TWI580767B - 鈷拋光加速劑 - Google Patents

鈷拋光加速劑 Download PDF

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Publication number
TWI580767B
TWI580767B TW104134568A TW104134568A TWI580767B TW I580767 B TWI580767 B TW I580767B TW 104134568 A TW104134568 A TW 104134568A TW 104134568 A TW104134568 A TW 104134568A TW I580767 B TWI580767 B TW I580767B
Authority
TW
Taiwan
Prior art keywords
polishing composition
cobalt
group
substrate
polishing
Prior art date
Application number
TW104134568A
Other languages
English (en)
Chinese (zh)
Other versions
TW201634652A (zh
Inventor
艾莉絲 席克瑪
維托 波
班傑明 佩特洛
傑弗瑞 克洛斯
葛倫 懷騰納
史蒂芬 卡夫特
安德魯 渥夫
菲利普 卡特
克莉絲汀 海耶斯
Original Assignee
卡博特微電子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 卡博特微電子公司 filed Critical 卡博特微電子公司
Publication of TW201634652A publication Critical patent/TW201634652A/zh
Application granted granted Critical
Publication of TWI580767B publication Critical patent/TWI580767B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104134568A 2014-10-21 2015-10-21 鈷拋光加速劑 TWI580767B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462066484P 2014-10-21 2014-10-21
US201562197992P 2015-07-28 2015-07-28

Publications (2)

Publication Number Publication Date
TW201634652A TW201634652A (zh) 2016-10-01
TWI580767B true TWI580767B (zh) 2017-05-01

Family

ID=55761505

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104134568A TWI580767B (zh) 2014-10-21 2015-10-21 鈷拋光加速劑

Country Status (7)

Country Link
US (2) US9688885B2 (enExample)
EP (1) EP3210238B1 (enExample)
JP (1) JP6646051B2 (enExample)
KR (1) KR102538575B1 (enExample)
CN (1) CN107148457B (enExample)
TW (1) TWI580767B (enExample)
WO (1) WO2016065060A1 (enExample)

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US9528030B1 (en) * 2015-10-21 2016-12-27 Cabot Microelectronics Corporation Cobalt inhibitor combination for improved dishing
TWI660017B (zh) 2016-07-14 2019-05-21 Cabot Microelectronics Corporation 用於鈷化學機械拋光(cmp)之替代氧化劑
US10077382B1 (en) 2017-03-06 2018-09-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for polishing cobalt-containing substrate
US10233356B2 (en) 2017-03-06 2019-03-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing slurry for cobalt-containing substrate
JP6901297B2 (ja) * 2017-03-22 2021-07-14 株式会社フジミインコーポレーテッド 研磨用組成物
EP3631045B1 (en) * 2017-05-25 2026-02-18 Fujifilm Electronic Materials U.S.A., Inc. Chemical mechanical polishing slurry for cobalt applications
US10377921B2 (en) 2017-09-21 2019-08-13 Rohm and Haas Electronics Materials CMP Holdings, Inc. Chemical mechanical polishing method for cobalt
US10170335B1 (en) 2017-09-21 2019-01-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for cobalt
US20200172759A1 (en) * 2018-12-04 2020-06-04 Cabot Microelectronics Corporation Composition and method for cobalt cmp
JP7244642B2 (ja) * 2019-06-20 2023-03-22 富士フイルム株式会社 研磨液、及び、化学的機械的研磨方法
EP4045226B1 (en) * 2019-10-15 2024-01-03 FUJIFILM Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof
KR102859110B1 (ko) * 2020-01-07 2025-09-12 씨엠씨 머티리얼즈 엘엘씨 유도체화된 폴리아미노산
JP2024508243A (ja) * 2021-02-04 2024-02-26 シーエムシー マテリアルズ リミティド ライアビリティ カンパニー 炭窒化ケイ素研磨組成物及び方法

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US20090184287A1 (en) * 2008-01-23 2009-07-23 Uwiz Technology Co., Ltd. Sarcosine compound used as corrosion inhibitor
US20090203213A1 (en) * 2008-02-12 2009-08-13 Samsung Electronics Co., Ltd. Slurry composition for chemical-mechanical polishing and method of chemical-mechanical polishing with the same
CN101649164A (zh) * 2008-08-04 2010-02-17 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光组合物及其相关方法
CN102770524A (zh) * 2010-01-29 2012-11-07 高级技术材料公司 附有金属布线的半导体用清洗剂
CN103228775A (zh) * 2010-11-29 2013-07-31 和光纯药工业株式会社 铜配线用基板清洗剂及铜配线半导体基板的清洗方法
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Also Published As

Publication number Publication date
US9850403B2 (en) 2017-12-26
US20170260421A1 (en) 2017-09-14
CN107148457B (zh) 2019-07-09
US20160115353A1 (en) 2016-04-28
KR20170076719A (ko) 2017-07-04
TW201634652A (zh) 2016-10-01
EP3210238B1 (en) 2019-06-26
JP2017538285A (ja) 2017-12-21
KR102538575B1 (ko) 2023-06-01
EP3210238A1 (en) 2017-08-30
CN107148457A (zh) 2017-09-08
US9688885B2 (en) 2017-06-27
WO2016065060A1 (en) 2016-04-28
EP3210238A4 (en) 2018-04-18
JP6646051B2 (ja) 2020-02-14

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