JP2019533088A5 - - Google Patents
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- Publication number
- JP2019533088A5 JP2019533088A5 JP2019521768A JP2019521768A JP2019533088A5 JP 2019533088 A5 JP2019533088 A5 JP 2019533088A5 JP 2019521768 A JP2019521768 A JP 2019521768A JP 2019521768 A JP2019521768 A JP 2019521768A JP 2019533088 A5 JP2019533088 A5 JP 2019533088A5
- Authority
- JP
- Japan
- Prior art keywords
- tin layer
- nickel
- coating
- coated
- coating method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16195351.8 | 2016-10-24 | ||
| EP16195351 | 2016-10-24 | ||
| PCT/EP2017/077156 WO2018077874A1 (en) | 2016-10-24 | 2017-10-24 | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019533088A JP2019533088A (ja) | 2019-11-14 |
| JP2019533088A5 true JP2019533088A5 (enExample) | 2020-11-19 |
| JP6990240B2 JP6990240B2 (ja) | 2022-01-12 |
Family
ID=57211308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019521768A Expired - Fee Related JP6990240B2 (ja) | 2016-10-24 | 2017-10-24 | 金属基板へのスズ層の被覆方法、および、ニッケル／リン合金下層と、前記方法による前記スズ層と、を備えた構造の使用 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20190271093A1 (enExample) |
| EP (1) | EP3529398B1 (enExample) |
| JP (1) | JP6990240B2 (enExample) |
| KR (1) | KR102404045B1 (enExample) |
| CN (1) | CN109844182A (enExample) |
| MY (1) | MY192687A (enExample) |
| SG (1) | SG11201902595UA (enExample) |
| WO (1) | WO2018077874A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7121881B2 (ja) * | 2017-08-08 | 2022-08-19 | 三菱マテリアル株式会社 | 銀皮膜付端子材及び銀皮膜付端子 |
| MX2021010225A (es) * | 2019-02-25 | 2021-09-21 | Tata Steel Ijmuiden Bv | Metodo para depositar electroliticamente una capa de oxido de cromo. |
| US11306409B2 (en) | 2019-05-23 | 2022-04-19 | Ag-Nano System Llc | Method to enable electroplating of golden silver nanoparticles |
| CA3202631A1 (en) * | 2020-12-17 | 2022-06-23 | George Bokisa | Multilayer corrosion system |
| JP2023075905A (ja) * | 2021-11-19 | 2023-05-31 | 千住金属工業株式会社 | 金属体の形成方法および金属体、ならびにその金属体を備える嵌合型接続端子 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58221291A (ja) * | 1982-06-16 | 1983-12-22 | Furukawa Electric Co Ltd:The | 電気接続用銀被覆銅材料 |
| JPH0790675A (ja) * | 1993-09-21 | 1995-04-04 | Murata Mfg Co Ltd | 電子部品の製造方法 |
| US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| US20020187364A1 (en) * | 2001-03-16 | 2002-12-12 | Shipley Company, L.L.C. | Tin plating |
| US20020185716A1 (en) | 2001-05-11 | 2002-12-12 | Abys Joseph Anthony | Metal article coated with multilayer finish inhibiting whisker growth |
| DE10132478C1 (de) * | 2001-07-03 | 2003-04-30 | Atotech Deutschland Gmbh | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
| JP2005109373A (ja) * | 2003-10-02 | 2005-04-21 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
| JP4894304B2 (ja) * | 2005-03-28 | 2012-03-14 | ソニー株式会社 | 無鉛Ｓｎベースめっき膜及び接続部品の接点構造 |
| WO2007002424A1 (en) | 2005-06-24 | 2007-01-04 | Technic, Inc. | Silver barrier layer to minimize whisker growth in tin electrodeposits |
| JP2007284762A (ja) | 2006-04-18 | 2007-11-01 | Sumitomo Metal Mining Co Ltd | スズめっき皮膜の形成方法および半導体装置 |
| JP4847898B2 (ja) * | 2007-03-07 | 2011-12-28 | 日立電線株式会社 | 配線用導体およびその製造方法 |
| EP2014798B1 (en) | 2007-07-10 | 2016-04-13 | ATOTECH Deutschland GmbH | Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
| JP5086485B1 (ja) | 2011-09-20 | 2012-11-28 | Ｊｘ日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法 |
-
2017
- 2017-10-24 JP JP2019521768A patent/JP6990240B2/ja not_active Expired - Fee Related
- 2017-10-24 US US16/344,031 patent/US20190271093A1/en not_active Abandoned
- 2017-10-24 WO PCT/EP2017/077156 patent/WO2018077874A1/en not_active Ceased
- 2017-10-24 KR KR1020197014365A patent/KR102404045B1/ko active Active
- 2017-10-24 EP EP17787197.7A patent/EP3529398B1/en not_active Not-in-force
- 2017-10-24 MY MYPI2019001970A patent/MY192687A/en unknown
- 2017-10-24 SG SG11201902595UA patent/SG11201902595UA/en unknown
- 2017-10-24 CN CN201780065970.1A patent/CN109844182A/zh active Pending
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