JP2019532815A5 - - Google Patents
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- Publication number
- JP2019532815A5 JP2019532815A5 JP2019504698A JP2019504698A JP2019532815A5 JP 2019532815 A5 JP2019532815 A5 JP 2019532815A5 JP 2019504698 A JP2019504698 A JP 2019504698A JP 2019504698 A JP2019504698 A JP 2019504698A JP 2019532815 A5 JP2019532815 A5 JP 2019532815A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser pulse
- pulse
- less
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 18
- 230000003746 surface roughness Effects 0.000 claims 6
- 230000001678 irradiating effect Effects 0.000 claims 3
- 238000003754 machining Methods 0.000 claims 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662368053P | 2016-07-28 | 2016-07-28 | |
| US62/368,053 | 2016-07-28 | ||
| PCT/US2017/043229 WO2018022441A1 (en) | 2016-07-28 | 2017-07-21 | Laser processing apparatus and methods of laser-processing workpieces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019532815A JP2019532815A (ja) | 2019-11-14 |
| JP2019532815A5 true JP2019532815A5 (enExample) | 2020-08-06 |
Family
ID=61016598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019504698A Pending JP2019532815A (ja) | 2016-07-28 | 2017-07-21 | レーザ加工装置及びワークピースをレーザ加工する方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3490750A4 (enExample) |
| JP (1) | JP2019532815A (enExample) |
| KR (1) | KR20190025721A (enExample) |
| CN (1) | CN109862991A (enExample) |
| TW (1) | TW201803674A (enExample) |
| WO (1) | WO2018022441A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019183237A1 (en) * | 2018-03-22 | 2019-09-26 | Applied Materials, Inc. | Laser polishing ceramic surfaces of processing components to be used in the manufacturing of semiconductor devices |
| CN112385029B (zh) * | 2018-05-08 | 2025-09-16 | 朗姆研究公司 | 包括带有远心透镜的透镜电路、光束折叠组件或多边形扫描仪的原子层蚀刻和沉积处理系统 |
| EP3774166A4 (en) * | 2018-06-05 | 2022-01-19 | Electro Scientific Industries, Inc. | LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME |
| CN113412453B (zh) * | 2019-02-19 | 2024-12-03 | Asml控股股份有限公司 | 激光粗加工:工程化突节顶部的粗糙度 |
| JP7686413B2 (ja) * | 2021-03-08 | 2025-06-02 | 株式会社東京精密 | シリコンウエハのエッジ品質向上方法 |
| CN113977099B (zh) * | 2021-12-07 | 2023-12-19 | 北京卫星制造厂有限公司 | 一种用于纤维复合材料的超快激光铣方法 |
| TWI826980B (zh) * | 2022-03-25 | 2023-12-21 | 國立陽明交通大學 | 液晶配向電極製作方法及其液晶盒製作方法 |
| CN116786993B (zh) * | 2023-06-20 | 2025-08-22 | 济南邦德激光股份有限公司 | 一种在板材切割过程中实现群组内外膜区分的装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2009514C (en) * | 1990-02-07 | 1995-04-25 | Mahmud U. Islam | Laser rough and finish machining of hard materials |
| JP2005116844A (ja) * | 2003-10-09 | 2005-04-28 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| US20060000814A1 (en) * | 2004-06-30 | 2006-01-05 | Bo Gu | Laser-based method and system for processing targeted surface material and article produced thereby |
| US20060039419A1 (en) * | 2004-08-16 | 2006-02-23 | Tan Deshi | Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths |
| JP2007021527A (ja) * | 2005-07-15 | 2007-02-01 | Matsushita Electric Ind Co Ltd | レーザ加工方法 |
| US9138913B2 (en) * | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| FI20060177L (fi) * | 2006-02-23 | 2007-08-24 | Picodeon Ltd Oy | Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote |
| CN102006964B (zh) * | 2008-03-21 | 2016-05-25 | Imra美国公司 | 基于激光的材料加工方法和系统 |
| GB2459669A (en) * | 2008-04-30 | 2009-11-04 | Xsil Technology Ltd | Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing |
| US20110287217A1 (en) * | 2010-05-21 | 2011-11-24 | Prantik Mazumder | Superoleophobic substrates and methods of forming same |
| JP2012156168A (ja) * | 2011-01-21 | 2012-08-16 | Disco Abrasive Syst Ltd | 分割方法 |
| US8685599B1 (en) * | 2011-02-24 | 2014-04-01 | Sandia Corporation | Method of intrinsic marking |
| US10357850B2 (en) * | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
| JP2016539005A (ja) * | 2013-12-05 | 2016-12-15 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | 粗面を有する基板の内部にマーキングを施すための方法及び装置 |
| US9850160B2 (en) * | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| CN105108343B (zh) * | 2015-09-22 | 2017-08-22 | 武汉金顿激光科技有限公司 | 一种集装箱焊缝的表面处理工艺 |
| CN105468873B (zh) * | 2015-12-24 | 2018-08-14 | 中北大学 | 硅基光波导激光表面光滑化仿真方法 |
-
2017
- 2017-07-21 EP EP17835014.6A patent/EP3490750A4/en not_active Withdrawn
- 2017-07-21 WO PCT/US2017/043229 patent/WO2018022441A1/en not_active Ceased
- 2017-07-21 KR KR1020197004389A patent/KR20190025721A/ko not_active Ceased
- 2017-07-21 JP JP2019504698A patent/JP2019532815A/ja active Pending
- 2017-07-21 CN CN201780054282.5A patent/CN109862991A/zh not_active Withdrawn
- 2017-07-27 TW TW106125299A patent/TW201803674A/zh unknown
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