TWI611499B - 搬送機構 - Google Patents
搬送機構 Download PDFInfo
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- TWI611499B TWI611499B TW103142141A TW103142141A TWI611499B TW I611499 B TWI611499 B TW I611499B TW 103142141 A TW103142141 A TW 103142141A TW 103142141 A TW103142141 A TW 103142141A TW I611499 B TWI611499 B TW I611499B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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Abstract
本發明是一種搬送機構。課題為做成,即使是在將具有翹曲的晶圓搬送至保持台上時,保持台仍可吸引保持晶圓。解決手段為,用於將晶圓搬送至可吸引保持晶圓之保持台的搬送機構,該搬送機構包含保持頭,及可使保持頭相對於保持台接近及遠離的保持頭移動手段。該保持頭具有,複數個可吸引保持晶圓的吸引保持部,及複數個可在將載置於保持台上之晶圓的外周部朝向保持台按壓之按壓位置,與不接觸到已保持在吸引保持部之晶圓的退避位置之間進行移動的按壓構件。即使是在晶圓的外周部分為向上地翹曲的情況下,仍可在保持台上將晶圓的翹曲矯正而消除與保持台之間的間隙,並吸引保持晶圓。
Description
本發明是有關於一種將晶圓搬送至保持台上之搬送機構。
在對晶圓進行各種加工之加工裝置中,有設有用於保持加工對象之晶圓的保持台的裝置(參照例如,專利文獻1)。在像這樣具有保持台之加工裝置上,通常具有可在保持台與其他部位之間搬送晶圓之搬送機構(參照例如,專利文獻2)。
專利文獻1:日本專利特開平11-284056號公報
專利文獻2:日本專利特開2013-144323號公報
然而,在將薄化之晶圓、玻璃、矽(silicon),或
密封樹脂等的材質積層而成之積層晶圓上,會有發生翹曲的情形。當將該等發生翹曲之晶圓載置於保持台上時,由於保持台之保持面與晶圓之間會有間隙,因此即使利用負壓吸引晶圓,仍會有所謂的有時會無法保持晶圓之問題。
本發明是有鑑於此問題而作成的,且目的是做成,即使將具有翹曲之晶圓搬送至保持台時保持台仍可以吸引保持晶圓。
本發明是一種可將晶圓搬送至能夠吸引保持晶圓之保持台的搬送機構,其包含:保持頭,具有複數個可吸引保持晶圓的吸引保持部,及複數個可在將載置於該保持台上之晶圓的外周部朝向該保持台按壓之按壓位置,與不接觸到已保持在該吸引保持部之晶圓的退避位置之間進行移動的按壓構件;及保持頭移動手段,可使該保持頭相對於該保持台接近及遠離。
較理想的是,將前述複數個吸引保持部配置成,能夠在比前述按壓構件還要內側之內側位置,及與該按壓構件在相同圓周上之外側位置之間進行移動。
根據本發明之搬送機構,由於複數個按壓構件可將晶圓的外周部分朝向保持台按壓,因此即使是在晶圓的外周部分為向上地翹曲的情況下,仍可在保持台上將晶圓的翹曲矯正而消除與保持台之間的間隙,並吸引保持晶圓。
又,只要吸引保持部可在內側位置與外側位置之間進行
