MY192687A - A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method - Google Patents
A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said methodInfo
- Publication number
- MY192687A MY192687A MYPI2019001970A MYPI2019001970A MY192687A MY 192687 A MY192687 A MY 192687A MY PI2019001970 A MYPI2019001970 A MY PI2019001970A MY PI2019001970 A MYPI2019001970 A MY PI2019001970A MY 192687 A MY192687 A MY 192687A
- Authority
- MY
- Malaysia
- Prior art keywords
- tin layer
- depositing
- metal substrate
- nickel
- phosphorous alloy
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract 6
- 238000000151 deposition Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 5
- 239000002184 metal Substances 0.000 title abstract 4
- 229910052751 metal Inorganic materials 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000000956 alloy Substances 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 title abstract 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052759 nickel Inorganic materials 0.000 title abstract 3
- 238000007747 plating Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Rolls And Other Rotary Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16195351 | 2016-10-24 | ||
| PCT/EP2017/077156 WO2018077874A1 (en) | 2016-10-24 | 2017-10-24 | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY192687A true MY192687A (en) | 2022-09-01 |
Family
ID=57211308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2019001970A MY192687A (en) | 2016-10-24 | 2017-10-24 | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20190271093A1 (enExample) |
| EP (1) | EP3529398B1 (enExample) |
| JP (1) | JP6990240B2 (enExample) |
| KR (1) | KR102404045B1 (enExample) |
| CN (1) | CN109844182A (enExample) |
| MY (1) | MY192687A (enExample) |
| SG (1) | SG11201902595UA (enExample) |
| WO (1) | WO2018077874A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7121881B2 (ja) * | 2017-08-08 | 2022-08-19 | 三菱マテリアル株式会社 | 銀皮膜付端子材及び銀皮膜付端子 |
| MX2021010225A (es) * | 2019-02-25 | 2021-09-21 | Tata Steel Ijmuiden Bv | Metodo para depositar electroliticamente una capa de oxido de cromo. |
| US11306409B2 (en) | 2019-05-23 | 2022-04-19 | Ag-Nano System Llc | Method to enable electroplating of golden silver nanoparticles |
| CA3202631A1 (en) * | 2020-12-17 | 2022-06-23 | George Bokisa | Multilayer corrosion system |
| JP2023075905A (ja) * | 2021-11-19 | 2023-05-31 | 千住金属工業株式会社 | 金属体の形成方法および金属体、ならびにその金属体を備える嵌合型接続端子 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58221291A (ja) * | 1982-06-16 | 1983-12-22 | Furukawa Electric Co Ltd:The | 電気接続用銀被覆銅材料 |
| JPH0790675A (ja) * | 1993-09-21 | 1995-04-04 | Murata Mfg Co Ltd | 電子部品の製造方法 |
| US5750017A (en) * | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| US20020187364A1 (en) * | 2001-03-16 | 2002-12-12 | Shipley Company, L.L.C. | Tin plating |
| US20020185716A1 (en) | 2001-05-11 | 2002-12-12 | Abys Joseph Anthony | Metal article coated with multilayer finish inhibiting whisker growth |
| DE10132478C1 (de) * | 2001-07-03 | 2003-04-30 | Atotech Deutschland Gmbh | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
| JP2005109373A (ja) * | 2003-10-02 | 2005-04-21 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
| JP4894304B2 (ja) * | 2005-03-28 | 2012-03-14 | ソニー株式会社 | 無鉛Ｓｎベースめっき膜及び接続部品の接点構造 |
| WO2007002424A1 (en) | 2005-06-24 | 2007-01-04 | Technic, Inc. | Silver barrier layer to minimize whisker growth in tin electrodeposits |
| JP2007284762A (ja) | 2006-04-18 | 2007-11-01 | Sumitomo Metal Mining Co Ltd | スズめっき皮膜の形成方法および半導体装置 |
| JP4847898B2 (ja) * | 2007-03-07 | 2011-12-28 | 日立電線株式会社 | 配線用導体およびその製造方法 |
| EP2014798B1 (en) | 2007-07-10 | 2016-04-13 | ATOTECH Deutschland GmbH | Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
| JP5086485B1 (ja) | 2011-09-20 | 2012-11-28 | Ｊｘ日鉱日石金属株式会社 | 電子部品用金属材料及びその製造方法 |
-
2017
- 2017-10-24 JP JP2019521768A patent/JP6990240B2/ja not_active Expired - Fee Related
- 2017-10-24 US US16/344,031 patent/US20190271093A1/en not_active Abandoned
- 2017-10-24 WO PCT/EP2017/077156 patent/WO2018077874A1/en not_active Ceased
- 2017-10-24 KR KR1020197014365A patent/KR102404045B1/ko active Active
- 2017-10-24 EP EP17787197.7A patent/EP3529398B1/en not_active Not-in-force
- 2017-10-24 MY MYPI2019001970A patent/MY192687A/en unknown
- 2017-10-24 SG SG11201902595UA patent/SG11201902595UA/en unknown
- 2017-10-24 CN CN201780065970.1A patent/CN109844182A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3529398A1 (en) | 2019-08-28 |
| CN109844182A (zh) | 2019-06-04 |
| JP6990240B2 (ja) | 2022-01-12 |
| WO2018077874A1 (en) | 2018-05-03 |
| JP2019533088A (ja) | 2019-11-14 |
| US20190271093A1 (en) | 2019-09-05 |
| SG11201902595UA (en) | 2019-05-30 |
| EP3529398B1 (en) | 2022-10-19 |
| KR20190070958A (ko) | 2019-06-21 |
| KR102404045B1 (ko) | 2022-05-30 |
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