JP2020013977A5 - - Google Patents

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Publication number
JP2020013977A5
JP2020013977A5 JP2019010630A JP2019010630A JP2020013977A5 JP 2020013977 A5 JP2020013977 A5 JP 2020013977A5 JP 2019010630 A JP2019010630 A JP 2019010630A JP 2019010630 A JP2019010630 A JP 2019010630A JP 2020013977 A5 JP2020013977 A5 JP 2020013977A5
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JP
Japan
Prior art keywords
resin layer
circuit board
printed circuit
board according
roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019010630A
Other languages
English (en)
Japanese (ja)
Other versions
JP6938825B2 (ja
JP2020013977A (ja
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Publication date
Priority claimed from KR1020180082454A external-priority patent/KR102214641B1/ko
Application filed filed Critical
Publication of JP2020013977A publication Critical patent/JP2020013977A/ja
Publication of JP2020013977A5 publication Critical patent/JP2020013977A5/ja
Application granted granted Critical
Publication of JP6938825B2 publication Critical patent/JP6938825B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019010630A 2018-07-16 2019-01-24 プリント回路基板 Active JP6938825B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180082454A KR102214641B1 (ko) 2018-07-16 2018-07-16 인쇄회로기판
KR10-2018-0082454 2018-07-16

Publications (3)

Publication Number Publication Date
JP2020013977A JP2020013977A (ja) 2020-01-23
JP2020013977A5 true JP2020013977A5 (https=) 2020-03-05
JP6938825B2 JP6938825B2 (ja) 2021-09-22

Family

ID=69170027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019010630A Active JP6938825B2 (ja) 2018-07-16 2019-01-24 プリント回路基板

Country Status (3)

Country Link
JP (1) JP6938825B2 (https=)
KR (1) KR102214641B1 (https=)
TW (1) TWI731298B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
WO2022024907A1 (ja) * 2020-07-29 2022-02-03 京セラ株式会社 回路基板およびその製造方法
KR102798468B1 (ko) * 2022-09-06 2025-04-23 주식회사 엔트리얼즈 다층 인쇄회로기판 제조방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080043408A (ko) * 1998-12-16 2008-05-16 이비덴 가부시키가이샤 도전성접속핀 및 패키지기판
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
SG163439A1 (en) 2003-04-15 2010-08-30 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP2006191145A (ja) * 2006-03-20 2006-07-20 Kyocera Corp 多層配線基板
KR100752025B1 (ko) * 2006-07-10 2007-08-28 삼성전기주식회사 인쇄회로기판의 제조 방법
KR100815319B1 (ko) * 2006-08-30 2008-03-19 삼성전기주식회사 고밀도 인쇄회로기판 및 그 제조 방법
JP5855905B2 (ja) * 2010-12-16 2016-02-09 日本特殊陶業株式会社 多層配線基板及びその製造方法
KR101180366B1 (ko) * 2011-02-25 2012-09-10 주식회사 심텍 회로기판 및 그 제조방법
WO2014125894A1 (ja) * 2013-02-15 2014-08-21 株式会社村田製作所 積層回路基板
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5658399B1 (ja) * 2014-05-21 2015-01-21 株式会社フジクラ プリント配線板
JP6653466B2 (ja) * 2014-06-05 2020-02-26 パナソニックＩｐマネジメント株式会社 金属箔付き液晶ポリマーフィルムの製造方法、金属箔付き液晶ポリマーフィルム、多層プリント配線板の製造方法
KR102473405B1 (ko) * 2015-10-30 2022-12-02 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20170079574A (ko) * 2015-12-30 2017-07-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2017175649A1 (ja) * 2016-04-05 2017-10-12 株式会社村田製作所 液晶ポリマー片面積層板
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
TWM543773U (zh) * 2017-01-26 2017-06-21 長興材料工業股份有限公司 感光型乾膜
KR102494341B1 (ko) * 2017-11-08 2023-02-01 삼성전기주식회사 인쇄회로기판

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