移動,在晶圓的外周部分為向上地翹曲的情況時,透過將吸引保持部配置到外側位置,則不僅是按壓構件,連吸引保持部也可以將晶圓的外周部分朝保持台按壓。又,在晶圓的外周部分為向下地翹曲的情況時,透過將吸引保持部配置到內側位置,就能一邊以按壓構件按壓晶圓的外周部分,一邊以吸引保持部將晶圓的中央部分朝向保持台按壓。藉此,無論晶圓的外周部分為向上地翹曲之情況,或向下地翹曲之情況,都可將晶圓的翹曲矯正,而消除與保持台之間的間隙,並使保持台吸引保持晶圓。
10‧‧‧搬送機構
12‧‧‧保持頭
13‧‧‧保持頭移動手段
21‧‧‧中央部
24‧‧‧吸引保持部
25、25a~25c‧‧‧按壓構件
26、26a~26c‧‧‧按壓移動手段
22a~22c、23a~23c‧‧‧腕部
24a~24c‧‧‧吸引保持部
31‧‧‧支撐部
32‧‧‧臂體
33‧‧‧軸部
41、43‧‧‧吸引源
42、44‧‧‧逆止閥
50‧‧‧保持台
51‧‧‧保持面
60‧‧‧晶圓
±X、±Y、±Z‧‧‧方向
圖1是表示搬送機構之立體圖。
圖2是表示搬送機構保持晶圓之情形的側面視剖面圖。
圖3是表示搬送機構將晶圓載置於保持台上之情形的側面視剖面圖。
圖4是表示搬送機構將晶圓按壓於保持台上之情形的側面視剖面圖。
圖5是表示搬送機構保持晶圓之情形的側面視剖面圖。
圖6是表示搬送機構將晶圓按壓於保持台上之情形的側面視剖面圖。
圖1所示之搬送機構10,可為例如組裝於可加工晶圓之加工裝置上之機構,並可將例如於加工前載置於暫時供晶圓載置之暫置台上的晶圓,在加工時搬送至可保持
晶圓之保持台上。保持台是用於吸引保持藉由搬送機構10所搬送之晶圓。保持於保持台上之晶圓可藉由例如,磨削手段或切削手段等的加工手段而進行加工。搬送機構10具備,在搬送中保持晶圓之保持頭12,及可使保持頭12移動之保持頭移動手段13。
保持頭12具備,平行於與暫置台及保持台之保持面平行的XY平面的圓板狀的中央部21、在平行於XY平面之平面內從中央部21朝向外側延伸成放射狀之6個腕部22a~22c、23a~23c、配置於各個腕部23a~23c上的3個吸引保持部24a~24c,及配置於各個腕部22a~22c上的3個按壓構件25a~25c與3個按壓移動手段26a~26c。
相鄰接的腕部22a~22c、23a~23c之間的角度,任何一個皆為60度。又,吸引保持部24a~24c是透過逆止閥42連接到真空源等之吸引源41,並吸引保持晶圓。且是將吸引保持部24a~24c構成為可沿著腕部23a~23c在徑向上移動。
保持頭12的中心(中央部21的中心軸)與各個按壓構件25a~25c之間的距離是,略小於搬送機構10所搬送之晶圓的半徑,且按壓構件25a~25c是配置成可按壓晶圓的外周部分。
保持頭12的中心與各個吸引保持部24a~24c之間的距離會,根據吸引保持部24a~24c的徑向之移動而變化。各個吸引保持部24a~24c在最遠離保持頭12的中心之位置時,保持頭12的中心與各個吸引保持部24a~24c之間的距離
是,與保持頭12的中心與各個按壓構件25a~25c之間的距離相等,且各個吸引保持部24a~24c會位於與各個按壓構件25a~25c相同的圓周上。此時的吸引保持部24a~24c的位置稱為「外側位置」。吸引保持部24a~24c在外側位置時,吸引保持部24a~24c可吸引保持晶圓之外周部分。另一方面,各個吸引保持部24a~24c在最接近保持頭12的中心之位置時,保持頭12之中心與各個吸引保持部24a~24c之間的距離是,小於保持頭12之中心與各個按壓構件25a~25c之間的距離,且各個吸引保持部24a~24c會位於比通過各個按壓構件25a~25c之圓周還要內側之位置。此時的吸引保持部24a~24c的位置稱為「內側位置」。吸引保持部24a~24c在內側位置時,吸引保持部24a~24c可吸引保持晶圓之靠近中央的位置。
