JP2017538285A5 - - Google Patents
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- Publication number
- JP2017538285A5 JP2017538285A5 JP2017519258A JP2017519258A JP2017538285A5 JP 2017538285 A5 JP2017538285 A5 JP 2017538285A5 JP 2017519258 A JP2017519258 A JP 2017519258A JP 2017519258 A JP2017519258 A JP 2017519258A JP 2017538285 A5 JP2017538285 A5 JP 2017538285A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing composition
- cobalt
- amino
- substituted
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 54
- 239000000203 mixture Substances 0.000 claims description 44
- 229910017052 cobalt Inorganic materials 0.000 claims description 37
- 239000010941 cobalt Substances 0.000 claims description 37
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 37
- 229910052739 hydrogen Inorganic materials 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 16
- 238000005260 corrosion Methods 0.000 claims description 15
- 230000007797 corrosion Effects 0.000 claims description 15
- 239000003112 inhibitor Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 125000004181 carboxyalkyl group Chemical group 0.000 claims description 14
- 150000002391 heterocyclic compounds Chemical class 0.000 claims description 14
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 14
- 150000002431 hydrogen Chemical class 0.000 claims description 13
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- 239000007800 oxidant agent Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 150000001413 amino acids Chemical class 0.000 claims description 7
- -1 hydrogen Compound Chemical class 0.000 claims description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 125000005097 aminocarbonylalkyl group Chemical group 0.000 claims description 6
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 claims description 6
- 230000001590 oxidative effect Effects 0.000 claims description 6
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims description 6
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- AWEZYTUWDZADKR-UHFFFAOYSA-N 2-[(2-amino-2-oxoethyl)azaniumyl]acetate Chemical compound NC(=O)CNCC(O)=O AWEZYTUWDZADKR-UHFFFAOYSA-N 0.000 claims description 3
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 claims description 3
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 claims description 3
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 claims description 3
- 239000004472 Lysine Substances 0.000 claims description 3
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 claims description 3
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims description 3
- 125000000129 anionic group Chemical group 0.000 claims description 3
- 239000007998 bicine buffer Substances 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 claims description 3
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical group OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 3
- 229940081066 picolinic acid Drugs 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 125000004415 heterocyclylalkyl group Chemical group 0.000 description 3
- 125000000547 substituted alkyl group Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462066484P | 2014-10-21 | 2014-10-21 | |
| US62/066,484 | 2014-10-21 | ||
| US201562197992P | 2015-07-28 | 2015-07-28 | |
| US62/197,992 | 2015-07-28 | ||
| PCT/US2015/056749 WO2016065060A1 (en) | 2014-10-21 | 2015-10-21 | Cobalt polishing accelerators |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017538285A JP2017538285A (ja) | 2017-12-21 |
| JP2017538285A5 true JP2017538285A5 (enExample) | 2018-11-15 |
| JP6646051B2 JP6646051B2 (ja) | 2020-02-14 |
Family
ID=55761505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017519258A Active JP6646051B2 (ja) | 2014-10-21 | 2015-10-21 | コバルト研磨促進剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US9688885B2 (enExample) |
| EP (1) | EP3210238B1 (enExample) |
| JP (1) | JP6646051B2 (enExample) |
| KR (1) | KR102538575B1 (enExample) |
| CN (1) | CN107148457B (enExample) |
| TW (1) | TWI580767B (enExample) |
| WO (1) | WO2016065060A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9528030B1 (en) * | 2015-10-21 | 2016-12-27 | Cabot Microelectronics Corporation | Cobalt inhibitor combination for improved dishing |
| TWI660017B (zh) | 2016-07-14 | 2019-05-21 | 卡博特微電子公司 | 用於鈷化學機械拋光(cmp)之替代氧化劑 |
| US10233356B2 (en) | 2017-03-06 | 2019-03-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing slurry for cobalt-containing substrate |
| US10077382B1 (en) | 2017-03-06 | 2018-09-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for polishing cobalt-containing substrate |
| JP6901297B2 (ja) * | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2018217628A1 (en) * | 2017-05-25 | 2018-11-29 | Fujifilm Planar Solutions, LLC | Chemical mechanical polishing slurry for cobalt applications |
| US10377921B2 (en) | 2017-09-21 | 2019-08-13 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | Chemical mechanical polishing method for cobalt |
| US10170335B1 (en) | 2017-09-21 | 2019-01-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for cobalt |
| US20200172759A1 (en) * | 2018-12-04 | 2020-06-04 | Cabot Microelectronics Corporation | Composition and method for cobalt cmp |
