JP2017516296A5 - - Google Patents
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- Publication number
- JP2017516296A5 JP2017516296A5 JP2016558692A JP2016558692A JP2017516296A5 JP 2017516296 A5 JP2017516296 A5 JP 2017516296A5 JP 2016558692 A JP2016558692 A JP 2016558692A JP 2016558692 A JP2016558692 A JP 2016558692A JP 2017516296 A5 JP2017516296 A5 JP 2017516296A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- colloidal silica
- silica abrasive
- composition
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 33
- 239000008119 colloidal silica Substances 0.000 claims description 33
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 29
- 229910052742 iron Inorganic materials 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 13
- 239000003054 catalyst Substances 0.000 claims description 7
- 239000003381 stabilizer Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 23
- 238000005498 polishing Methods 0.000 claims 11
- 238000000034 method Methods 0.000 claims 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 6
- -1 aminosilane compound Chemical class 0.000 claims 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims 4
- 150000001412 amines Chemical class 0.000 claims 4
- TXXHDPDFNKHHGW-UHFFFAOYSA-N muconic acid Chemical compound OC(=O)C=CC=CC(O)=O TXXHDPDFNKHHGW-UHFFFAOYSA-N 0.000 claims 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 4
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 claims 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 claims 2
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 2
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims 2
- TXXHDPDFNKHHGW-CCAGOZQPSA-N Muconic acid Natural products OC(=O)\C=C/C=C\C(O)=O TXXHDPDFNKHHGW-CCAGOZQPSA-N 0.000 claims 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 2
- 239000001361 adipic acid Substances 0.000 claims 2
- 235000011037 adipic acid Nutrition 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims 2
- 235000003704 aspartic acid Nutrition 0.000 claims 2
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 2
- 235000015165 citric acid Nutrition 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 2
- 239000011976 maleic acid Substances 0.000 claims 2
- 235000006408 oxalic acid Nutrition 0.000 claims 2
- 239000007800 oxidant agent Substances 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 2
- 239000011164 primary particle Substances 0.000 claims 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 2
- XNCSCQSQSGDGES-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]propyl-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)C(C)CN(CC(O)=O)CC(O)=O XNCSCQSQSGDGES-UHFFFAOYSA-N 0.000 claims 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims 1
- VYTBPJNGNGMRFH-UHFFFAOYSA-N acetic acid;azane Chemical compound N.N.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O VYTBPJNGNGMRFH-UHFFFAOYSA-N 0.000 claims 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 125000006264 diethylaminomethyl group Chemical group [H]C([H])([H])C([H])([H])N(C([H])([H])*)C([H])([H])C([H])([H])[H] 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 238000007790 scraping Methods 0.000 claims 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims 1
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/222,736 | 2014-03-24 | ||
| US14/222,736 US9303190B2 (en) | 2014-03-24 | 2014-03-24 | Mixed abrasive tungsten CMP composition |
| PCT/US2015/021674 WO2015148295A1 (en) | 2014-03-24 | 2015-03-20 | Mixed abrasive tungsten cmp composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017516296A JP2017516296A (ja) | 2017-06-15 |
| JP2017516296A5 true JP2017516296A5 (enExample) | 2018-04-19 |
| JP6633540B2 JP6633540B2 (ja) | 2020-01-22 |
Family
ID=54141490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016558692A Active JP6633540B2 (ja) | 2014-03-24 | 2015-03-20 | 混合研磨剤タングステンｃｍｐ組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9303190B2 (enExample) |
| EP (1) | EP3123498B1 (enExample) |
| JP (1) | JP6633540B2 (enExample) |
| KR (1) | KR102390111B1 (enExample) |
| CN (1) | CN106415796B (enExample) |
| TW (1) | TWI545184B (enExample) |
| WO (1) | WO2015148295A1 (enExample) |
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| US20170183537A1 (en) * | 2014-08-26 | 2017-06-29 | K.C. Tech Co., Ltd | Polishing slurry composition |
