JP2019512718A - 発光モジュール製造方法および表示装置 - Google Patents
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims (10)
- 支持フレーム;および
前記支持フレーム上に配置される複数の発光モジュールを含む複数の発光キャビネットを含み、
前記複数の発光モジュールそれぞれは、基板と、前記基板上の発光部および前記基板の上に配置されて前記発光部を囲むブラックマトリクスとを含み、
前記発光部は、500μm未満の幅を有する表示装置。 - 前記発光部は、
前記基板に直接実装された赤色波長を発光する第1発光素子;
前記基板に直接実装された緑色波長を発光する第2発光素子;
前記基板に直接実装された青色波長を発光する第3発光素子;および
前記第1ないし第3発光素子を覆うモルディング部を含くみ、
前記第1ないし第3発光素子それぞれは200μm以下の幅を有し、
前記発光部および前記ブラックマトリクスは、COB(Chip On Board)タイプであり、
前記支持フレームは、前記複数の発光モジュールと直接接する平らな一面と、前記一面から他面を貫通する複数の開口部および外側面を含み、
前記外側面上には複数の突起および複数の溝を含む、請求項1に記載の表示装置。 - 前記基板の4個の端部は、前記支持フレームの4個の端部より外側に突出し、
前記複数の発光モジュールの端部の終端と前記支持フレームの端部の終端との間の間隔は、0.5mm〜2.0mmである、請求項1に記載の表示装置。 - 前記複数の開口部は、前記複数の発光キャビネットそれぞれに配置され、
前記複数の発光モジュールの下部面に配置された駆動回路を含み、
前記複数の開口部は前記駆動回路と対面される、請求項2に記載の表示装置。 - 前記複数の発光キャビネットは、互いに隣接した第1および第2発光キャビネットを含み、
前記第1発光キャビネットは、前記支持フレームの他面に配置された第1締結部および外側面に沿って配置された突起を含み、
前記第2発光キャビネットは、前記支持フレームの他面に配置された第2締結部および外側面に沿って配置されたスリット溝を含み、
前記第1および第2締結部は、互いに対面される孔を有し、
前記孔を貫通する締結部材を含み、
前記突起は、前記スリット溝と接する、請求項1に記載の表示装置。 - キャリアフィルム上に複数の第1ないし第3発光素子をアラインするステップ;
前記キャリアフィルムおよび前記複数の第1ないし第3発光素子上にモルディング層を形成するステップ;
前記モルディング層をカッティングして複数の発光部を形成するステップ;および
前記基板上に前記複数の発光部を実装するステップを含む発光モジュール製造方法。 - 前記複数の発光部を他のキャリアフィルムにアラインするステップ;および
前記他のキャリアフィルム上の複数の発光部の間にブラックマトリクスを形成して発光素子ブロックを形成するステップを含み、
前記複数の第1ないし第3発光部は、前記発光素子ブロックと対応し、
前記複数の発光部それぞれを前記基板上に実装するステップ;および
前記基板および前記複数の発光部上にブラックマトリクスを形成するステップを含む、請求項6に記載の発光モジュール製造方法。 - 基板上に複数の第1ないし第3発光素子を実装するステップ;
前記基板および前記複数の第1ないし第3発光素子上にモルディング層を形成するステップ;
前記モルディング層をカッティングして複数の発光部を形成するステップ;および
前記基板および前記複数の発光部上にブラックマトリクスを形成するステップを含む発光モジュール製造方法。 - 基板上に複数の第1ないし第3発光素子を実装するステップ;
前記基板上にマトリックスタイプのキャビティを有するブラックマトリクスを形成するステップ;および
前記キャビティ内にモルディング部を形成するステップを含む発光モジュール製造方法。 - 前記キャビティそれぞれには、一つの第1発光素子、一つの第2発光素子および一つの第3発光素子が配置され、
前記第1ないし第3発光素子を前記基板上に実装するステップは、前記ブラックマトリクスを前記基板上に形成するステップ以後に進行され、前記ブラックマトリクスを前記基板上に形成するステップは、前記ブラックマトリクスをマスクで前記ブラックマトリクスから露出した前記基板をエッチングするステップをさらに含み、
前記第1ないし第3発光素子は、エッチングされた前記基板上に実装される、請求項7に記載の発光モジュール製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2016-0021556 | 2016-02-23 | ||
KR1020160021556A KR102572819B1 (ko) | 2016-02-23 | 2016-02-23 | 발광모듈 제조방법 및 표시장치 |
PCT/KR2017/002007 WO2017146489A1 (ko) | 2016-02-23 | 2017-02-23 | 발광모듈 제조방법 및 표시장치 |
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JP6837071B2 JP6837071B2 (ja) | 2021-03-03 |
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EP (1) | EP3422819B1 (ja) |
JP (1) | JP6837071B2 (ja) |
KR (1) | KR102572819B1 (ja) |
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WO2017146489A1 (ko) | 2017-08-31 |
KR20170099325A (ko) | 2017-08-31 |
JP6837071B2 (ja) | 2021-03-03 |
US20190049760A1 (en) | 2019-02-14 |
KR102572819B1 (ko) | 2023-08-30 |
EP3422819A1 (en) | 2019-01-02 |
US10705370B2 (en) | 2020-07-07 |
EP3422819A4 (en) | 2019-09-04 |
EP3422819B1 (en) | 2023-08-09 |
CN108702827A (zh) | 2018-10-23 |
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