MY192687A - A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method - Google Patents

A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method

Info

Publication number
MY192687A
MY192687A MYPI2019001970A MYPI2019001970A MY192687A MY 192687 A MY192687 A MY 192687A MY PI2019001970 A MYPI2019001970 A MY PI2019001970A MY PI2019001970 A MYPI2019001970 A MY PI2019001970A MY 192687 A MY192687 A MY 192687A
Authority
MY
Malaysia
Prior art keywords
tin layer
depositing
metal substrate
nickel
phosphorous alloy
Prior art date
Application number
MYPI2019001970A
Other languages
English (en)
Inventor
Neoh Din-Ghee
Tan Chee-Chow
Joo Lim Jen
Ruther Robert
Barthelmes Jurgen
Kurtz Olaf
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MY192687A publication Critical patent/MY192687A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Rolls And Other Rotary Bodies (AREA)
MYPI2019001970A 2016-10-24 2017-10-24 A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method MY192687A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16195351 2016-10-24
PCT/EP2017/077156 WO2018077874A1 (en) 2016-10-24 2017-10-24 A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method

Publications (1)

Publication Number Publication Date
MY192687A true MY192687A (en) 2022-09-01

Family

ID=57211308

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019001970A MY192687A (en) 2016-10-24 2017-10-24 A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method

Country Status (8)

Country Link
US (1) US20190271093A1 (enExample)
EP (1) EP3529398B1 (enExample)
JP (1) JP6990240B2 (enExample)
KR (1) KR102404045B1 (enExample)
CN (1) CN109844182A (enExample)
MY (1) MY192687A (enExample)
SG (1) SG11201902595UA (enExample)
WO (1) WO2018077874A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7121881B2 (ja) * 2017-08-08 2022-08-19 三菱マテリアル株式会社 銀皮膜付端子材及び銀皮膜付端子
WO2020173950A1 (en) * 2019-02-25 2020-09-03 Tata Steel Ijmuiden B.V. Method for electrolytically depositing a chromium oxide layer
US11306409B2 (en) 2019-05-23 2022-04-19 Ag-Nano System Llc Method to enable electroplating of golden silver nanoparticles
CA3202631A1 (en) * 2020-12-17 2022-06-23 George Bokisa Multilayer corrosion system
JP2023075905A (ja) * 2021-11-19 2023-05-31 千住金属工業株式会社 金属体の形成方法および金属体、ならびにその金属体を備える嵌合型接続端子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58221291A (ja) * 1982-06-16 1983-12-22 Furukawa Electric Co Ltd:The 電気接続用銀被覆銅材料
JPH0790675A (ja) * 1993-09-21 1995-04-04 Murata Mfg Co Ltd 電子部品の製造方法
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
KR20020073434A (ko) * 2001-03-16 2002-09-26 쉬플리 캄파니, 엘.엘.씨. 주석 도금
US20020185716A1 (en) * 2001-05-11 2002-12-12 Abys Joseph Anthony Metal article coated with multilayer finish inhibiting whisker growth
DE10132478C1 (de) * 2001-07-03 2003-04-30 Atotech Deutschland Gmbh Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung
JP2005109373A (ja) * 2003-10-02 2005-04-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP4894304B2 (ja) * 2005-03-28 2012-03-14 ソニー株式会社 無鉛Ｓｎベースめっき膜及び接続部品の接点構造
US20060292847A1 (en) 2005-06-24 2006-12-28 Schetty Robert A Iii Silver barrier layers to minimize whisker growth in tin electrodeposits
JP2007284762A (ja) 2006-04-18 2007-11-01 Sumitomo Metal Mining Co Ltd スズめっき皮膜の形成方法および半導体装置
JP4847898B2 (ja) * 2007-03-07 2011-12-28 日立電線株式会社 配線用導体およびその製造方法
ES2574561T3 (es) 2007-07-10 2016-06-20 Atotech Deutschland Gmbh Solución y proceso para incrementar la capacidad de soldadura y la resistencia a la corrosión de la superficie de un metal o de una aleación metálica
JP5086485B1 (ja) 2011-09-20 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子部品用金属材料及びその製造方法

Also Published As

Publication number Publication date
US20190271093A1 (en) 2019-09-05
JP2019533088A (ja) 2019-11-14
KR102404045B1 (ko) 2022-05-30
SG11201902595UA (en) 2019-05-30
JP6990240B2 (ja) 2022-01-12
KR20190070958A (ko) 2019-06-21
WO2018077874A1 (en) 2018-05-03
EP3529398A1 (en) 2019-08-28
CN109844182A (zh) 2019-06-04
EP3529398B1 (en) 2022-10-19

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