JP2020013976A5 - - Google Patents

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Publication number
JP2020013976A5
JP2020013976A5 JP2019010618A JP2019010618A JP2020013976A5 JP 2020013976 A5 JP2020013976 A5 JP 2020013976A5 JP 2019010618 A JP2019010618 A JP 2019010618A JP 2019010618 A JP2019010618 A JP 2019010618A JP 2020013976 A5 JP2020013976 A5 JP 2020013976A5
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JP
Japan
Prior art keywords
resin layer
printed circuit
circuit board
board according
via hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019010618A
Other languages
English (en)
Japanese (ja)
Other versions
JP7238241B2 (ja
JP2020013976A (ja
Filing date
Publication date
Priority claimed from KR1020180081253A external-priority patent/KR102158711B1/ko
Application filed filed Critical
Publication of JP2020013976A publication Critical patent/JP2020013976A/ja
Publication of JP2020013976A5 publication Critical patent/JP2020013976A5/ja
Application granted granted Critical
Publication of JP7238241B2 publication Critical patent/JP7238241B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019010618A 2018-07-12 2019-01-24 プリント回路基板 Active JP7238241B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0081253 2018-07-12
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판

Publications (3)

Publication Number Publication Date
JP2020013976A JP2020013976A (ja) 2020-01-23
JP2020013976A5 true JP2020013976A5 (https=) 2020-03-05
JP7238241B2 JP7238241B2 (ja) 2023-03-14

Family

ID=69170021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019010618A Active JP7238241B2 (ja) 2018-07-12 2019-01-24 プリント回路基板

Country Status (3)

Country Link
JP (1) JP7238241B2 (https=)
KR (1) KR102158711B1 (https=)
TW (1) TWI714953B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
WO2022024907A1 (ja) * 2020-07-29 2022-02-03 京セラ株式会社 回路基板およびその製造方法
JP7806387B2 (ja) * 2020-12-01 2026-01-27 味の素株式会社 プリント配線板
WO2022186037A1 (ja) * 2021-03-04 2022-09-09 Tdk株式会社 多層配線基板及びその製造方法
WO2023171351A1 (ja) * 2022-03-07 2023-09-14 株式会社村田製作所 回路基板及び回路基板の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117345A (ja) * 1997-06-19 1999-01-22 Ibiden Co Ltd 多層プリント配線板
MY120077A (en) * 1998-06-26 2005-08-30 Ibiden Co Ltd Multilayer printed wiring board having a roughened inner conductor layer and production method thereof
JP2003258435A (ja) * 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
SG163439A1 (en) 2003-04-15 2010-08-30 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
JP2008103640A (ja) * 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板
WO2009069791A1 (ja) * 2007-11-28 2009-06-04 Kyocera Corporation 配線基板、実装構造体及び配線基板の製造方法
JP5631281B2 (ja) * 2010-08-31 2014-11-26 京セラ株式会社 配線基板の製造方法及びその実装構造体の製造方法
WO2013094606A1 (ja) * 2011-12-22 2013-06-27 太陽インキ製造株式会社 ドライフィルム及びそれを用いたプリント配線板、プリント配線板の製造方法、及びフリップチップ実装基板
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
JP2015195308A (ja) * 2014-03-31 2015-11-05 イビデン株式会社 プリント配線板およびその製造方法
KR101952864B1 (ko) * 2016-09-30 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지

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