IN2012DN00528A - - Google Patents

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Publication number
IN2012DN00528A
IN2012DN00528A IN528DEN2012A IN2012DN00528A IN 2012DN00528 A IN2012DN00528 A IN 2012DN00528A IN 528DEN2012 A IN528DEN2012 A IN 528DEN2012A IN 2012DN00528 A IN2012DN00528 A IN 2012DN00528A
Authority
IN
India
Prior art keywords
substrate
nickel layer
producing
layer
subjecting
Prior art date
Application number
Inventor
Ota Hajime
Konishi Masaya
Yamaguchi Takashi
Original Assignee
Sumitomo Electric Industries
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries, Toyo Kohan Co Ltd filed Critical Sumitomo Electric Industries
Publication of IN2012DN00528A publication Critical patent/IN2012DN00528A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06—Films or wires on bases or cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
    • H10N60/0632—Intermediate layers, e.g. for growth control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)

Abstract

Method of Producing Substrate and Superconducting Wire The present invention relates to a method of producing a substrate, including the steps of preparing a substrate having a nickel layer (3) formed on a copper layer (2) through plating, subjecting the nickel layer (3) to thermal treatment at 800-1000°C, and epitaxial-growing an intermediate layer (4) on the nickel layer (3), after the step of subjecting the nickel layer (3) to thermal treatment. According to the present invention, there can be provided a substrate that allows the orientation and flatness at the surface of a nickel layer (3) to be improved, and a method of producing the substrate.
IN528DEN2012 2009-07-10 2010-10-07 IN2012DN00528A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009163513A JP5096422B2 (en) 2009-07-10 2009-07-10 Substrate and superconducting wire manufacturing method
PCT/JP2010/060102 WO2011004684A1 (en) 2009-07-10 2010-06-15 Method for producing substrate and superconductive wire rod

Publications (1)

Publication Number Publication Date
IN2012DN00528A true IN2012DN00528A (en) 2015-08-21

Family

ID=43429108

Family Applications (1)

Application Number Title Priority Date Filing Date
IN528DEN2012 IN2012DN00528A (en) 2009-07-10 2010-10-07

Country Status (7)

Country Link
US (1) US9306147B2 (en)
EP (1) EP2453446A4 (en)
JP (1) JP5096422B2 (en)
KR (1) KR101685732B1 (en)
CN (1) CN102473488B (en)
IN (1) IN2012DN00528A (en)
WO (1) WO2011004684A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132128A1 (en) * 2011-03-28 2012-10-04 株式会社村田製作所 Detection device, method for producing same, sensor electrode, gap-disposed structure, and detection method using same
JP2013089354A (en) * 2011-10-14 2013-05-13 Sumitomo Electric Ind Ltd Intermediate layer-formed base material for superconducting thin film wiring material, its manufacturing method and superconducting thin film wiring material
US10174420B2 (en) 2013-09-04 2019-01-08 Toyo Kohan Co., Ltd. Method for forming oxide layer, laminated substrate for epitaxial growth, and method for producing the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU1325401A (en) * 1999-07-23 2001-02-13 American Superconductor Corporation Enhanced purity oxide layer formation
KR100352976B1 (en) * 1999-12-24 2002-09-18 한국기계연구원 Electrical Plating Process and Device for Ni Plate Layer Having Biaxial Texture
GB0010494D0 (en) * 2000-04-28 2000-06-14 Isis Innovation Textured metal article
US6500568B1 (en) * 2001-06-06 2002-12-31 3M Innovative Properties Company Biaxially textured metal substrate with palladium layer
EP1419538B1 (en) 2001-07-31 2007-03-07 American Superconductor Corporation Methods and reactors for forming superconductor layers
JP2005001935A (en) 2003-06-11 2005-01-06 Sumitomo Electric Ind Ltd Method for producing oxide thin film
US7816303B2 (en) 2004-10-01 2010-10-19 American Superconductor Corporation Architecture for high temperature superconductor wire
JP5123462B2 (en) * 2004-10-27 2013-01-23 住友電気工業株式会社 Film-forming alignment substrate, superconducting wire, and method for manufacturing film-forming alignment substrate
US7781376B2 (en) 2005-07-29 2010-08-24 American Superconductor Corporation High temperature superconducting wires and coils
JP5156188B2 (en) 2005-12-14 2013-03-06 公益財団法人国際超電導産業技術研究センター Method for manufacturing thick film tape-shaped RE (123) superconductor
US7674751B2 (en) * 2006-01-10 2010-03-09 American Superconductor Corporation Fabrication of sealed high temperature superconductor wires
JP4602911B2 (en) * 2006-01-13 2010-12-22 財団法人国際超電導産業技術研究センター Rare earth tape oxide superconductor
JP5074083B2 (en) 2007-04-17 2012-11-14 中部電力株式会社 Clad-oriented metal substrate for epitaxial thin film formation and manufacturing method thereof
JP5324763B2 (en) * 2007-08-21 2013-10-23 中部電力株式会社 Alignment substrate for epitaxial film formation and surface modification method for alignment substrate for epitaxial film formation
JP5400416B2 (en) * 2009-02-20 2014-01-29 中部電力株式会社 Superconducting wire

Also Published As

Publication number Publication date
WO2011004684A1 (en) 2011-01-13
KR101685732B1 (en) 2016-12-12
EP2453446A1 (en) 2012-05-16
JP5096422B2 (en) 2012-12-12
EP2453446A4 (en) 2015-04-22
JP2011018598A (en) 2011-01-27
KR20120051010A (en) 2012-05-21
CN102473488A (en) 2012-05-23
CN102473488B (en) 2015-05-06
US20120108439A1 (en) 2012-05-03
US9306147B2 (en) 2016-04-05

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