JP2020526930A5 - - Google Patents
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- Publication number
- JP2020526930A5 JP2020526930A5 JP2020501184A JP2020501184A JP2020526930A5 JP 2020526930 A5 JP2020526930 A5 JP 2020526930A5 JP 2020501184 A JP2020501184 A JP 2020501184A JP 2020501184 A JP2020501184 A JP 2020501184A JP 2020526930 A5 JP2020526930 A5 JP 2020526930A5
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- semiconductor module
- molding compound
- metal coating
- side wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 21
- 239000011248 coating agent Substances 0.000 claims 13
- 238000000576 coating method Methods 0.000 claims 13
- 150000001875 compounds Chemical class 0.000 claims 13
- 239000002184 metal Substances 0.000 claims 13
- 238000000465 moulding Methods 0.000 claims 12
- 239000000758 substrate Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- 230000002093 peripheral effect Effects 0.000 claims 4
- 239000011253 protective coating Substances 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 229920006336 epoxy molding compound Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17181052.6 | 2017-07-12 | ||
| EP17181052 | 2017-07-12 | ||
| PCT/EP2018/068604 WO2019011890A1 (en) | 2017-07-12 | 2018-07-10 | POWER SEMICONDUCTOR MODULE |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020526930A JP2020526930A (ja) | 2020-08-31 |
| JP2020526930A5 true JP2020526930A5 (enExample) | 2021-08-05 |
| JP7221930B2 JP7221930B2 (ja) | 2023-02-14 |
Family
ID=59325238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020501184A Active JP7221930B2 (ja) | 2017-07-12 | 2018-07-10 | パワー半導体モジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11362008B2 (enExample) |
| EP (1) | EP3649671B1 (enExample) |
| JP (1) | JP7221930B2 (enExample) |
| CN (1) | CN110914975B (enExample) |
| WO (1) | WO2019011890A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD929462S1 (en) * | 2018-06-04 | 2021-08-31 | Semikron Elektronik Gmbh & Co. Kg | Module |
| USD903590S1 (en) | 2018-09-12 | 2020-12-01 | Cree Fayetteville, Inc. | Power module |
| CN209419498U (zh) * | 2019-03-25 | 2019-09-20 | 阳光电源股份有限公司 | Igbt模块及其导体安装结构、逆变器 |
| USD942403S1 (en) | 2019-10-24 | 2022-02-01 | Wolfspeed, Inc. | Power module having pin fins |
| EP4187586A1 (en) | 2021-11-24 | 2023-05-31 | Hitachi Energy Switzerland AG | Assembly for a power module, power module and method for producing an assembly for a power module |
| US20230326823A1 (en) * | 2022-04-06 | 2023-10-12 | Infineon Technologies Ag | Temperature Sensor Arrangement in Semiconductor Module |
| DE102024201717A1 (de) * | 2024-02-26 | 2025-08-28 | Robert Bosch Gesellschaft mit beschränkter Haftung | Substrat eines Leistungsmoduls |
| EP4687170A1 (en) * | 2024-07-31 | 2026-02-04 | Hitachi Energy Ltd | Power semiconductor module and method for manufacturing a power semiconductor module |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3269745B2 (ja) | 1995-01-17 | 2002-04-02 | 株式会社日立製作所 | モジュール型半導体装置 |
| JP3440824B2 (ja) * | 1998-05-28 | 2003-08-25 | 株式会社日立製作所 | 半導体装置 |
