JP2020031106A - 半導体装置の製造方法及び製造装置 - Google Patents
半導体装置の製造方法及び製造装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 175
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000009966 trimming Methods 0.000 claims abstract description 98
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- 238000000034 method Methods 0.000 claims description 40
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- 235000012431 wafers Nutrition 0.000 abstract description 140
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02016—Backside treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
しかしながら、上記した従来技術には、半導体デバイスウェーハの欠けを抑制する高精度且つ高効率なエッジトリミング工程を実現するために改善すべき問題点があった。
図1は、本発明の実施形態に係る半導体装置の製造装置を示す略図であり、エッジトリミング装置10の概略構成を示す正面図である。図1を参照して、エッジトリミング装置10は、半導体デバイスウェーハ30の周側面33をトリミングする装置である。
図3は、半導体装置の製造方法を示す図であり、図3(a)は、チャッキング工程で半導体デバイスウェーハ30が準備される状態、図3(b)は、エッジトリミング工程でトリミングが行われている状態、図3(c)は、エッジトリミング工程が完了した状態、図3(d)は、薄層化工程で薄層化が行われた状態を示す図である。
次いで、トリミング工程では、半導体デバイスウェーハ30は、超音波が印加され水平回転する回転ブレード17によってトリミングされ、周側面33には、図5(c)に示すように、トリミング面35による凹部が形成される。
10 エッジトリミング装置
11 真空チャック
12 貼り合わせ樹脂層
13 支持基板
14 保護テープ
15 縦型スピンドル
16 超音波発振装置
17 回転ブレード
18 軸受
30 半導体デバイスウェーハ
31 半導体デバイス層
32 デバイス面
33 周側面
34 裏面
35 トリミング面
Claims (6)
- 半導体デバイスウェーハをそのデバイス面を下にしてチャック機構の上面に取り付けるチャッキング工程と、
前記チャッキング工程の後に、前記チャック機構によって前記半導体デバイスウェーハを水平回転させると共に超音波を印加した縦型スピンドルにより回転ブレードを水平回転させて前記半導体デバイスウェーハの周側面を前記回転ブレードでトリミングするエッジトリミング工程と、を具備することを特徴とする半導体装置の製造方法。 - 前記エッジトリミング工程の後に、カップといしを用いた研削法により前記半導体デバイスウェーハの裏面を加工して薄層化する薄層化工程と、を具備することを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記エッジトリミング工程において、前記回転ブレードの外周といし面近傍は、前記半導体デバイスウェーハよりも薄いことを特徴とする請求項1または請求項2に記載の半導体装置の製造方法。
- 半導体デバイスウェーハをそのデバイス面を下にして吸着し水平回転させるチャック機構と、
前記チャック機構に吸着されて水平回転している前記半導体デバイスウェーハの周側面を縦型スピンドルによって水平回転してトリミングする回転ブレードと、
前記縦型スピンドルに超音波を印加する超音波振動装置と、を具備することを特徴とする半導体装置の製造装置。 - 前記チャック機構の上方には、前記回転ブレードでトリミングされた前記半導体デバイスウェーハの裏面を加工して薄層化するカップといしが設けられていることを特徴とする請求項4に記載の半導体装置の製造装置。
- 前記縦型スピンドルは、前記回転ブレードの上方及び下方において軸支されていることを特徴とする請求項4または請求項5に記載の半導体装置の製造装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018154786A JP7258489B2 (ja) | 2018-08-21 | 2018-08-21 | 半導体装置の製造方法及び製造装置 |
CN201910732906.5A CN110856900B (zh) | 2018-08-21 | 2019-08-09 | 半导体装置的制造方法和制造装置 |
KR1020190097061A KR20200021887A (ko) | 2018-08-21 | 2019-08-09 | 반도체 장치의 제조 방법 및 제조 장치 |
US16/541,771 US11735411B2 (en) | 2018-08-21 | 2019-08-15 | Method and apparatus for manufacturing semiconductor device |
TW108129784A TWI804670B (zh) | 2018-08-21 | 2019-08-21 | 半導體裝置的製造方法和製造裝置 |
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JP2018154786A JP7258489B2 (ja) | 2018-08-21 | 2018-08-21 | 半導体装置の製造方法及び製造装置 |
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JP2020031106A true JP2020031106A (ja) | 2020-02-27 |
JP7258489B2 JP7258489B2 (ja) | 2023-04-17 |
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US (1) | US11735411B2 (ja) |
JP (1) | JP7258489B2 (ja) |
KR (1) | KR20200021887A (ja) |
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Cited By (1)
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JP2020078633A (ja) * | 2020-02-27 | 2020-05-28 | 株式会社三洋物産 | 遊技機 |
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CN115256108B (zh) * | 2022-07-12 | 2023-12-19 | 山东润马光能科技有限公司 | 一种浮动式晶圆边缘打磨方法及装置 |
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- 2018-08-21 JP JP2018154786A patent/JP7258489B2/ja active Active
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2019
- 2019-08-09 KR KR1020190097061A patent/KR20200021887A/ko not_active Application Discontinuation
- 2019-08-09 CN CN201910732906.5A patent/CN110856900B/zh active Active
- 2019-08-15 US US16/541,771 patent/US11735411B2/en active Active
- 2019-08-21 TW TW108129784A patent/TWI804670B/zh active
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JP2013102026A (ja) * | 2011-11-08 | 2013-05-23 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2014053350A (ja) * | 2012-09-05 | 2014-03-20 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2017177251A (ja) * | 2016-03-29 | 2017-10-05 | 株式会社東京精密 | 面取り装置及び面取り方法 |
JP2018058129A (ja) * | 2016-10-03 | 2018-04-12 | 株式会社東京精密 | 面取り研削方法及び面取り研削装置 |
JP2018126967A (ja) * | 2017-02-10 | 2018-08-16 | 株式会社高田工業所 | 超音波振動回転切断装置 |
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JP2020078633A (ja) * | 2020-02-27 | 2020-05-28 | 株式会社三洋物産 | 遊技機 |
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