TW201803674A - 雷射處理設備和雷射處理工件的方法 - Google Patents

雷射處理設備和雷射處理工件的方法 Download PDF

Info

Publication number
TW201803674A
TW201803674A TW106125299A TW106125299A TW201803674A TW 201803674 A TW201803674 A TW 201803674A TW 106125299 A TW106125299 A TW 106125299A TW 106125299 A TW106125299 A TW 106125299A TW 201803674 A TW201803674 A TW 201803674A
Authority
TW
Taiwan
Prior art keywords
workpiece
laser
pulse
less
laser pulse
Prior art date
Application number
TW106125299A
Other languages
English (en)
Chinese (zh)
Inventor
達瑞 芬恩
麥可 凱斯林卓
Original Assignee
伊雷克托科學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 伊雷克托科學工業股份有限公司 filed Critical 伊雷克托科學工業股份有限公司
Publication of TW201803674A publication Critical patent/TW201803674A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
TW106125299A 2016-07-28 2017-07-27 雷射處理設備和雷射處理工件的方法 TW201803674A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
US62/368,053 2016-07-28

Publications (1)

Publication Number Publication Date
TW201803674A true TW201803674A (zh) 2018-02-01

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106125299A TW201803674A (zh) 2016-07-28 2017-07-27 雷射處理設備和雷射處理工件的方法

Country Status (6)

Country Link
EP (1) EP3490750A4 (enExample)
JP (1) JP2019532815A (enExample)
KR (1) KR20190025721A (enExample)
CN (1) CN109862991A (enExample)
TW (1) TW201803674A (enExample)
WO (1) WO2018022441A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019183237A1 (en) * 2018-03-22 2019-09-26 Applied Materials, Inc. Laser polishing ceramic surfaces of processing components to be used in the manufacturing of semiconductor devices
CN112385029B (zh) * 2018-05-08 2025-09-16 朗姆研究公司 包括带有远心透镜的透镜电路、光束折叠组件或多边形扫描仪的原子层蚀刻和沉积处理系统
EP3774166A4 (en) * 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
CN113412453B (zh) * 2019-02-19 2024-12-03 Asml控股股份有限公司 激光粗加工：工程化突节顶部的粗糙度
JP7686413B2 (ja) * 2021-03-08 2025-06-02 株式会社東京精密 シリコンウエハのエッジ品質向上方法
CN113977099B (zh) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 一种用于纤维复合材料的超快激光铣方法
CN116786993B (zh) * 2023-06-20 2025-08-22 济南邦德激光股份有限公司 一种在板材切割过程中实现群组内外膜区分的装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2009514C (en) * 1990-02-07 1995-04-25 Mahmud U. Islam Laser rough and finish machining of hard materials
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
FI20060177L (fi) * 2006-02-23 2007-08-24 Picodeon Ltd Oy Menetelmä tuottaa hyvälaatuisia pintoja ja hyvälaatuisen pinnan omaava tuote
CN102006964B (zh) * 2008-03-21 2016-05-25 Imra美国公司 基于激光的材料加工方法和系统
GB2459669A (en) * 2008-04-30 2009-11-04 Xsil Technology Ltd Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing
US20110287217A1 (en) * 2010-05-21 2011-11-24 Prantik Mazumder Superoleophobic substrates and methods of forming same
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
JP2016539005A (ja) * 2013-12-05 2016-12-15 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 粗面を有する基板の内部にマーキングを施すための方法及び装置
US9850160B2 (en) * 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
CN105108343B (zh) * 2015-09-22 2017-08-22 武汉金顿激光科技有限公司 一种集装箱焊缝的表面处理工艺
CN105468873B (zh) * 2015-12-24 2018-08-14 中北大学 硅基光波导激光表面光滑化仿真方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法

Also Published As

Publication number Publication date
EP3490750A1 (en) 2019-06-05
CN109862991A (zh) 2019-06-07
JP2019532815A (ja) 2019-11-14
EP3490750A4 (en) 2020-04-29
KR20190025721A (ko) 2019-03-11
WO2018022441A1 (en) 2018-02-01

Similar Documents

Publication Publication Date Title
JP7404316B2 (ja) レーザ処理装置、ワークピースをレーザ処理する方法及び関連する構成
TW201803674A (zh) 雷射處理設備和雷射處理工件的方法
TWI774721B (zh) 用於延長雷射處理設備中的光學器件生命期的方法和系統
Adelmann et al. Rapid micro hole laser drilling in ceramic substrates using single mode fiber laser
TWI886129B (zh) 雷射加工設備、其操作方法以及使用該雷射加工設備加工工件的方法
JP6220775B2 (ja) ピコ秒レーザパルスを用いた高いパルス繰り返し周波数でのレーザダイレクトアブレーション
TWI647187B (zh) 自載體分離玻璃片的方法
KR20120098869A (ko) 레이저 가공과 스크라이빙 시스템 및 방법
US20210331273A1 (en) Laser processing apparatus and methods of laser-processing workpieces
Lott et al. Enhanced drilling of transparent materials with ultrashort pulses