018-10-10 JP JP2018191690A patent/JP7140626B2/ja active Active
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2019
- 2019-09-17 TW TW108133337A patent/TWI809192B/zh active
- 2019-10-03 SG SG10201909280VA patent/SG10201909280VA/en unknown
- 2019-10-09 US US16/596,898 patent/US11318625B2/en active Active
- 2019-10-09 CN CN201910952513.5A patent/CN111029253B/zh active Active
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Patent Citations (4)
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CN111029253B (zh) | 2024-05-14 |
KR20200040689A (ko) | 2020-04-20 |
US11318625B2 (en) | 2022-05-03 |
US20200114525A1 (en) | 2020-04-16 |
CN111029253A (zh) | 2020-04-17 |
JP7140626B2 (ja) | 2022-09-21 |
KR102668030B1 (ko) | 2024-05-21 |
TW202015172A (zh) | 2020-04-16 |
SG10201909280VA (en) | 2020-05-28 |
TWI809192B (zh) | 2023-07-21 |
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