KR102154718B1 - 반송 기구 - Google Patents

반송 기구 Download PDF

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Publication number
KR102154718B1
KR102154718B1 KR1020150001033A KR20150001033A KR102154718B1 KR 102154718 B1 KR102154718 B1 KR 102154718B1 KR 1020150001033 A KR1020150001033 A KR 1020150001033A KR 20150001033 A KR20150001033 A KR 20150001033A KR 102154718 B1 KR102154718 B1 KR 102154718B1
Authority
KR
South Korea
Prior art keywords
wafer
holding
suction
holding table
pressing
Prior art date
Application number
KR1020150001033A
Other languages
English (en)
Korean (ko)
Other versions
KR20150090997A (ko
Inventor
린타로 차노
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20150090997A publication Critical patent/KR20150090997A/ko
Application granted granted Critical
Publication of KR102154718B1 publication Critical patent/KR102154718B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020150001033A 2014-01-30 2015-01-06 반송 기구 KR102154718B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014015444A JP6255259B2 (ja) 2014-01-30 2014-01-30 搬送機構
JPJP-P-2014-015444 2014-01-30

Publications (2)

Publication Number Publication Date
KR20150090997A KR20150090997A (ko) 2015-08-07
KR102154718B1 true KR102154718B1 (ko) 2020-09-10

Family

ID=53731546

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150001033A KR102154718B1 (ko) 2014-01-30 2015-01-06 반송 기구

Country Status (4)

Country Link
JP (1) JP6255259B2 (zh)
KR (1) KR102154718B1 (zh)
CN (1) CN104821288B (zh)
TW (1) TWI611499B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6859075B2 (ja) * 2016-11-04 2021-04-14 株式会社東京精密 ウエハの搬送保持装置
JP6879807B2 (ja) * 2017-04-07 2021-06-02 株式会社ディスコ 加工装置
CN113003185A (zh) * 2021-02-23 2021-06-22 胡慧红 一种晶圆光刻显影用的平贴设备
CN118315325B (zh) * 2024-06-11 2024-09-20 华芯(嘉兴)智能装备有限公司 一种晶圆吸附控制方法与系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009107097A (ja) * 2007-10-31 2009-05-21 Disco Abrasive Syst Ltd 加工装置
JP2012156415A (ja) 2011-01-28 2012-08-16 Lintec Corp 板状部材の支持装置及び支持方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3993296B2 (ja) 1998-03-27 2007-10-17 株式会社ディスコ 吸着固定装置
JP4796249B2 (ja) * 2001-09-14 2011-10-19 株式会社ディスコ 板状物の搬送機構および搬送機構を備えたダイシング装置
JP4371939B2 (ja) * 2004-08-03 2009-11-25 パナソニック株式会社 基板搬入装置、部品実装装置、及び基板搬入方法
JP4841355B2 (ja) * 2006-08-08 2011-12-21 日東電工株式会社 半導体ウエハの保持方法
TWM312404U (en) * 2006-11-07 2007-05-21 Hiwin Tech Corp Arm mechanism for transporting wafer
JP2008227134A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 部品実装装置及び基板搬送方法
JP2010076929A (ja) * 2008-09-29 2010-04-08 Ushio Inc 基板搬送アーム
JP5846734B2 (ja) * 2010-11-05 2016-01-20 株式会社ディスコ 搬送装置
TWM410333U (en) * 2011-01-18 2011-08-21 Xintec Inc Loading device
TWM421587U (en) * 2011-07-28 2012-01-21 Nutrim Technology Inc Leveling apparatus for wafer
JP5943581B2 (ja) * 2011-11-01 2016-07-05 株式会社ディスコ 搬送装置
JP5877719B2 (ja) 2012-01-13 2016-03-08 株式会社ディスコ 搬送方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009107097A (ja) * 2007-10-31 2009-05-21 Disco Abrasive Syst Ltd 加工装置
JP2012156415A (ja) 2011-01-28 2012-08-16 Lintec Corp 板状部材の支持装置及び支持方法

Also Published As

Publication number Publication date
CN104821288A (zh) 2015-08-05
TW201537664A (zh) 2015-10-01
CN104821288B (zh) 2019-04-19
JP2015142087A (ja) 2015-08-03
KR20150090997A (ko) 2015-08-07
JP6255259B2 (ja) 2017-12-27
TWI611499B (zh) 2018-01-11

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