JP2019533088A5 - - Google Patents

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Publication number
JP2019533088A5
JP2019533088A5 JP2019521768A JP2019521768A JP2019533088A5 JP 2019533088 A5 JP2019533088 A5 JP 2019533088A5 JP 2019521768 A JP2019521768 A JP 2019521768A JP 2019521768 A JP2019521768 A JP 2019521768A JP 2019533088 A5 JP2019533088 A5 JP 2019533088A5
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JP
Japan
Prior art keywords
tin layer
nickel
coating
coated
coating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2019521768A
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English (en)
Japanese (ja)
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JP2019533088A (ja
JP6990240B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2017/077156 external-priority patent/WO2018077874A1/en
Publication of JP2019533088A publication Critical patent/JP2019533088A/ja
Publication of JP2019533088A5 publication Critical patent/JP2019533088A5/ja
Application granted granted Critical
Publication of JP6990240B2 publication Critical patent/JP6990240B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019521768A 2016-10-24 2017-10-24 金属基板へのスズ層の被覆方法、および、ニッケル／リン合金下層と、前記方法による前記スズ層と、を備えた構造の使用 Expired - Fee Related JP6990240B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP16195351 2016-10-24
EP16195351.8 2016-10-24
PCT/EP2017/077156 WO2018077874A1 (en) 2016-10-24 2017-10-24 A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method

Publications (3)

Publication Number Publication Date
JP2019533088A JP2019533088A (ja) 2019-11-14
JP2019533088A5 true JP2019533088A5 (enExample) 2020-11-19
JP6990240B2 JP6990240B2 (ja) 2022-01-12

Family

ID=57211308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019521768A Expired - Fee Related JP6990240B2 (ja) 2016-10-24 2017-10-24 金属基板へのスズ層の被覆方法、および、ニッケル／リン合金下層と、前記方法による前記スズ層と、を備えた構造の使用

Country Status (8)

Country Link
US (1) US20190271093A1 (enExample)
EP (1) EP3529398B1 (enExample)
JP (1) JP6990240B2 (enExample)
KR (1) KR102404045B1 (enExample)
CN (1) CN109844182A (enExample)
MY (1) MY192687A (enExample)
SG (1) SG11201902595UA (enExample)
WO (1) WO2018077874A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7121881B2 (ja) * 2017-08-08 2022-08-19 三菱マテリアル株式会社 銀皮膜付端子材及び銀皮膜付端子
CN113597481B (zh) * 2019-02-25 2024-11-15 塔塔钢铁艾默伊登有限责任公司 电解沉积氧化铬层的方法
US11306409B2 (en) 2019-05-23 2022-04-19 Ag-Nano System Llc Method to enable electroplating of golden silver nanoparticles
CA3202631A1 (en) * 2020-12-17 2022-06-23 George Bokisa Multilayer corrosion system
JP2023075905A (ja) * 2021-11-19 2023-05-31 千住金属工業株式会社 金属体の形成方法および金属体、ならびにその金属体を備える嵌合型接続端子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58221291A (ja) * 1982-06-16 1983-12-22 Furukawa Electric Co Ltd:The 電気接続用銀被覆銅材料
JPH0790675A (ja) * 1993-09-21 1995-04-04 Murata Mfg Co Ltd 電子部品の製造方法
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US20020187364A1 (en) * 2001-03-16 2002-12-12 Shipley Company, L.L.C. Tin plating
US20020185716A1 (en) 2001-05-11 2002-12-12 Abys Joseph Anthony Metal article coated with multilayer finish inhibiting whisker growth
DE10132478C1 (de) * 2001-07-03 2003-04-30 Atotech Deutschland Gmbh Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung
JP2005109373A (ja) * 2003-10-02 2005-04-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP4894304B2 (ja) * 2005-03-28 2012-03-14 ソニー株式会社 無鉛Ｓｎベースめっき膜及び接続部品の接点構造
WO2007002424A1 (en) 2005-06-24 2007-01-04 Technic, Inc. Silver barrier layer to minimize whisker growth in tin electrodeposits
JP2007284762A (ja) 2006-04-18 2007-11-01 Sumitomo Metal Mining Co Ltd スズめっき皮膜の形成方法および半導体装置
JP4847898B2 (ja) * 2007-03-07 2011-12-28 日立電線株式会社 配線用導体およびその製造方法
EP2014798B1 (en) 2007-07-10 2016-04-13 ATOTECH Deutschland GmbH Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface
JP5086485B1 (ja) 2011-09-20 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子部品用金属材料及びその製造方法

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