JP2020061429A5 - - Google Patents

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Publication number
JP2020061429A5
JP2020061429A5 JP2018190723A JP2018190723A JP2020061429A5 JP 2020061429 A5 JP2020061429 A5 JP 2020061429A5 JP 2018190723 A JP2018190723 A JP 2018190723A JP 2018190723 A JP2018190723 A JP 2018190723A JP 2020061429 A5 JP2020061429 A5 JP 2020061429A5
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JP
Japan
Prior art keywords
drive circuit
circuit
voltage
signal processing
semiconductor device
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JP2018190723A
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English (en)
Japanese (ja)
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JP2020061429A (ja
JP7002431B2 (ja
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Priority to JP2018190723A priority Critical patent/JP7002431B2/ja
Priority claimed from JP2018190723A external-priority patent/JP7002431B2/ja
Priority to US16/559,391 priority patent/US10720918B2/en
Priority to CN201910918651.1A priority patent/CN111030431B/zh
Priority to DE102019215250.3A priority patent/DE102019215250A1/de
Publication of JP2020061429A publication Critical patent/JP2020061429A/ja
Publication of JP2020061429A5 publication Critical patent/JP2020061429A5/ja
Application granted granted Critical
Publication of JP7002431B2 publication Critical patent/JP7002431B2/ja
Active legal-status Critical Current
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JP2018190723A 2018-10-09 2018-10-09 半導体装置 Active JP7002431B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018190723A JP7002431B2 (ja) 2018-10-09 2018-10-09 半導体装置
US16/559,391 US10720918B2 (en) 2018-10-09 2019-09-03 Semiconductor device
CN201910918651.1A CN111030431B (zh) 2018-10-09 2019-09-26 半导体装置
DE102019215250.3A DE102019215250A1 (de) 2018-10-09 2019-10-02 Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018190723A JP7002431B2 (ja) 2018-10-09 2018-10-09 半導体装置

Publications (3)

Publication Number Publication Date
JP2020061429A JP2020061429A (ja) 2020-04-16
JP2020061429A5 true JP2020061429A5 (cg-RX-API-DMAC7.html) 2020-12-10
JP7002431B2 JP7002431B2 (ja) 2022-01-20

Family

ID=69886345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018190723A Active JP7002431B2 (ja) 2018-10-09 2018-10-09 半導体装置

Country Status (4)

Country Link
US (1) US10720918B2 (cg-RX-API-DMAC7.html)
JP (1) JP7002431B2 (cg-RX-API-DMAC7.html)
CN (1) CN111030431B (cg-RX-API-DMAC7.html)
DE (1) DE102019215250A1 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3993249A1 (en) * 2020-10-28 2022-05-04 NXP USA, Inc. Advanced power supply to insure safe behavior of an inverter application
JP7444027B2 (ja) * 2020-11-06 2024-03-06 三菱電機株式会社 半導体装置
JP7722648B2 (ja) * 2020-12-04 2025-08-13 国立大学法人 東京大学 半導体装置
JP7578356B2 (ja) * 2021-09-01 2024-11-06 ミネベアパワーデバイス株式会社 駆動回路および電力変換装置
JP2024174702A (ja) * 2023-06-05 2024-12-17 ミネベアパワーデバイス株式会社 駆動回路

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2624809B2 (ja) 1988-12-06 1997-06-25 株式会社東芝 ダブルゲートｉｇｂｔのゲート駆動回路
JP3302725B2 (ja) * 1991-08-26 2002-07-15 株式会社東芝 電力用半導体集積回路装置
DE69332443T2 (de) * 1992-05-01 2003-06-26 Fuji Electric Co., Ltd. Steuervorrichtung für Halbleitervorrichtung mit doppeltem Gate
JPH11205123A (ja) * 1998-01-20 1999-07-30 Toshiba Corp 高耐圧パワー集積回路
WO1999046809A1 (en) 1998-03-09 1999-09-16 Harris Corporation Devices formable by low temperature direct bonding
JP2002100971A (ja) 2000-09-22 2002-04-05 Toshiba Corp ダブルゲートｉｇｂｔの駆動方法
JP3773863B2 (ja) 2001-07-19 2006-05-10 三菱電機株式会社 半導体装置
JP2005340624A (ja) 2004-05-28 2005-12-08 Fuji Electric Device Technology Co Ltd 半導体集積回路装置
JP2006073775A (ja) 2004-09-02 2006-03-16 Matsushita Electric Ind Co Ltd 半導体装置及びそれを用いたモジュール
JP2011182591A (ja) * 2010-03-02 2011-09-15 Panasonic Corp 半導体装置
JP5828093B2 (ja) * 2010-10-25 2015-12-02 パナソニックＩｐマネジメント株式会社 電源装置
WO2014181450A1 (ja) * 2013-05-10 2014-11-13 株式会社 日立製作所 絶縁ゲート型半導体素子の制御装置およびそれを用いた電力変換装置
JP2016039477A (ja) 2014-08-07 2016-03-22 株式会社デンソー 駆動制御装置
WO2016031052A1 (ja) * 2014-08-29 2016-03-03 三菱電機株式会社 半導体装置及び多相用半導体装置
JP6413965B2 (ja) * 2015-07-20 2018-10-31 株式会社デンソー 半導体装置
JP6414090B2 (ja) * 2016-01-27 2018-10-31 株式会社デンソー 半導体装置

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