| EP0962974B1 (en) * | 1998-05-28 | 2005-01-26 | Hitachi, Ltd. | Semiconductor device |
| JP3414388B2 (ja) * | 2000-06-12 | 2003-06-09 | 株式会社日立製作所 | 電子機器 |
| DE10214953A1 (de) * | 2002-04-04 | 2003-10-30 | Infineon Technologies Ag | Leistungsmodul mit mindestens zwei Substraten und Verfahren zu seiner Herstellung |
| US6696644B1 (en) * | 2002-08-08 | 2004-02-24 | Texas Instruments Incorporated | Polymer-embedded solder bumps for reliable plastic package attachment |
| JP3740117B2 (ja) | 2002-11-13 | 2006-02-01 | 三菱電機株式会社 | 電力用半導体装置 |
| KR101391925B1 (ko) | 2007-02-28 | 2014-05-07 | 페어차일드코리아반도체 주식회사 | 반도체 패키지 및 이를 제조하기 위한 반도체 패키지 금형 |
| JP5061717B2 (ja) * | 2007-05-18 | 2012-10-31 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
| US8018047B2 (en) * | 2007-08-06 | 2011-09-13 | Infineon Technologies Ag | Power semiconductor module including a multilayer substrate |
| US8154114B2 (en) * | 2007-08-06 | 2012-04-10 | Infineon Technologies Ag | Power semiconductor module |
| DE102008029829B4 (de) | 2008-06-25 | 2012-10-11 | Danfoss Silicon Power Gmbh | Vertikal nach oben kontaktierender Halbleiter und Verfahren zu dessen Herstellung |
| JP4576448B2 (ja) | 2008-07-18 | 2010-11-10 | 三菱電機株式会社 | 電力用半導体装置 |
| US8248809B2 (en) * | 2008-08-26 | 2012-08-21 | GM Global Technology Operations LLC | Inverter power module with distributed support for direct substrate cooling |
| JP4607995B2 (ja) * | 2008-11-28 | 2011-01-05 | 三菱電機株式会社 | 電力用半導体装置 |
| JP4825259B2 (ja) * | 2008-11-28 | 2011-11-30 | 三菱電機株式会社 | 電力用半導体モジュール及びその製造方法 |
| JP2011187819A (ja) | 2010-03-10 | 2011-09-22 | Mitsubishi Electric Corp | 樹脂封止型パワーモジュールおよびその製造方法 |
| JP5661183B2 (ja) | 2012-02-13 | 2015-01-28 | パナソニックＩｐマネジメント株式会社 | 半導体装置およびその製造方法 |
| JP5859906B2 (ja) | 2012-04-20 | 2016-02-16 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP5836298B2 (ja) | 2013-03-13 | 2015-12-24 | 三菱電機株式会社 | 半導体装置 |
| DE102013219833B4 (de) * | 2013-09-30 | 2020-02-13 | Infineon Technologies Ag | Halbleitermodul mit leiterplatte und vefahren zur hertellung eines halbleitermoduls mit einer leiterplatte |
| CN105765716B (zh) | 2014-05-15 | 2018-06-22 | 富士电机株式会社 | 功率半导体模块和复合模块 |
| JP6540324B2 (ja) | 2015-07-23 | 2019-07-10 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
| DE102015112451B4 (de) | 2015-07-30 | 2021-02-04 | Danfoss Silicon Power Gmbh | Leistungshalbleitermodul |
| CN108886036B (zh) * | 2016-04-04 | 2022-06-24 | 三菱电机株式会社 | 功率模块、功率半导体装置及功率模块制造方法 |
| US10224268B1 (en) * | 2016-11-28 | 2019-03-05 | CoolStar Technology, Inc. | Enhanced thermal transfer in a semiconductor structure |
| EP4401126A3 (en) * | 2018-01-30 | 2024-09-25 | Infineon Technologies AG | Power semiconductor module and method for producing the same |
-
2018
- 2018-07-10 JP JP2020501184A patent/JP7221930B2/ja active Active
- 2018-07-10 EP EP18735597.9A patent/EP3649671B1/en active Active
- 2018-07-10 CN CN201880046337.2A patent/CN110914975B/zh active Active
- 2018-07-10 WO PCT/EP2018/068604 patent/WO2019011890A1/en not_active Ceased
-
2020
- 2020-01-08 US US16/737,378 patent/US11362008B2/en active Active
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