按壓移動手段26a~26c具備,在例如前端上連接有按壓構件25a~25c之桿體,及使桿體在相對於XY平面為垂直之±Z方向上進行移動之氣缸,且可藉由使桿體移動而使按壓構件25a~25c在±Z方向上移動。氣缸可為,例如能夠將桿體2段式伸長之2段行程氣缸。當按壓移動手段26a~26c使按壓構件25a~25c朝+Z方向移動時,按壓構件25a~25c可退避至不接觸到吸引保持部24a~24c所吸引保持之晶圓的位置上。此時的按壓構件25a~25c的位置稱為「退避位置」。另一方面,當按壓移動手段26a~26c使按壓構件25a~25c朝-Z方向移動時,按壓構件25a~25c會抵接於晶圓,並將晶圓朝-Z方向按壓。此時的按壓構件25a~25c的位置稱為「按
壓位置」。在按壓位置中有,於±Z方向上,使按壓構件25a~25c的前端位於比吸引保持部24a~24c的前端還靠近-Z側之「第一按壓位置」,及位於與吸引保持部24a~24c的前端為相同高度的「第二按壓位置」。
保持頭移動手段13具有,可支撐保持頭12之支撐部31、供支撐部31配置於前端之臂體32,及可使臂體32移動之軸部33。軸部33可使臂體32在XY平面內轉動,同時使臂體32在±Z方向上移動。藉此,就能移動保持頭12,以使保持頭12接近載置有應進行搬送之晶圓的暫置台或為晶圓之搬送目的地之保持台,或者,使保持頭12遠離暫置台或保持台。
接著,針對搬送晶圓之順序進行說明。以下,是將吸引保持部24a~24c之中的任意1個當作吸引保持部24、按壓構件25a~25c之中的任意1個當作按壓構件25、移動手段26a~26c之中的任意1個當作移動手段26而進行說明。
(1)晶圓為中央凹入的情況
如圖2所示,在晶圓60的外周部分為朝+Z方向翹曲的情況(中央凹入的情況)中,是使吸引保持部24朝外周側移動而定位至外側位置,且按壓移動手段26會使按壓構件25朝+Z方向移動而定位至退避位置。在此狀態下,保持頭移動手段13會使臂體32轉動,以將保持頭12定位於載置在暫置台等上之晶圓60的+Z方向上,且保持頭移動手段13會使臂體32朝-Z方向移動,以使吸引保持部24抵接於晶圓60的外周部分。之後,開啟逆止閥42(參照圖1)以啟動藉由吸引源
41(參照圖1)形成的吸引,並使吸引保持部24吸引保持晶圓60。
如圖3所示,保持台50具有透過逆止閥44與真空等之吸引源43連接的保持面51。保持頭移動手段13可使臂體32朝+Z方向移動,以將保持於吸引保持部24之晶圓60拿起,並以保持頭移動手段13使臂體32轉動,以將保持頭12定位到作為晶圓60之搬送目的地之保持台50的+Z方向上。並且,保持頭移動手段13會使臂體32朝-Z方向下降,且將保持於吸引保持部24之晶圓60載置到保持台50之保持面51上。
接著,如圖4所示,關閉逆止閥42(參照圖1)而停止藉由吸引源41(參照圖1)形成之吸引以使吸引保持部24放開晶圓60,且按壓移動手段26會使按壓構件25朝-Z方向移動並定位於第一按壓位置,且將晶圓60的外周部分朝-Z方向按壓。之後,開啟逆止閥44而啟動藉由吸引源43形成之吸引,並使保持台50吸引保持晶圓60。藉由使按壓構件25將晶圓60的外周部分朝-Z方向按壓,就能矯正晶圓60的翹曲,並消除晶圓60與保持面51之間的間隙。藉由在此狀態下使保持台50進行吸引,就能確實地保持晶圓60。再者,也可將按壓構件25定位於第二按壓位置而非第一按壓位置。如此進行,則不僅按壓構件25,連吸引保持部24也可以用於按壓晶圓60。
