JP2019197748A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2019197748A JP2019197748A JP2018089084A JP2018089084A JP2019197748A JP 2019197748 A JP2019197748 A JP 2019197748A JP 2018089084 A JP2018089084 A JP 2018089084A JP 2018089084 A JP2018089084 A JP 2018089084A JP 2019197748 A JP2019197748 A JP 2019197748A
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
- H03K17/08104—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit in field-effect transistor switches
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
- H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
- H03K17/08116—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit in composite switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L58/00—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
- H01H2085/0283—Structural association with a semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
- H01H85/10—Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Inverter Devices (AREA)
- Fuses (AREA)
- Power Conversion In General (AREA)
Abstract
Description
4:冷却器
10、20:半導体モジュール
12、22:半導体素子
14、16:封止体
16、18、26、28:電力端子
30、32、34:バスバー
40、42、44、46:接続部材
40a:接続部材の屈曲部
40b:接続部材の脆弱部
40d:接続部材の内側部分
40e:接続部材の外側部分
Claims (9)
- 半導体素子及び前記半導体素子に接続された電力端子を有する半導体モジュールと、
前記半導体モジュールの前記電力端子に接続部材を介して接続されたバスバーと、を備え、
前記接続部材の溶断電流は、前記電力端子及び前記バスバーの各溶断電流よりも低い、半導体装置。 - 前記接続部材と前記電力端子との間の接合面は、前記接続部材と前記バスバーとの間の接合面と平行である、請求項1に記載の半導体装置。
- 前記接続部材と前記電力端子との間の前記接合面は、前記接続部材と前記バスバーとの間の前記接合面と同一平面内に位置する、請求項2に記載の半導体装置。
- 前記半導体モジュールは、前記半導体素子を封止する封止体をさらに有し、
前記電力端子は、前記封止体から外部へ延びる第1部分と、前記第1部分の延びる方向に対して垂直な方向に延びる第2部分とを有し、
前記接続部材は、前記電力端子の前記第2部分に接合されている、請求項2又は3に記載の半導体装置。 - 前記接続部材を構成する材料は、前記電力端子及び前記バスバーを構成する各材料よりも、低い融点を有する、請求項1から4のいずれか一項に記載の半導体装置。
- 前記接続部材は、内側部分と、前記内側部分を覆う外側部分とを有し、
前記内側部分を構成する材料は、前記外側部分を構成する材料よりも、低い電気抵抗率を有する、請求項1から5のいずれか一項に記載の半導体装置。 - 前記接続部材は、長手方向の中間位置に屈曲部を有する、請求項1から6のいずれか一項に記載の半導体装置。
- 前記接続部材は、長手方向に垂直な断面が局所的に縮小された脆弱部を有する、請求項1から7のいずれか一項に記載の半導体装置。
- 第1スイッチング素子と第1電力端子と第2電力端子とを有し、前記第1電力端子が前記第1スイッチング素子を介して前記第2電力端子に接続された、第1半導体モジュールと、
第2スイッチング素子と第3電力端子と第4電力端子とを有し、前記第3電力端子が前記第2スイッチング素子を介して前記第4電力端子に接続された、第2半導体モジュールと、
前記第1半導体モジュールの前記第1電力端子が第1接続部材を介して接続された第1バスバーと、
前記第1半導体モジュールの前記第2電力端子が第2接続部材を介して接続されているとともに、前記第2半導体モジュールの前記第3電力端子が第3接続部材を介して接続されている第2バスバーと、
前記第2半導体モジュールの前記第4電力端子が第4接続部材を介して接続された第3バスバーと、
を備え、
前記第1接続部材の溶断電流は、前記第1電力端子及び前記第1バスバーの各溶断電流よりも低く、
前記第2接続部材の溶断電流は、前記第2電力端子及び前記第2バスバーの各溶断電流よりも低く、
前記第3接続部材の溶断電流は、前記第3電力端子及び前記第2バスバーの各溶断電流よりも低く、
前記第4接続部材の溶断電流は、前記第4電力端子及び前記第3バスバーの各溶断電流よりも低い、半導体装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018089084A JP2019197748A (ja) | 2018-05-07 | 2018-05-07 | 半導体装置 |
US16/364,581 US20190341362A1 (en) | 2018-05-07 | 2019-03-26 | Semiconductor device |
CN201910342767.5A CN110459516A (zh) | 2018-05-07 | 2019-04-26 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018089084A JP2019197748A (ja) | 2018-05-07 | 2018-05-07 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019197748A true JP2019197748A (ja) | 2019-11-14 |
Family
ID=68384056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018089084A Pending JP2019197748A (ja) | 2018-05-07 | 2018-05-07 | 半導体装置 |
Country Status (3)
Country | Link |
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US (1) | US20190341362A1 (ja) |
JP (1) | JP2019197748A (ja) |
CN (1) | CN110459516A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003068967A (ja) * | 2001-08-29 | 2003-03-07 | Denso Corp | 半導体装置 |
JP2005175439A (ja) * | 2003-11-20 | 2005-06-30 | Toyota Motor Corp | 半導体装置およびそれを備えた自動車 |
JP2009218275A (ja) * | 2008-03-07 | 2009-09-24 | Mitsubishi Electric Corp | 半導体装置及びその半導体装置を備えたインバータシステム |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005039220A (ja) * | 2003-06-26 | 2005-02-10 | Nec Electronics Corp | 半導体装置 |
CN100416803C (zh) * | 2003-08-22 | 2008-09-03 | 关西电力株式会社 | 半导体装置及制造方法、使用该半导体装置的电力变换装置 |
JP4908750B2 (ja) * | 2004-11-25 | 2012-04-04 | ローム株式会社 | 半導体装置 |
US8289123B2 (en) * | 2005-07-22 | 2012-10-16 | Littelfuse, Inc. | Electrical device with integrally fused conductor |
JP4880950B2 (ja) * | 2005-09-05 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7986212B2 (en) * | 2007-05-15 | 2011-07-26 | Yazaki Corporation | Fuse |
JP5205834B2 (ja) * | 2007-06-25 | 2013-06-05 | 日産自動車株式会社 | 半導体装置 |
JP6221542B2 (ja) * | 2013-09-16 | 2017-11-01 | 株式会社デンソー | 半導体装置 |
JP5781185B1 (ja) * | 2014-03-25 | 2015-09-16 | 三菱電機株式会社 | 樹脂封止型半導体装置 |
-
2018
- 2018-05-07 JP JP2018089084A patent/JP2019197748A/ja active Pending
-
2019
- 2019-03-26 US US16/364,581 patent/US20190341362A1/en not_active Abandoned
- 2019-04-26 CN CN201910342767.5A patent/CN110459516A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003068967A (ja) * | 2001-08-29 | 2003-03-07 | Denso Corp | 半導体装置 |
JP2005175439A (ja) * | 2003-11-20 | 2005-06-30 | Toyota Motor Corp | 半導体装置およびそれを備えた自動車 |
JP2009218275A (ja) * | 2008-03-07 | 2009-09-24 | Mitsubishi Electric Corp | 半導体装置及びその半導体装置を備えたインバータシステム |
Also Published As
Publication number | Publication date |
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CN110459516A (zh) | 2019-11-15 |
US20190341362A1 (en) | 2019-11-07 |
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