CN109862991A - 镭射处理设备和镭射处理工件的方法 - Google Patents

镭射处理设备和镭射处理工件的方法 Download PDF

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Publication number
CN109862991A
CN109862991A CN201780054282.5A CN201780054282A CN109862991A CN 109862991 A CN109862991 A CN 109862991A CN 201780054282 A CN201780054282 A CN 201780054282A CN 109862991 A CN109862991 A CN 109862991A
Authority
CN
China
Prior art keywords
workpiece
laser pulse
radium
shine
pulse
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201780054282.5A
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English (en)
Chinese (zh)
Inventor
达瑞·芬恩
麦可·凯斯林卓
杰恩·克雷能特
林智斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electro Scientific Industries Inc
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of CN109862991A publication Critical patent/CN109862991A/zh
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
CN201780054282.5A 2016-07-28 2017-07-21 镭射处理设备和镭射处理工件的方法 Withdrawn CN109862991A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662368053P 2016-07-28 2016-07-28
US62/368,053 2016-07-28
PCT/US2017/043229 WO2018022441A1 (en) 2016-07-28 2017-07-21 Laser processing apparatus and methods of laser-processing workpieces

Publications (1)

Publication Number Publication Date
CN109862991A true CN109862991A (zh) 2019-06-07

Family

ID=61016598

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780054282.5A Withdrawn CN109862991A (zh) 2016-07-28 2017-07-21 镭射处理设备和镭射处理工件的方法

Country Status (6)

Country Link
EP (1) EP3490750A4 (enExample)
JP (1) JP2019532815A (enExample)
KR (1) KR20190025721A (enExample)
CN (1) CN109862991A (enExample)
TW (1) TW201803674A (enExample)
WO (1) WO2018022441A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116786993A (zh) * 2023-06-20 2023-09-22 济南邦德激光股份有限公司 一种在板材切割过程中实现群组内外膜区分的装置

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US20190291214A1 (en) * 2018-03-22 2019-09-26 Applied Materials, Inc. Laser polishing ceramic surfaces of processing components to be used in the manufacturing of semiconductor devices
KR102823628B1 (ko) * 2018-05-08 2025-06-20 램 리써치 코포레이션 텔레센트릭 (tele-centric) 렌즈, 광학 빔 폴딩 어셈블리, 또는 다각형 스캐너를 갖는 렌즈 회로를 포함하는 원자 층 에칭 및 증착 프로세싱 시스템들
CN116275467A (zh) * 2018-06-05 2023-06-23 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法以及使用其加工工件的方法
NL2024815A (en) * 2019-02-19 2020-08-27 Asml Holding Nv Laser roughening: engineering the roughness of the burl top
JP7686413B2 (ja) * 2021-03-08 2025-06-02 株式会社東京精密 シリコンウエハのエッジ品質向上方法
CN113977099B (zh) * 2021-12-07 2023-12-19 北京卫星制造厂有限公司 一种用于纤维复合材料的超快激光铣方法
TWI826980B (zh) * 2022-03-25 2023-12-21 國立陽明交通大學 液晶配向電極製作方法及其液晶盒製作方法

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CN101389441A (zh) * 2006-02-23 2009-03-18 皮克迪昂有限公司 塑料基底上的涂层方法和涂覆的塑料产品
CN101965242A (zh) * 2008-03-07 2011-02-02 Imra美国公司 利用超短脉冲激光的透明材料加工
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US20150232369A1 (en) * 2013-12-17 2015-08-20 Corning Incorporated Laser cutting of display glass compositions
CN105108343A (zh) * 2015-09-22 2015-12-02 武汉金顿激光科技有限公司 一种焊缝的表面处理工艺
CN105468873A (zh) * 2015-12-24 2016-04-06 中北大学 硅基光波导激光表面光滑化仿真方法

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CA2009514C (en) * 1990-02-07 1995-04-25 Mahmud U. Islam Laser rough and finish machining of hard materials
JP2005116844A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US20060000814A1 (en) * 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US20060039419A1 (en) * 2004-08-16 2006-02-23 Tan Deshi Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths
JP2007021527A (ja) * 2005-07-15 2007-02-01 Matsushita Electric Ind Co Ltd レーザ加工方法
CN105583526B (zh) * 2008-03-21 2018-08-17 Imra美国公司 基于激光的材料加工方法和系统
GB2459669A (en) * 2008-04-30 2009-11-04 Xsil Technology Ltd Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing
US20110287217A1 (en) * 2010-05-21 2011-11-24 Prantik Mazumder Superoleophobic substrates and methods of forming same
JP2012156168A (ja) * 2011-01-21 2012-08-16 Disco Abrasive Syst Ltd 分割方法
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20160093593A (ko) * 2013-12-05 2016-08-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 거친 표면을 가진 기판을 내부적으로 마킹하는 방법 및 장치

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Publication number Priority date Publication date Assignee Title
CN101389441A (zh) * 2006-02-23 2009-03-18 皮克迪昂有限公司 塑料基底上的涂层方法和涂覆的塑料产品
CN101965242A (zh) * 2008-03-07 2011-02-02 Imra美国公司 利用超短脉冲激光的透明材料加工
US8685599B1 (en) * 2011-02-24 2014-04-01 Sandia Corporation Method of intrinsic marking
US20150232369A1 (en) * 2013-12-17 2015-08-20 Corning Incorporated Laser cutting of display glass compositions
CN105108343A (zh) * 2015-09-22 2015-12-02 武汉金顿激光科技有限公司 一种焊缝的表面处理工艺
CN105468873A (zh) * 2015-12-24 2016-04-06 中北大学 硅基光波导激光表面光滑化仿真方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116786993A (zh) * 2023-06-20 2023-09-22 济南邦德激光股份有限公司 一种在板材切割过程中实现群组内外膜区分的装置

Also Published As

Publication number Publication date
EP3490750A4 (en) 2020-04-29
EP3490750A1 (en) 2019-06-05
JP2019532815A (ja) 2019-11-14
WO2018022441A1 (en) 2018-02-01
TW201803674A (zh) 2018-02-01
KR20190025721A (ko) 2019-03-11

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Application publication date: 20190607

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