JP2019532815A5

JP2019532815A5 -

Info

Publication number: JP2019532815A5
Application number: JP2019504698A
Authority: JP
Filing date: 2017-07-21
Publication date: 2020-08-06

Description

一般的に、第２のポジショナ108がビーム軸を移動して、プロセススポットを位置決め（これにより第２のスキャニング範囲内で第１のスキャニング範囲をスキャン）できる帯域幅（すなわち第２の位置決め帯域幅）は、第１の位置決め帯域幅よりも狭い。一実施形態においては、第２の位置決め帯域幅は、900Hzから５kHzの範囲にある。他の実施形態においては、第１の位置決め帯域幅は、２kHzから３kHz（例えば約2.5kHz）の範囲にある。例えば、第２のポジショナ108は、２つのガルバノメータミラーコンポーネントを含むガルバノメータミラーシステムとして提供される。１つのガルバノメータミラーコンポーネントは、ワークピース102に対してＸ方向に沿ってビーム軸を移動するように構成されており、他のガルバノメータミラーコンポーネントは、ワークピース102に対してＹ方向に沿ってビーム軸を移動するように構成されている。しかしながら、他の実施形態においては、第２のポジショナ108は、回転多面鏡システムなどとして提供されてもよい。このように、第２のポジショナ108及び第１のポジショナ106の特定の構成によっては、第２の位置決め帯域幅が第１の位置決め帯域幅以上であってもよいことは理解されよう。

In general, a bandwidth (ie, a second positioning bandwidth) that allows the second positioner 108 to move the beam axis to position the process spot (and thereby scan the first scanning range within the second scanning range). ) Is narrower than the first positioning bandwidth. In one embodiment, the second positioning bandwidth is in the range 900Hz to 5kHz. In other embodiments, the first positioning bandwidth is in the range of 2kHz to 3kHz (eg, about 2.5kHz). For example, the second positioner 108 is provided as a galvanometer mirror system that includes two galvanometer mirror components. One galvanometer mirror component is configured to move the beam axis along the X direction relative to the workpiece 102, and the other galvanometer mirror component is configured to move the beam axis along the Y direction relative to the workpiece 102. Is configured to move. However, in other embodiments, the second positioner 108 may be provided as a rotating polygon mirror system or the like. Thus, it will be appreciated that the second positioning bandwidth may be greater than or equal to the first positioning bandwidth, depending on the particular configuration of the second positioner 108 and the first positioner 106.

Claims

Producing a first laser pulse beam having a pulse duration of less than 200 ps, a spot size and a pulse energy at a pulse repetition rate higher than 500 kHz,
Irradiating the first laser pulse beam along a beam axis that intersects a workpiece having a first surface and a second surface opposite the first surface ,
Scanning the beam axis along a machining trajectory such that a continuously emitted laser pulse impinges on the workpiece with a non-zero bite size to form a feature on the first surface of the workpiece. Is characterized as having a processed workpiece surface with an average surface roughness (Ra) of less than 1.0 μm,
Method.

The method of claim 1, wherein the pulse duration is 1 ps or less.

The method of claim 2 , wherein the pulse duration is 800 fs or less.

Method according to any of claims 1 to 3, wherein the pulse repetition rate is higher than 1264kHz.

The method of claim 4 , wherein the pulse repetition rate is 1800 kHz or higher.

The method of claim 5 , wherein the pulse repetition rate is 1900 kHz or higher.

7. The method of claim 6 , wherein the pulse repetition rate is 2000 kHz or higher.

8. The method of claim 7 , wherein the pulse repetition rate is 3000 kHz or higher.

9. The method according to claim 1, wherein the average surface roughness (Ra) is less than 0.75 μm.

The method of claim 9 , wherein the average surface roughness (Ra) is less than 0.5 μm.

11. The method of claim 10 , wherein the average surface roughness (Ra) is less than 0.4 μm.

The method of claim 11 , wherein the average surface roughness (Ra) is less than 0.3 μm.

13. The method of claim 12 , wherein the average surface roughness (Ra) is less than 0.25 μm.

further,
Generate a second laser pulse beam,
Focusing the laser pulse in the second laser pulse beam to produce a beam waist,
Along the beam axis intersecting the focused second laser pulse beam with the machined workpiece surface such that the beam waist is located within the workpiece or on the second surface of the workpiece. Irradiate
Processing the workpiece with the beam waist,
The method according to any one of claims 1 to 13.

15. The workpiece of claim 14, wherein the workpiece is more transparent to wavelengths of laser pulses in the second laser pulse beam than to wavelengths of laser pulses in the first laser pulse beam. Method.

Irradiating a first laser pulse beam along a beam axis that intersects a workpiece having a first surface and a second surface opposite the first surface,
Scanning the beam axis along a machining trajectory such that a continuously radiated laser pulse hits the workpiece at a non-zero bite size to form a feature on the first surface of the workpiece, the feature , Characterized as having a machined workpiece surface,
Irradiating a second laser pulse beam along a beam axis that intersects the machined workpiece surface to focus the laser pulses in the second laser pulse beam into or within the workpiece. Forming a beam waist on the second surface,
Processing the workpiece with the beam waist,
Method.

17. The workpiece of claim 16, wherein the workpiece is more transparent to the wavelength of laser pulses in the second laser pulse beam than to the wavelength of laser pulses in the first laser pulse beam. Method.