JP7238241B2 - プリント回路基板 - Google Patents

プリント回路基板 Download PDF

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Publication number
JP7238241B2
JP7238241B2 JP2019010618A JP2019010618A JP7238241B2 JP 7238241 B2 JP7238241 B2 JP 7238241B2 JP 2019010618 A JP2019010618 A JP 2019010618A JP 2019010618 A JP2019010618 A JP 2019010618A JP 7238241 B2 JP7238241 B2 JP 7238241B2
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Japan
Prior art keywords
resin layer
layer
via hole
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2019010618A
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English (en)
Japanese (ja)
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JP2020013976A5 (https=
JP2020013976A (ja
Inventor
チョイ、ジュン－ウー
ミン、テ－ホン
ジャン、ジュン－ヒョン
ソン、ヨ－ハン
Original Assignee
サムソン エレクトロ－メカニックス カンパニーリミテッド．
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Publication of JP2020013976A publication Critical patent/JP2020013976A/ja
Publication of JP2020013976A5 publication Critical patent/JP2020013976A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2019010618A 2018-07-12 2019-01-24 プリント回路基板 Active JP7238241B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0081253 2018-07-12
KR1020180081253A KR102158711B1 (ko) 2018-07-12 2018-07-12 인쇄회로기판

Publications (3)

Publication Number Publication Date
JP2020013976A JP2020013976A (ja) 2020-01-23
JP2020013976A5 JP2020013976A5 (https=) 2020-03-05
JP7238241B2 true JP7238241B2 (ja) 2023-03-14

Family

ID=69170021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019010618A Active JP7238241B2 (ja) 2018-07-12 2019-01-24 プリント回路基板

Country Status (3)

Country Link
JP (1) JP7238241B2 (https=)
KR (1) KR102158711B1 (https=)
TW (1) TWI714953B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102880997B1 (ko) 2020-03-02 2025-11-04 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 모듈
WO2022024907A1 (ja) * 2020-07-29 2022-02-03 京セラ株式会社 回路基板およびその製造方法
JP7806387B2 (ja) * 2020-12-01 2026-01-27 味の素株式会社 プリント配線板
WO2022186037A1 (ja) * 2021-03-04 2022-09-09 Tdk株式会社 多層配線基板及びその製造方法
WO2023171351A1 (ja) * 2022-03-07 2023-09-14 株式会社村田製作所 回路基板及び回路基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258435A (ja) 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
JP2008103640A (ja) 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117345A (ja) * 1997-06-19 1999-01-22 Ibiden Co Ltd 多層プリント配線板
MY120077A (en) * 1998-06-26 2005-08-30 Ibiden Co Ltd Multilayer printed wiring board having a roughened inner conductor layer and production method thereof
SG163439A1 (en) 2003-04-15 2010-08-30 Denki Kagaku Kogyo Kk Metal base circuit board and its production process
WO2009069791A1 (ja) * 2007-11-28 2009-06-04 Kyocera Corporation 配線基板、実装構造体及び配線基板の製造方法
JP5631281B2 (ja) * 2010-08-31 2014-11-26 京セラ株式会社 配線基板の製造方法及びその実装構造体の製造方法
WO2013094606A1 (ja) * 2011-12-22 2013-06-27 太陽インキ製造株式会社 ドライフィルム及びそれを用いたプリント配線板、プリント配線板の製造方法、及びフリップチップ実装基板
JP2013219204A (ja) * 2012-04-09 2013-10-24 Ngk Spark Plug Co Ltd 配線基板製造用コア基板、配線基板
JP5952100B2 (ja) * 2012-06-15 2016-07-13 旭化成株式会社 硬化性樹脂組成物
JP2015195308A (ja) * 2014-03-31 2015-11-05 イビデン株式会社 プリント配線板およびその製造方法
KR101952864B1 (ko) * 2016-09-30 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258435A (ja) 2002-03-07 2003-09-12 Shinko Electric Ind Co Ltd 配線基板用シート材料及び多層配線基板
JP2008103640A (ja) 2006-10-20 2008-05-01 Ngk Spark Plug Co Ltd 多層配線基板

Also Published As

Publication number Publication date
KR102158711B1 (ko) 2020-09-22
JP2020013976A (ja) 2020-01-23
KR20200007308A (ko) 2020-01-22
TWI714953B (zh) 2021-01-01
TW202007238A (zh) 2020-02-01

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