SG11201811130YA - Film formation method - Google Patents

Film formation method

Info

Publication number
SG11201811130YA
SG11201811130YA SG11201811130YA SG11201811130YA SG11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA
Authority
SG
Singapore
Prior art keywords
film
film formation
formation method
forming
catalyst
Prior art date
Application number
SG11201811130YA
Inventor
Katsuhisa Tanabe
Tatsushi Someya
Naoshi Nishimura
Tetsuya Sasamura
Eriko FURUYA
Original Assignee
C Uyemura & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura & Co Ltd filed Critical C Uyemura & Co Ltd
Publication of SG11201811130YA publication Critical patent/SG11201811130YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1841—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemically Coating (AREA)

Abstract

U17-015 FILM FORMATION METHOD A film formation method comprises a catalyst film formation step of forming a catalyst film on a surface of a substrate by substitution reduction plating, an intermediate film 5 formation step of forming a palladium plating film on the catalyst film, and a surface film formation step of forming a gold plating film on the palladium plating film.
SG11201811130YA 2016-06-13 2017-04-27 Film formation method SG11201811130YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016116993A JP6329589B2 (en) 2016-06-13 2016-06-13 Film formation method
PCT/JP2017/016793 WO2017217125A1 (en) 2016-06-13 2017-04-27 Film formation method

Publications (1)

Publication Number Publication Date
SG11201811130YA true SG11201811130YA (en) 2019-01-30

Family

ID=60663560

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201811130YA SG11201811130YA (en) 2016-06-13 2017-04-27 Film formation method

Country Status (9)

Country Link
US (1) US10941493B2 (en)
EP (1) EP3470546B1 (en)
JP (1) JP6329589B2 (en)
KR (1) KR102230083B1 (en)
CN (1) CN109312463B (en)
MY (1) MY186814A (en)
SG (1) SG11201811130YA (en)
TW (1) TWI693303B (en)
WO (1) WO2017217125A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6811041B2 (en) * 2016-07-04 2021-01-13 上村工業株式会社 Electroless platinum plating bath
JP6572376B1 (en) 2018-11-30 2019-09-11 上村工業株式会社 Electroless plating bath
JP7285123B2 (en) * 2019-04-10 2023-06-01 上村工業株式会社 Gold plating method and plating film
CN110204885B (en) * 2019-05-24 2021-02-12 合肥安利聚氨酯新材料有限公司 Solvent-free polyurethane resin leather film, preparation method thereof and shoe leather
JP6754151B1 (en) * 2020-02-18 2020-09-09 日本高純度化学株式会社 Plating laminate
JP6754152B1 (en) * 2020-02-18 2020-09-09 日本高純度化学株式会社 Plating laminate
WO2022239017A1 (en) * 2021-05-09 2022-11-17 Prerna Goradia Novel methodology for coating non-conducting articles with broad-spectrum antimicrobial electroless plating layers
TWI824612B (en) * 2022-07-11 2023-12-01 台灣上村股份有限公司 Gold-palladium coating structure and production method thereof
KR102666518B1 (en) * 2023-08-31 2024-05-21 (주)엠케이켐앤텍 Semiconductor package substrate and semiconductor package including the same

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JPH05327187A (en) * 1992-05-18 1993-12-10 Ishihara Chem Co Ltd Printed circuit board and manufacture thereof
JP3345529B2 (en) * 1995-06-20 2002-11-18 日立化成工業株式会社 Wire bonding terminal, method of manufacturing the same, and method of manufacturing semiconductor mounting substrate using the wire bonding terminal
JP3466521B2 (en) * 1999-10-04 2003-11-10 新光電気工業株式会社 Substitution type electroless gold plating solution and electroless gold plating method
DE10048844A1 (en) * 2000-10-02 2002-04-11 Basf Ag Process for the production of platinum metal catalysts
JP3866164B2 (en) 2002-07-05 2007-01-10 京セラ株式会社 Wiring board
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JP2005317729A (en) 2004-04-28 2005-11-10 Hitachi Chem Co Ltd Connection terminal, semiconductor package using the same, and method for manufacturing semiconductor package
KR100688833B1 (en) 2005-10-25 2007-03-02 삼성전기주식회사 Method for plating on printed circuit board and printed circuit board produced therefrom
JP5526459B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526458B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP2008184679A (en) * 2007-01-31 2008-08-14 Okuno Chem Ind Co Ltd Activation composition for electroless palladium plating
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Also Published As

Publication number Publication date
WO2017217125A1 (en) 2017-12-21
KR20190008284A (en) 2019-01-23
EP3470546A4 (en) 2019-05-08
EP3470546A1 (en) 2019-04-17
CN109312463A (en) 2019-02-05
CN109312463B (en) 2021-05-14
KR102230083B1 (en) 2021-03-22
US20190345612A1 (en) 2019-11-14
EP3470546B1 (en) 2021-10-13
TW201819681A (en) 2018-06-01
JP6329589B2 (en) 2018-05-23
TWI693303B (en) 2020-05-11
US10941493B2 (en) 2021-03-09
JP2017222891A (en) 2017-12-21
MY186814A (en) 2021-08-23

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