JP2019133994A5 - - Google Patents

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Publication number
JP2019133994A5
JP2019133994A5 JP2018012842A JP2018012842A JP2019133994A5 JP 2019133994 A5 JP2019133994 A5 JP 2019133994A5 JP 2018012842 A JP2018012842 A JP 2018012842A JP 2018012842 A JP2018012842 A JP 2018012842A JP 2019133994 A5 JP2019133994 A5 JP 2019133994A5
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JP
Japan
Prior art keywords
light receiving
receiving element
light emitting
emitting element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018012842A
Other languages
English (en)
Japanese (ja)
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JP2019133994A (ja
JP6620176B2 (ja
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Publication date
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Priority claimed from JP2018012842A external-priority patent/JP6620176B2/ja
Priority to JP2018012842A priority Critical patent/JP6620176B2/ja
Priority to PCT/JP2018/047287 priority patent/WO2019146339A1/ja
Priority to KR1020207018716A priority patent/KR102459822B1/ko
Priority to CN201880087698.1A priority patent/CN111656540B/zh
Priority to TW108103065A priority patent/TWI785195B/zh
Publication of JP2019133994A publication Critical patent/JP2019133994A/ja
Publication of JP2019133994A5 publication Critical patent/JP2019133994A5/ja
Publication of JP6620176B2 publication Critical patent/JP6620176B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018012842A 2018-01-29 2018-01-29 半導体装置 Active JP6620176B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018012842A JP6620176B2 (ja) 2018-01-29 2018-01-29 半導体装置
PCT/JP2018/047287 WO2019146339A1 (ja) 2018-01-29 2018-12-21 半導体装置
KR1020207018716A KR102459822B1 (ko) 2018-01-29 2018-12-21 반도체 장치
CN201880087698.1A CN111656540B (zh) 2018-01-29 2018-12-21 半导体装置
TW108103065A TWI785195B (zh) 2018-01-29 2019-01-28 半導體裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018012842A JP6620176B2 (ja) 2018-01-29 2018-01-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2019133994A JP2019133994A (ja) 2019-08-08
JP2019133994A5 true JP2019133994A5 (enExample) 2019-09-19
JP6620176B2 JP6620176B2 (ja) 2019-12-11

Family

ID=67395853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018012842A Active JP6620176B2 (ja) 2018-01-29 2018-01-29 半導体装置

Country Status (5)

Country Link
JP (1) JP6620176B2 (enExample)
KR (1) KR102459822B1 (enExample)
CN (1) CN111656540B (enExample)
TW (1) TWI785195B (enExample)
WO (1) WO2019146339A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7189994B2 (ja) * 2021-04-16 2022-12-14 アオイ電子株式会社 半導体装置およびその製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132535A (ja) * 1984-07-25 1986-02-15 Sanyo Electric Co Ltd センサの製造方法
JPH06204508A (ja) * 1992-12-28 1994-07-22 Canon Inc 光学式検出装置
JP3573400B2 (ja) * 1997-07-16 2004-10-06 シャープ株式会社 光学式入力装置
JP3684823B2 (ja) * 1998-03-26 2005-08-17 松下電工株式会社 半導体リレー
JP3819664B2 (ja) * 2000-03-08 2006-09-13 シャープ株式会社 光結合素子
JP4812189B2 (ja) * 2001-06-15 2011-11-09 オリンパス株式会社 光学式検出装置
EP1376960A1 (en) 2002-06-29 2004-01-02 Deutsche Thomson-Brandt Gmbh Data link layer device with two transmission modes for a serial communication bus
JP2004063764A (ja) * 2002-07-29 2004-02-26 Toshiba Corp 光結合半導体装置、およびその製造方法
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP4021382B2 (ja) * 2003-07-28 2007-12-12 オリンパス株式会社 光学式エンコーダ及びその製造方法並びに光学レンズモジュール
JP4418278B2 (ja) * 2004-03-30 2010-02-17 オリンパス株式会社 光学式エンコーダ及びその製造方法
JP5381280B2 (ja) * 2009-04-23 2014-01-08 オムロン株式会社 光結合装置
KR101069197B1 (ko) * 2009-09-25 2011-09-30 전자부품연구원 발광 및 수광 소자가 일체로 형성된 패키지 모듈
WO2013190871A1 (ja) * 2012-06-20 2013-12-27 アオイ電子株式会社 光源一体型光センサ
EP2860497B2 (de) * 2013-10-09 2019-04-10 SICK STEGMANN GmbH Optoelektronischer Sensor und Verfahren zur Herstellung eines solchen
JP2015095584A (ja) * 2013-11-13 2015-05-18 ローム株式会社 光学装置、光学装置の製造方法
JP2015177052A (ja) * 2014-03-14 2015-10-05 株式会社東芝 光結合装置
KR102455919B1 (ko) * 2014-07-25 2022-10-17 에이엠에스 센서스 싱가포르 피티이. 리미티드. 서로 광학적으로 분리된 영역들을 갖는 이미지 센서를 포함하는 광전 모듈들

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