JP2019532815A - レーザ加工装置及びワークピースをレーザ加工する方法 - Google Patents

レーザ加工装置及びワークピースをレーザ加工する方法 Download PDF

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Publication number
JP2019532815A
JP2019532815A JP2019504698A JP2019504698A JP2019532815A JP 2019532815 A JP2019532815 A JP 2019532815A JP 2019504698 A JP2019504698 A JP 2019504698A JP 2019504698 A JP2019504698 A JP 2019504698A JP 2019532815 A JP2019532815 A JP 2019532815A
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JP
Japan
Prior art keywords
workpiece
pulse
laser
laser pulse
positioner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019504698A
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English (en)
Japanese (ja)
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JP2019532815A5 (enExample
Inventor
フィン，ダラ
カイスリンガー，マイケル
クライネルト，ヤン
リン，ジィビン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Application filed by エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド, エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド filed Critical エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
Publication of JP2019532815A publication Critical patent/JP2019532815A/ja
Publication of JP2019532815A5 publication Critical patent/JP2019532815A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
JP2019504698A 2016-07-28 2017-07-21 レーザ加工装置及びワークピースをレーザ加工する方法 Pending JP2019532815A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
US62/368,053 2016-07-28
PCT/US2017/043229 WO2018022441A1 (en) 2016-07-28 2017-07-21 Laser processing apparatus and methods of laser-processing workpieces

Publications (2)

Publication Number Publication Date
JP2019532815A true JP2019532815A (ja) 2019-11-14
JP2019532815A5 JP2019532815A5 (enExample) 2020-08-06

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019504698A Pending JP2019532815A (ja) 2016-07-28 2017-07-21 レーザ加工装置及びワークピースをレーザ加工する方法

Country Status (6)

Country Link
EP (1) EP3490750A4 (enExample)
JP (1) JP2019532815A (enExample)
KR (1) KR20190025721A (enExample)
CN (1) CN109862991A (enExample)
TW (1) TW201803674A (enExample)
WO (1) WO2018022441A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021518662A (ja) * 2018-03-22 2021-08-02 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体デバイスの製造に使用される加工構成要素のセラミック表面のレーザ研磨
JP2022136730A (ja) * 2021-03-08 2022-09-21 株式会社東京精密 シリコンウエハのエッジ品質向上方法

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CN112385029B (zh) * 2018-05-08 2025-09-16 朗姆研究公司 包括带有远心透镜的透镜电路、光束折叠组件或多边形扫描仪的原子层蚀刻和沉积处理系统
EP3774166A4 (en) * 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
CN113412453B (zh) * 2019-02-19 2024-12-03 Asml控股股份有限公司 激光粗加工：工程化突节顶部的粗糙度
CN113977099B (zh) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 一种用于纤维复合材料的超快激光铣方法
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法
CN116786993B (zh) * 2023-06-20 2025-08-22 济南邦德激光股份有限公司 一种在板材切割过程中实现群组内外膜区分的装置

Citations (4)

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CN101389441A (zh) * 2006-02-23 2009-03-18 皮克迪昂有限公司 塑料基底上的涂层方法和涂覆的塑料产品
JP2011517622A (ja) * 2008-03-21 2011-06-16 イムラ アメリカ インコーポレイテッド レーザベースの材料加工方法及びシステム
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法
JP2013533115A (ja) * 2010-05-21 2013-08-22 コーニング インコーポレイテッド 超疎油性基体およびその形成方法

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CA2009514C (en) * 1990-02-07 1995-04-25 Mahmud U. Islam Laser rough and finish machining of hard materials
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
GB2459669A (en) * 2008-04-30 2009-11-04 Xsil Technology Ltd Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
JP2016539005A (ja) * 2013-12-05 2016-12-15 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 粗面を有する基板の内部にマーキングを施すための方法及び装置
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
CN105108343B (zh) * 2015-09-22 2017-08-22 武汉金顿激光科技有限公司 一种集装箱焊缝的表面处理工艺
CN105468873B (zh) * 2015-12-24 2018-08-14 中北大学 硅基光波导激光表面光滑化仿真方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101389441A (zh) * 2006-02-23 2009-03-18 皮克迪昂有限公司 塑料基底上的涂层方法和涂覆的塑料产品
JP2011517622A (ja) * 2008-03-21 2011-06-16 イムラ アメリカ インコーポレイテッド レーザベースの材料加工方法及びシステム
JP2013533115A (ja) * 2010-05-21 2013-08-22 コーニング インコーポレイテッド 超疎油性基体およびその形成方法
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021518662A (ja) * 2018-03-22 2021-08-02 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体デバイスの製造に使用される加工構成要素のセラミック表面のレーザ研磨
JP2022136730A (ja) * 2021-03-08 2022-09-21 株式会社東京精密 シリコンウエハのエッジ品質向上方法
JP7686413B2 (ja) 2021-03-08 2025-06-02 株式会社東京精密 シリコンウエハのエッジ品質向上方法

Also Published As

Publication number Publication date
EP3490750A1 (en) 2019-06-05
CN109862991A (zh) 2019-06-07
EP3490750A4 (en) 2020-04-29
KR20190025721A (ko) 2019-03-11
TW201803674A (zh) 2018-02-01
WO2018022441A1 (en) 2018-02-01

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