(2)晶圓為中央凸起的情況
如圖5所示,在晶圓60的外周部分為朝-Z方向翹曲的
情況(中央凸起的情況)中,吸引保持移動手段會使吸引保持部24朝中心側移動而定位到內側位置上,且按壓移動手段26會使按壓構件25朝-Z方向移動而定位於退避位置。在此狀態下,保持頭移動手段13會使臂體32轉動,而將保持頭12定位於載置在暫置台等上之晶圓60的+Z方向上,並以保持頭移動手段13使臂體32朝-Z方向移動,以使吸引保持部24抵接於晶圓60的中央附近。之後,開啟逆止閥42(參照圖1)以啟動藉由吸引源41(參照圖1)形成之吸引,並使吸引保持部24吸引保持晶圓60。
接著,保持頭移動手段13會使臂體32朝+Z方向移動,以將保持於吸引保持部24之晶圓60拿起,並以保持頭移動手段13使臂體32轉動,以將保持頭12定位於作為晶圓60之搬送目的地之保持台50的+Z方向上。並且,保持頭移動手段13會使臂體32朝-Z方向下降,以將保持於吸引保持部24之晶圓60載置到保持台50之保持面51上。
如圖6所示,按壓移動手段26會使按壓構件25朝-Z方向移動而定位於第二按壓位置,且保持頭移動手段13會使臂體32朝-Z方向下降,以藉按壓構件25將晶圓60的外周部分朝-Z方向按壓,同時藉吸引保持部24將晶圓60的中央附近朝-Z方向按壓。之後,開啟逆止閥44而啟動藉由吸引源43形成之吸引,以使保持台50吸引保持晶圓60,並關閉逆止閥42(參照圖1)而停止藉由吸引源41(參照圖1)形成之吸引以使吸引保持部24放開晶圓60。
藉由使按壓構件25將晶圓60的外周部分朝-Z
方向按壓,同時使吸引保持部24將晶圓60的中央附近朝-Z方向按壓,就能矯正晶圓60的翹曲,並消除晶圓60與保持面51之間的間隙。藉由在此狀態下使保持台50進行吸引,就能確實地保持晶圓60。
再者,吸引保持部的數量,不限定為3個,也可為4個以上。同樣地,按壓構件的數量不限定為3個,也可為4個以上。又,吸引保持部24a~24c在外側位置時之離中心的距離,也可以大於按壓構件25a~25c之離中心的距離。此外,不僅吸引保持部24a~24c,按壓構件25a~25c也可以是可在徑向上移動之構成。
10‧‧‧搬送機構
12‧‧‧保持頭
13‧‧‧保持頭移動手段
21‧‧‧中央部
22a~22c、23a~23c‧‧‧腕部
24a~24c‧‧‧吸引保持部
25a~25c‧‧‧按壓構件
26a~26c‧‧‧按壓移動手段
31‧‧‧支撐部
32‧‧‧臂體
33‧‧‧軸部
41‧‧‧吸引源
42‧‧‧逆止閥
±X、±Y、±Z‧‧‧方向
Claims (2)
- 一種搬送機構,為將晶圓搬送至吸引保持晶圓之保持台的搬送機構,其包含:保持頭,具有複數個吸引保持晶圓的吸引保持部,及複數個可在將載置於該保持台上之晶圓的外周部朝向該保持台按壓之按壓位置,與不接觸到已保持在該吸引保持部之晶圓的退避位置之間進行移動的按壓構件;及保持頭移動手段,可使該保持頭相對於該保持台接近及遠離。
- 如請求項1所述的搬送機構,其中,是將前述複數個吸引保持部配置成,能夠在比前述按壓構件還要內側之內側位置,及與該按壓構件在相同圓周上之外側位置之間進行移動。
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