| US10570313B2 (en) * | 2015-02-12 | 2020-02-25 | Versum Materials Us, Llc | Dishing reducing in tungsten chemical mechanical polishing |
| US10077381B2 (en) * | 2015-07-20 | 2018-09-18 | Kctech Co., Ltd. | Polishing slurry composition |
| US9631122B1 (en) * | 2015-10-28 | 2017-04-25 | Cabot Microelectronics Corporation | Tungsten-processing slurry with cationic surfactant |
| JP6955014B2 (ja) * | 2016-09-28 | 2021-10-27 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 第四級ホスホニウム化合物を含有する方法及び組成物を使用したタングステンの化学機械研磨 |
| WO2018058396A1 (en) | 2016-09-29 | 2018-04-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US10640682B2 (en) | 2016-09-29 | 2020-05-05 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US10633557B2 (en) | 2016-09-29 | 2020-04-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US20180094166A1 (en) * | 2016-09-30 | 2018-04-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing composition comprising positive and negative silica particles |
| US9783702B1 (en) | 2016-10-19 | 2017-10-10 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Aqueous compositions of low abrasive silica particles |
| US9803108B1 (en) | 2016-10-19 | 2017-10-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous compositions of stabilized aminosilane group containing silica particles |
| KR102798940B1 (ko) * | 2016-12-05 | 2025-04-25 | 솔브레인 주식회사 | 화학적 기계적 연마 슬러리 조성물 및 이를 이용한 반도체 소자의 제조방법 |
| US9984895B1 (en) * | 2017-01-31 | 2018-05-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US10181408B2 (en) * | 2017-01-31 | 2019-01-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives |
| SG11201909469WA (en) * | 2017-04-14 | 2019-11-28 | Cabot Microelectronics Corp | Chemical-mechanical processing slurry and methods |
| US10221336B2 (en) * | 2017-06-16 | 2019-03-05 | rohm and Hass Electronic Materials CMP Holdings, Inc. | Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them |
| KR20200032024A (ko) * | 2017-08-03 | 2020-03-25 | 제이에스알 가부시끼가이샤 | 반도체 처리용 조성물 및 처리 방법 |
| US10600655B2 (en) | 2017-08-10 | 2020-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US10316218B2 (en) * | 2017-08-30 | 2019-06-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them |
| CN111094481B (zh) * | 2017-09-15 | 2026-04-28 | Cmc材料有限责任公司 | 用于钨化学机械抛光的组合物 |
| US20190185713A1 (en) * | 2017-12-14 | 2019-06-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp slurry compositions containing silica with trimethylsulfoxonium cations |
| US10647887B2 (en) * | 2018-01-08 | 2020-05-12 | Cabot Microelectronics Corporation | Tungsten buff polishing compositions with improved topography |
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| SG10201904669TA (en) * | 2018-06-28 | 2020-01-30 | Kctech Co Ltd | Polishing Slurry Composition |
| US12227673B2 (en) * | 2018-12-04 | 2025-02-18 | Cmc Materials Llc | Composition and method for silicon nitride CMP |
| US10968366B2 (en) | 2018-12-04 | 2021-04-06 | Cmc Materials, Inc. | Composition and method for metal CMP |
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| US10676647B1 (en) * | 2018-12-31 | 2020-06-09 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| CN113544093B (zh) * | 2019-03-06 | 2024-07-26 | 扶桑化学工业株式会社 | 胶体二氧化硅及其制造方法 |
| KR102258900B1 (ko) * | 2019-04-22 | 2021-06-02 | 주식회사 케이씨텍 | 금속막 연마용 슬러리 조성물 |
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| KR102851125B1 (ko) * | 2021-03-31 | 2025-08-28 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법 |
| KR20240145790A (ko) | 2023-03-28 | 2024-10-07 | 고등기술연구원연구조합 | 실리카 나노 분말 및 웨이퍼의 화학기계 연마용 슬러리 제조 방법 |
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| KR101243331B1 (ko) * | 2010-12-17 | 2013-03-13 | 솔브레인 주식회사 | 화학 기계적 연마 슬러리 조성물 및 이를 이용하는 반도체 소자의 제조 방법 |
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| KR101335946B1 (ko) * | 2011-08-16 | 2013-12-04 | 유비머트리얼즈주식회사 | 텅스텐 연마용 ｃｍｐ 슬러리 조성물 |
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-
2014
- 2014-03-24 US US14/222,736 patent/US9303190B2/en active Active
-
2015
- 2015-03-20 CN CN201580027199.XA patent/CN106415796B/zh active Active
- 2015-03-20 WO PCT/US2015/021674 patent/WO2015148295A1/en not_active Ceased
- 2015-03-20 EP EP15767830.1A patent/EP3123498B1/en active Active
- 2015-03-20 JP JP2016558692A patent/JP6633540B2/ja active Active
- 2015-03-20 KR KR1020167029079A patent/KR102390111B1/ko active Active
- 2015-03-24 TW TW104109483A patent/TWI545184B/zh active
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