| JP7244642B2 (ja) * | 2019-06-20 | 2023-03-22 | 富士フイルム株式会社 | 研磨液、及び、化学的機械的研磨方法 |
| JP7729812B2 (ja) | 2019-10-15 | 2025-08-26 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 研磨組成物およびその使用方法 |
| EP4087904A4 (en) | 2020-01-07 | 2023-12-06 | CMC Materials, Inc. | Derivatized polyamino acids |
| EP4288498A4 (en) * | 2021-02-04 | 2024-12-11 | CMC Materials, Inc. | SILICON CARBONITRIDE POLISHING COMPOSITION AND METHOD |
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| US4711735A (en) | 1986-09-12 | 1987-12-08 | Gulley Harold J | Coolant additive with corrosion inhibitive and scale preventative properties |
| US5230833A (en) | 1989-06-09 | 1993-07-27 | Nalco Chemical Company | Low sodium, low metals silica polishing slurries |
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US5316573A (en) | 1992-03-12 | 1994-05-31 | International Business Machines Corporation | Corrosion inhibition with CU-BTA |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
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| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| JP3329572B2 (ja) | 1994-04-15 | 2002-09-30 | 福田金属箔粉工業株式会社 | 印刷回路用銅箔およびその表面処理方法 |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
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| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
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| US6585933B1 (en) | 1999-05-03 | 2003-07-01 | Betzdearborn, Inc. | Method and composition for inhibiting corrosion in aqueous systems |
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| JP2002047483A (ja) * | 2000-08-04 | 2002-02-12 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| KR100479804B1 (ko) * | 2002-05-30 | 2005-03-30 | 동우 화인켐 주식회사 | 금속 ｃｍｐ용 연마 슬러리 조성물 |
| JP2004172606A (ja) | 2002-11-08 | 2004-06-17 | Sumitomo Chem Co Ltd | 金属研磨材組成物及び研磨方法 |
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| US8435421B2 (en) | 2007-11-27 | 2013-05-07 | Cabot Microelectronics Corporation | Metal-passivating CMP compositions and methods |
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| KR101481573B1 (ko) | 2008-02-12 | 2015-01-14 | 삼성전자주식회사 | 화학적 기계적 연마용 슬러리 조성물 및 이를 이용한화학적 기계적 연마 방법 |
| CN101525563B (zh) | 2008-03-03 | 2011-04-13 | 盟智科技股份有限公司 | 用于后研磨清洁剂的腐蚀抑制剂 |
| CN101580700B (zh) | 2008-05-16 | 2015-08-19 | 盟智科技股份有限公司 | 化学机械研磨的组成物 |
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| US8540893B2 (en) * | 2008-08-04 | 2013-09-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| US8071479B2 (en) | 2008-12-11 | 2011-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| TWI454561B (zh) | 2008-12-30 | 2014-10-01 | Uwiz Technology Co Ltd | A polishing composition for planarizing the metal layer |
| JP2011003665A (ja) * | 2009-06-17 | 2011-01-06 | Jsr Corp | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法 |
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| SG10201500387RA (en) * | 2010-01-29 | 2015-04-29 | Entegris Inc | Cleaning agent for semiconductor provided with metal wiring |
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| EP2502969A1 (en) | 2011-03-22 | 2012-09-26 | Basf Se | A chemical mechanical polishing (cmp) composition comprising two types of corrosion inhibitors |
| US10407594B2 (en) | 2011-03-22 | 2019-09-10 | Basf Se | Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine |
| CN102304327A (zh) * | 2011-07-05 | 2012-01-04 | 复旦大学 | 一种基于金属Co的抛光工艺的抛光液 |
| US8865013B2 (en) | 2011-08-15 | 2014-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing tungsten |
| US20130186850A1 (en) | 2012-01-24 | 2013-07-25 | Applied Materials, Inc. | Slurry for cobalt applications |
| TWI456013B (zh) | 2012-04-10 | 2014-10-11 | Uwiz Technology Co Ltd | 研磨液組成物 |
| US8717710B2 (en) | 2012-05-08 | 2014-05-06 | HGST Netherlands, B.V. | Corrosion-resistant bit patterned media (BPM) and discrete track media (DTM) and methods of production thereof |
| JP2014072336A (ja) * | 2012-09-28 | 2014-04-21 | Fujimi Inc | 研磨用組成物 |
| KR102152964B1 (ko) * | 2013-01-11 | 2020-09-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 화학 기계적 폴리싱 장치 및 방법 |
| SG11201506102TA (en) | 2013-02-28 | 2015-09-29 | Fujimi Inc | Polishing slurry for cobalt removal |
| JP6156630B2 (ja) * | 2013-05-24 | 2017-07-05 | Jsr株式会社 | 化学機械研磨用水系分散体および化学機械研磨方法 |
| US10358579B2 (en) | 2013-12-03 | 2019-07-23 | Cabot Microelectronics Corporation | CMP compositions and methods for polishing nickel phosphorous surfaces |
| US9735030B2 (en) * | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
-
2015
- 2015-10-21 EP EP15852684.8A patent/EP3210238B1/en active Active
- 2015-10-21 TW TW104134568A patent/TWI580767B/zh active
- 2015-10-21 JP JP2017519258A patent/JP6646051B2/ja active Active
- 2015-10-21 US US14/919,449 patent/US9688885B2/en active Active
- 2015-10-21 KR KR1020177013245A patent/KR102538575B1/ko active Active
- 2015-10-21 WO PCT/US2015/056749 patent/WO2016065060A1/en not_active Ceased
- 2015-10-21 CN CN201580057492.0A patent/CN107148457B/zh active Active
-
2017
- 2017-05-24 US US15/603,634 patent/US9850403B2/en active Active
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