JP2019176058A5 - - Google Patents

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Publication number
JP2019176058A5
JP2019176058A5 JP2018064209A JP2018064209A JP2019176058A5 JP 2019176058 A5 JP2019176058 A5 JP 2019176058A5 JP 2018064209 A JP2018064209 A JP 2018064209A JP 2018064209 A JP2018064209 A JP 2018064209A JP 2019176058 A5 JP2019176058 A5 JP 2019176058A5
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JP
Japan
Prior art keywords
heat radiating
arm element
heat
main
upper arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018064209A
Other languages
English (en)
Japanese (ja)
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JP6939679B2 (ja
JP2019176058A (ja
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Publication date
Application filed filed Critical
Priority to JP2018064209A priority Critical patent/JP6939679B2/ja
Priority claimed from JP2018064209A external-priority patent/JP6939679B2/ja
Priority to PCT/JP2019/003057 priority patent/WO2019187608A1/ja
Publication of JP2019176058A publication Critical patent/JP2019176058A/ja
Publication of JP2019176058A5 publication Critical patent/JP2019176058A5/ja
Application granted granted Critical
Publication of JP6939679B2 publication Critical patent/JP6939679B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018064209A 2018-03-29 2018-03-29 半導体装置 Active JP6939679B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018064209A JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置
PCT/JP2019/003057 WO2019187608A1 (ja) 2018-03-29 2019-01-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018064209A JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2019176058A JP2019176058A (ja) 2019-10-10
JP2019176058A5 true JP2019176058A5 (enExample) 2020-03-05
JP6939679B2 JP6939679B2 (ja) 2021-09-22

Family

ID=68058784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018064209A Active JP6939679B2 (ja) 2018-03-29 2018-03-29 半導体装置

Country Status (2)

Country Link
JP (1) JP6939679B2 (enExample)
WO (1) WO2019187608A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7467854B2 (ja) 2019-09-26 2024-04-16 船井電機株式会社 照明装置および表示装置
JP7167907B2 (ja) * 2019-12-12 2022-11-09 株式会社デンソー 半導体装置
JP7452233B2 (ja) * 2020-05-01 2024-03-19 株式会社デンソー 半導体装置および電力変換装置
JP7517143B2 (ja) 2020-12-28 2024-07-17 トヨタ自動車株式会社 リアクトルユニット

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
JP2015018860A (ja) * 2013-07-09 2015-01-29 株式会社デンソー 半導体パッケージの製造方法
JP6578900B2 (ja) * 2014-12-10 2019-09-25 株式会社デンソー 半導体装置及びその製造方法
JP6485397B2 (ja) * 2016-04-04 2019-03-20 株式会社デンソー 電子装置及びその製造方法

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