JPH0418468B2 - - Google Patents

Info

Publication number
JPH0418468B2
JPH0418468B2 JP60245113A JP24511385A JPH0418468B2 JP H0418468 B2 JPH0418468 B2 JP H0418468B2 JP 60245113 A JP60245113 A JP 60245113A JP 24511385 A JP24511385 A JP 24511385A JP H0418468 B2 JPH0418468 B2 JP H0418468B2
Authority
JP
Japan
Prior art keywords
case
corners
silicone gel
semiconductor device
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60245113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62104145A (ja
Inventor
Yoshio Takagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60245113A priority Critical patent/JPS62104145A/ja
Publication of JPS62104145A publication Critical patent/JPS62104145A/ja
Publication of JPH0418468B2 publication Critical patent/JPH0418468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP60245113A 1985-10-31 1985-10-31 半導体装置 Granted JPS62104145A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60245113A JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60245113A JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS62104145A JPS62104145A (ja) 1987-05-14
JPH0418468B2 true JPH0418468B2 (enExample) 1992-03-27

Family

ID=17128814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60245113A Granted JPS62104145A (ja) 1985-10-31 1985-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS62104145A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3638746B2 (ja) * 1997-01-30 2005-04-13 東レ・ダウコーニング・シリコーン株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP3765444B2 (ja) * 1997-07-10 2006-04-12 東レ・ダウコーニング株式会社 電気・電子部品封止・充填用シリコーンゲル組成物およびシリコーンゲル
JP4081611B2 (ja) * 2003-11-19 2008-04-30 株式会社豊田自動織機 半導体装置
US10155852B2 (en) 2014-01-27 2018-12-18 Dow Corning Toray Co., Ltd. Silicone gel composition
US20200164613A1 (en) 2016-09-26 2020-05-28 Dow Corning Toray Co., Ltd. Laminate, method of manufacturing the same, and method of manufacturing electronic component
WO2018056297A1 (ja) 2016-09-26 2018-03-29 東レ・ダウコーニング株式会社 硬化反応性シリコーンゲルおよびその用途
WO2018079678A1 (ja) 2016-10-31 2018-05-03 東レ・ダウコーニング株式会社 積層体および電子部品の製造方法
WO2018186165A1 (ja) 2017-04-06 2018-10-11 東レ・ダウコーニング株式会社 液状硬化性シリコーン接着剤組成物、その硬化物およびその用途
KR102673414B1 (ko) 2017-09-11 2024-06-13 다우 도레이 캄파니 리미티드 라디칼 반응성을 가지는 실리콘 엘라스토머 경화물 및 그 용도

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167552U (enExample) * 1980-05-15 1981-12-11
JPS58121652A (ja) * 1981-12-11 1983-07-20 Fuji Electric Co Ltd 混成集積回路装置

Also Published As

Publication number Publication date
JPS62104145A (ja) 1987-05-14

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