SG11201909369RA - Electroless plating process - Google Patents
Electroless plating processInfo
- Publication number
- SG11201909369RA SG11201909369RA SG11201909369RA SG11201909369RA SG 11201909369R A SG11201909369R A SG 11201909369RA SG 11201909369R A SG11201909369R A SG 11201909369RA SG 11201909369R A SG11201909369R A SG 11201909369RA
- Authority
- SG
- Singapore
- Prior art keywords
- electroless plating
- film
- plating process
- copper material
- plating method
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
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- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Abstract
ELECTROLESS PLATING PROCESS An object is to provide an electroless plating 5 process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided 10 is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike 15 plating method; and a step of forming the gold film by a reduction-type electroless plating method. Figure 1 20
Applications Claiming Priority (2)
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JP2017126052A JP6466521B2 (en) | 2017-06-28 | 2017-06-28 | Electroless plating process |
PCT/JP2018/023630 WO2019004056A1 (en) | 2017-06-28 | 2018-06-21 | Electroless plating process |
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SG11201909369RA true SG11201909369RA (en) | 2019-11-28 |
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SG11201909369R SG11201909369RA (en) | 2017-06-28 | 2018-06-21 | Electroless plating process |
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US (1) | US20200048773A1 (en) |
EP (1) | EP3647461A4 (en) |
JP (1) | JP6466521B2 (en) |
KR (1) | KR102084905B1 (en) |
CN (1) | CN110325665B (en) |
SG (1) | SG11201909369RA (en) |
TW (1) | TWI668330B (en) |
WO (1) | WO2019004056A1 (en) |
Families Citing this family (5)
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JP6474860B2 (en) * | 2017-06-28 | 2019-02-27 | 小島化学薬品株式会社 | Electroless nickel strike plating solution and method for forming nickel plating film |
US20220389588A1 (en) * | 2019-11-20 | 2022-12-08 | Atotech Deutschland GmbH & Co. KG | Electroless nickel alloy plating baths, a method for deposition of nickel alloys, nickel alloy deposits and uses of such formed nickel alloy deposits |
JP2021110009A (en) * | 2020-01-14 | 2021-08-02 | 小島化学薬品株式会社 | Electroless plating process and two layer plating film |
EP3922753A1 (en) * | 2020-06-10 | 2021-12-15 | ATOTECH Deutschland GmbH | Electroless nickel or cobalt plating solution |
JP6841462B1 (en) * | 2020-07-03 | 2021-03-10 | 奥野製薬工業株式会社 | Catalyst-imparting liquid for electroless plating |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US5235139A (en) * | 1990-09-12 | 1993-08-10 | Macdermid, Incorprated | Method for fabricating printed circuits |
JP3035676B2 (en) * | 1991-10-08 | 2000-04-24 | 奥野製薬工業株式会社 | Method for electroless nickel plating on zinc-aluminum alloy, composition for catalytic treatment, composition for activation treatment, and composition for electroless nickel strike plating |
JP3393190B2 (en) * | 1999-02-22 | 2003-04-07 | 有限会社関東学院大学表面工学研究所 | Method for selectively activating copper pattern and activator used therefor |
CN101151399B (en) * | 2005-04-01 | 2010-12-29 | 日矿金属株式会社 | Plated base material |
JP2007031826A (en) * | 2005-06-23 | 2007-02-08 | Hitachi Chem Co Ltd | Connection terminal and substrate for mounting semiconductor having the same |
JP5526440B2 (en) | 2007-01-17 | 2014-06-18 | 奥野製薬工業株式会社 | Printed wiring board formed using reduced deposition type electroless gold plating solution for palladium film |
JP5573429B2 (en) * | 2009-08-10 | 2014-08-20 | 住友ベークライト株式会社 | Electroless nickel-palladium-gold plating method, plated product, printed wiring board, interposer, and semiconductor device |
KR101310256B1 (en) * | 2011-06-28 | 2013-09-23 | 삼성전기주식회사 | Electroless plated layers of printed circuit board and method for preparing the same |
EP2873752B1 (en) * | 2012-07-13 | 2020-05-20 | Toyo Kohan Co., Ltd. | Electroless gold plating method and gold-plate-coated material |
KR20140035701A (en) * | 2012-09-14 | 2014-03-24 | 삼성전기주식회사 | Method fo forming au thin-film and printed circuit board |
JP6201622B2 (en) * | 2013-10-21 | 2017-09-27 | 日立化成株式会社 | Connection terminal and semiconductor chip mounting board using the same |
JP2015110821A (en) * | 2013-12-06 | 2015-06-18 | 学校法人関東学院 | Forming method of forming nickel layer on surface of aluminium material, forming method of forming nickel layer on surface of aluminum electrode of semiconductor wafer using forming method, and semiconductor wafer substrate obtained using forming method |
US20160230287A1 (en) * | 2014-08-25 | 2016-08-11 | Kojima Chemicals Co., Ltd. | Reductive electroless gold plating solution, and electroless gold plating method using the plating solution |
JP2016160504A (en) * | 2015-03-03 | 2016-09-05 | 学校法人関東学院 | ELECTROLESS Ni/Au PLATED FILM FORMING METHOD, AND ELECTROLESS Ni/Au PLATED FILM OBTAINED BY THE FORMING METHOD |
JP6025899B2 (en) * | 2015-03-30 | 2016-11-16 | 上村工業株式会社 | Electroless nickel plating bath and electroless plating method using the same |
CN105386016B (en) * | 2015-10-21 | 2018-01-19 | 东莞市发斯特精密五金有限公司 | The method of chemical nickel plating method and chemical plating cupro-nickel conducting wire |
-
2017
- 2017-06-28 JP JP2017126052A patent/JP6466521B2/en active Active
-
2018
- 2018-06-21 CN CN201880012615.2A patent/CN110325665B/en active Active
- 2018-06-21 US US16/485,543 patent/US20200048773A1/en active Pending
- 2018-06-21 EP EP18824025.3A patent/EP3647461A4/en active Pending
- 2018-06-21 WO PCT/JP2018/023630 patent/WO2019004056A1/en unknown
- 2018-06-21 SG SG11201909369R patent/SG11201909369RA/en unknown
- 2018-06-21 KR KR1020197024866A patent/KR102084905B1/en active IP Right Grant
- 2018-06-27 TW TW107122017A patent/TWI668330B/en active
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KR20190102097A (en) | 2019-09-02 |
CN110325665B (en) | 2021-02-12 |
EP3647461A1 (en) | 2020-05-06 |
WO2019004056A1 (en) | 2019-01-03 |
TWI668330B (en) | 2019-08-11 |
JP2019007067A (en) | 2019-01-17 |
CN110325665A (en) | 2019-10-11 |
EP3647461A4 (en) | 2021-05-05 |
JP6466521B2 (en) | 2019-02-06 |
US20200048773A1 (en) | 2020-02-13 |
KR102084905B1 (en) | 2020-03-04 |
TW201905239A (en) | 2019-02-01 |
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