IN2012DN00532A - - Google Patents

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Publication number
IN2012DN00532A
IN2012DN00532A IN532DEN2012A IN2012DN00532A IN 2012DN00532 A IN2012DN00532 A IN 2012DN00532A IN 532DEN2012 A IN532DEN2012 A IN 532DEN2012A IN 2012DN00532 A IN2012DN00532 A IN 2012DN00532A
Authority
IN
India
Prior art keywords
layer
nickel
alloy layer
copper
substrate
Prior art date
Application number
Inventor
Yamaguchi Takashi
Konishi Masaya
Ota Hajime
Original Assignee
Sumitomo Co Ltd
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Co Ltd, Toyo Kohan Co Ltd filed Critical Sumitomo Co Ltd
Publication of IN2012DN00532A publication Critical patent/IN2012DN00532A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
    • H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
    • H01B12/06—Films or wires on bases or cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming superconductor layers
    • H10N60/0576—Processes for depositing or forming superconductor layers characterised by the substrate
    • H10N60/0632—Intermediate layers, e.g. for growth control
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12458—All metal or with adjacent metals having composition, density, or hardness gradient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Abstract

A substrate (1) of the present invention includes a copper layer (2), an alloy layer (3) containing copper and nickel, formed on the copper layer (2), a nickel layer (4) formed on the alloy layer (3), and an intermediate layer (5) formed on the nickel layer (4). The concentration of nickel in the alloy layer (3) at the interface between the alloy layer (3) and the nickel layer (4) is greater than the concentration of nickel in the alloy layer (3) at the interface between the alloy layer (3) and the copper layer (2). According to the present invention, there can be provided a substrate (1) that allows the AC loss of a superconducting wire (7) to be reduced, a method of producing a substrate (1), a superconducting wire (7), and a method of producing a superconducting wire (7).
IN532DEN2012 2009-07-10 2010-07-07 IN2012DN00532A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009163514A JP5356134B2 (en) 2009-07-10 2009-07-10 Substrate, substrate manufacturing method, superconducting wire, and superconducting wire manufacturing method
PCT/JP2010/061540 WO2011004842A1 (en) 2009-07-10 2010-07-07 Substrate, process for production of substrate, electrically super-conductive wire material, and process for production of electrically super-conductive wire material

Publications (1)

Publication Number Publication Date
IN2012DN00532A true IN2012DN00532A (en) 2015-08-21

Family

ID=43429266

Family Applications (1)

Application Number Title Priority Date Filing Date
IN532DEN2012 IN2012DN00532A (en) 2009-07-10 2010-07-07

Country Status (7)

Country Link
US (1) US8912126B2 (en)
EP (1) EP2453447B1 (en)
JP (1) JP5356134B2 (en)
KR (1) KR101680405B1 (en)
CN (1) CN102473487B (en)
IN (1) IN2012DN00532A (en)
WO (1) WO2011004842A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9002424B2 (en) * 2012-04-16 2015-04-07 Furukawa Electric Co., Ltd. Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method
DE112015007114T5 (en) * 2015-11-11 2018-08-02 Sumitomo Electric Industries, Ltd. Superconducting wire
CN112262330A (en) * 2018-03-09 2021-01-22 印度科学研究院 Superconducting block, superconducting nanocrystal, superconducting device, and method thereof
CN110534017B (en) * 2018-12-26 2021-03-26 友达光电股份有限公司 Display panel

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1045483A (en) * 1989-03-09 1990-09-19 日本钢管株式会社 Superconducting article
GB0010494D0 (en) * 2000-04-28 2000-06-14 Isis Innovation Textured metal article
JP2005001935A (en) 2003-06-11 2005-01-06 Sumitomo Electric Ind Ltd Method for producing thin oxide film
JP5123462B2 (en) * 2004-10-27 2013-01-23 住友電気工業株式会社 Film-forming alignment substrate, superconducting wire, and method for manufacturing film-forming alignment substrate
JP5156188B2 (en) * 2005-12-14 2013-03-06 公益財団法人国際超電導産業技術研究センター Method for manufacturing thick film tape-shaped RE (123) superconductor
JP4602911B2 (en) * 2006-01-13 2010-12-22 財団法人国際超電導産業技術研究センター Rare earth tape oxide superconductor
JP5074083B2 (en) 2007-04-17 2012-11-14 中部電力株式会社 Clad-oriented metal substrate for epitaxial thin film formation and manufacturing method thereof
JP5324763B2 (en) 2007-08-21 2013-10-23 中部電力株式会社 Alignment substrate for epitaxial film formation and surface modification method for alignment substrate for epitaxial film formation
JP5400416B2 (en) 2009-02-20 2014-01-29 中部電力株式会社 Superconducting wire

Also Published As

Publication number Publication date
KR101680405B1 (en) 2016-11-28
CN102473487B (en) 2013-10-16
JP5356134B2 (en) 2013-12-04
EP2453447B1 (en) 2017-11-01
EP2453447A4 (en) 2015-04-22
US20120108436A1 (en) 2012-05-03
JP2011018599A (en) 2011-01-27
WO2011004842A1 (en) 2011-01-13
CN102473487A (en) 2012-05-23
KR20120051009A (en) 2012-05-21
EP2453447A1 (en) 2012-05-16
US8912126B2 (en) 2014-12-16

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