JP2019175923A5 - - Google Patents

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Publication number
JP2019175923A5
JP2019175923A5 JP2018060114A JP2018060114A JP2019175923A5 JP 2019175923 A5 JP2019175923 A5 JP 2019175923A5 JP 2018060114 A JP2018060114 A JP 2018060114A JP 2018060114 A JP2018060114 A JP 2018060114A JP 2019175923 A5 JP2019175923 A5 JP 2019175923A5
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JP
Japan
Prior art keywords
sealing resin
semiconductor package
package according
lid
internal wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018060114A
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English (en)
Japanese (ja)
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JP6895126B2 (ja
JP2019175923A (ja
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Publication date
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Priority to JP2018060114A priority Critical patent/JP6895126B2/ja
Priority claimed from JP2018060114A external-priority patent/JP6895126B2/ja
Priority to US16/188,772 priority patent/US10593605B2/en
Priority to DE102019201158.6A priority patent/DE102019201158B4/de
Priority to CN201910221792.8A priority patent/CN110310930B/zh
Publication of JP2019175923A publication Critical patent/JP2019175923A/ja
Publication of JP2019175923A5 publication Critical patent/JP2019175923A5/ja
Application granted granted Critical
Publication of JP6895126B2 publication Critical patent/JP6895126B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018060114A 2018-03-27 2018-03-27 半導体パッケージ Active JP6895126B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018060114A JP6895126B2 (ja) 2018-03-27 2018-03-27 半導体パッケージ
US16/188,772 US10593605B2 (en) 2018-03-27 2018-11-13 Semiconductor package
DE102019201158.6A DE102019201158B4 (de) 2018-03-27 2019-01-30 Halbleiterbaugruppe
CN201910221792.8A CN110310930B (zh) 2018-03-27 2019-03-22 半导体封装件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018060114A JP6895126B2 (ja) 2018-03-27 2018-03-27 半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2019175923A JP2019175923A (ja) 2019-10-10
JP2019175923A5 true JP2019175923A5 (enExample) 2020-08-20
JP6895126B2 JP6895126B2 (ja) 2021-06-30

Family

ID=67910315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018060114A Active JP6895126B2 (ja) 2018-03-27 2018-03-27 半導体パッケージ

Country Status (4)

Country Link
US (1) US10593605B2 (enExample)
JP (1) JP6895126B2 (enExample)
CN (1) CN110310930B (enExample)
DE (1) DE102019201158B4 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11527456B2 (en) * 2019-10-31 2022-12-13 Ut-Battelle, Llc Power module with organic layers
JP7209615B2 (ja) * 2019-11-13 2023-01-20 三菱電機株式会社 半導体装置
WO2021195871A1 (zh) * 2020-03-30 2021-10-07 华为技术有限公司 埋入式基板、电路板组件及电子设备
JP7735655B2 (ja) * 2020-10-15 2025-09-09 富士電機株式会社 半導体装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233953A (ja) * 1988-07-22 1990-02-05 Mitsubishi Electric Corp 半導体装置
JP3506733B2 (ja) * 1993-07-09 2004-03-15 ローム株式会社 安全ヒューズ付き面実装型電子部品の構造
JP3019679B2 (ja) * 1993-09-08 2000-03-13 富士電機株式会社 半導体装置の内部配線構造
US5744860A (en) 1996-02-06 1998-04-28 Asea Brown Boveri Ag Power semiconductor module
JPH1012806A (ja) * 1996-06-24 1998-01-16 Toshiba Corp 半導体装置
DE19639279C2 (de) * 1996-09-25 2002-01-17 Daimlerchrysler Rail Systems Stromrichterschaltung
JP2000138107A (ja) 1998-11-04 2000-05-16 Mitsubishi Materials Corp 半導体サージ吸収素子
JP3778268B2 (ja) * 2001-03-21 2006-05-24 オムロン株式会社 過電流遮断構造の製造方法
JP4615289B2 (ja) * 2004-11-12 2011-01-19 三菱電機株式会社 半導体装置
US20070075822A1 (en) * 2005-10-03 2007-04-05 Littlefuse, Inc. Fuse with cavity forming enclosure
JP2008235502A (ja) * 2007-03-20 2008-10-02 Mitsubishi Electric Corp 樹脂封止型半導体装置
CN104112730A (zh) * 2013-06-09 2014-10-22 广东美的制冷设备有限公司 智能功率模块及其制造方法
JP6916997B2 (ja) * 2016-03-17 2021-08-11 富士電機株式会社 半導体装置
JP6627698B2 (ja) * 2016-09-13 2020-01-08 三菱電機株式会社 半導体装置
JP2018060114A (ja) 2016-10-07 2018-04-12 キヤノン株式会社 投影型表示装置
US9865537B1 (en) * 2016-12-30 2018-01-09 Texas Instruments Incorporated Methods and apparatus for integrated circuit failsafe fuse package with arc arrest

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