JP2019527468A5 - - Google Patents
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- Publication number
- JP2019527468A5 JP2019527468A5 JP2018567886A JP2018567886A JP2019527468A5 JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5 JP 2018567886 A JP2018567886 A JP 2018567886A JP 2018567886 A JP2018567886 A JP 2018567886A JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing composition
- compounds
- cobalt
- oxidizing agent
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 44
- 239000000203 mixture Substances 0.000 claims 39
- -1 hydroxylamine compound Chemical class 0.000 claims 22
- 238000000034 method Methods 0.000 claims 19
- 229910017052 cobalt Inorganic materials 0.000 claims 16
- 239000010941 cobalt Substances 0.000 claims 16
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 16
- 239000007800 oxidant agent Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 8
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 claims 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 150000001412 amines Chemical class 0.000 claims 4
- 238000005260 corrosion Methods 0.000 claims 4
- 230000007797 corrosion Effects 0.000 claims 4
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 claims 4
- 125000000623 heterocyclic group Chemical group 0.000 claims 4
- 239000003112 inhibitor Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 239000006061 abrasive grain Substances 0.000 claims 3
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims 2
- QZTKDVCDBIDYMD-UHFFFAOYSA-N 2,2'-[(2-amino-2-oxoethyl)imino]diacetic acid Chemical compound NC(=O)CN(CC(O)=O)CC(O)=O QZTKDVCDBIDYMD-UHFFFAOYSA-N 0.000 claims 2
- JKMHFZQWWAIEOD-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperazin-1-yl]ethanesulfonic acid Chemical compound OCC[NH+]1CCN(CCS([O-])(=O)=O)CC1 JKMHFZQWWAIEOD-UHFFFAOYSA-N 0.000 claims 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 2
- 239000004471 Glycine Substances 0.000 claims 2
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims 2
- 150000003973 alkyl amines Chemical class 0.000 claims 2
- 150000001413 amino acids Chemical class 0.000 claims 2
- 125000004408 aryl N-oxide group Chemical group 0.000 claims 2
- 239000007998 bicine buffer Substances 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical group OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M nitrite group Chemical group N(=O)[O-] IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims 2
- 150000002826 nitrites Chemical class 0.000 claims 2
- 150000002828 nitro derivatives Chemical class 0.000 claims 2
- 150000002832 nitroso derivatives Chemical class 0.000 claims 2
- 229940081066 picolinic acid Drugs 0.000 claims 2
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 150000003628 tricarboxylic acids Chemical class 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022064299A JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662362222P | 2016-07-14 | 2016-07-14 | |
| US62/362,222 | 2016-07-14 | ||
| PCT/US2017/041988 WO2018013847A1 (en) | 2016-07-14 | 2017-07-13 | Alternative oxidizing agents for cobalt cmp |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Division JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019527468A JP2019527468A (ja) | 2019-09-26 |
| JP2019527468A5 true JP2019527468A5 (enExample) | 2020-08-06 |
| JP7253924B2 JP7253924B2 (ja) | 2023-04-07 |
Family
ID=60942463
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018567886A Active JP7253924B2 (ja) | 2016-07-14 | 2017-07-13 | コバルトｃｍｐ用の代替的な酸化剤 |
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11851584B2 (enExample) |
| EP (1) | EP3484971B1 (enExample) |
| JP (2) | JP7253924B2 (enExample) |
| KR (3) | KR20190018751A (enExample) |
| CN (1) | CN109415599B (enExample) |
| TW (1) | TWI660017B (enExample) |
| WO (1) | WO2018013847A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7326048B2 (ja) * | 2018-09-28 | 2023-08-15 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| US11814547B2 (en) * | 2018-09-28 | 2023-11-14 | Kao Corporation | Polishing liquid composition for silicon oxide film |
| WO2021076352A1 (en) * | 2019-10-15 | 2021-04-22 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
| JP7803675B2 (ja) * | 2020-10-05 | 2026-01-21 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| JP3507628B2 (ja) * | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
| CN100378145C (zh) * | 2001-06-21 | 2008-04-02 | 花王株式会社 | 研磨液组合物 |
| US6692546B2 (en) | 2001-08-14 | 2004-02-17 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US7029373B2 (en) | 2001-08-14 | 2006-04-18 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| IL154782A0 (en) * | 2003-03-06 | 2003-10-31 | J G Systems Inc | Chemical-mechanical polishing composition containing organic nitro compounds |
| US7736405B2 (en) | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
| JP2005056879A (ja) | 2003-08-01 | 2005-03-03 | Tosoh Corp | 銅系金属用研磨液及び研磨方法 |
| JP2008546214A (ja) * | 2005-06-06 | 2008-12-18 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | 集積された化学機械研磨組成物および単一プラテン処理のためのプロセス |
| TW200714696A (en) | 2005-08-05 | 2007-04-16 | Advanced Tech Materials | High throughput chemical mechanical polishing composition for metal film planarization |
| EP1932174A4 (en) * | 2005-10-05 | 2009-09-23 | Advanced Tech Materials | OXIDIZING AQUEOUS CLEANSER FOR REMOVING NIGHT REST |
| US7732393B2 (en) | 2006-03-20 | 2010-06-08 | Cabot Microelectronics Corporation | Oxidation-stabilized CMP compositions and methods |
| US9028572B2 (en) | 2007-09-21 | 2015-05-12 | Cabot Microelectronics Corporation | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
| SG11201404930SA (en) | 2012-02-15 | 2014-09-26 | Advanced Tech Materials | Post-cmp removal using compositions and method of use |
| US8999193B2 (en) * | 2012-05-10 | 2015-04-07 | Air Products And Chemicals, Inc. | Chemical mechanical polishing composition having chemical additives and methods for using same |
| US10217645B2 (en) * | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
| US9735030B2 (en) * | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
| US9944828B2 (en) * | 2014-10-21 | 2018-04-17 | Cabot Microelectronics Corporation | Slurry for chemical mechanical polishing of cobalt |
| US10124464B2 (en) | 2014-10-21 | 2018-11-13 | Cabot Microelectronics Corporation | Corrosion inhibitors and related compositions and methods |
| KR102525356B1 (ko) | 2014-10-21 | 2023-04-25 | 씨엠씨 머티리얼즈, 인코포레이티드 | 코발트 파임 제어제 |
| US9688885B2 (en) | 2014-10-21 | 2017-06-27 | Cabot Microelectronics Corporation | Cobalt polishing accelerators |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| US9528030B1 (en) * | 2015-10-21 | 2016-12-27 | Cabot Microelectronics Corporation | Cobalt inhibitor combination for improved dishing |
-
2017
- 2017-07-12 TW TW106123275A patent/TWI660017B/zh active
- 2017-07-13 JP JP2018567886A patent/JP7253924B2/ja active Active
- 2017-07-13 EP EP17828487.3A patent/EP3484971B1/en active Active
- 2017-07-13 KR KR1020197004126A patent/KR20190018751A/ko not_active Ceased
- 2017-07-13 KR KR1020247040827A patent/KR20250005498A/ko active Pending
- 2017-07-13 WO PCT/US2017/041988 patent/WO2018013847A1/en not_active Ceased
- 2017-07-13 CN CN201780041554.8A patent/CN109415599B/zh active Active
- 2017-07-13 US US15/649,378 patent/US11851584B2/en active Active
- 2017-07-13 KR KR1020237002200A patent/KR20230014887A/ko not_active Ceased
-
2022
- 2022-04-08 JP JP2022064299A patent/JP2022097502A/ja not_active Withdrawn
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