KR102459822B1 - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR102459822B1
KR102459822B1 KR1020207018716A KR20207018716A KR102459822B1 KR 102459822 B1 KR102459822 B1 KR 102459822B1 KR 1020207018716 A KR1020207018716 A KR 1020207018716A KR 20207018716 A KR20207018716 A KR 20207018716A KR 102459822 B1 KR102459822 B1 KR 102459822B1
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KR
South Korea
Prior art keywords
light
substrate
light receiving
chip
receiving element
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KR1020207018716A
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English (en)
Korean (ko)
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KR20200090239A (ko
Inventor
아츠시 구로하
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아오이 전자 주식회사
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Publication of KR20200090239A publication Critical patent/KR20200090239A/ko
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Publication of KR102459822B1 publication Critical patent/KR102459822B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H01L31/12—

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Bipolar Transistors (AREA)
  • Noodles (AREA)
KR1020207018716A 2018-01-29 2018-12-21 반도체 장치 Active KR102459822B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018012842A JP6620176B2 (ja) 2018-01-29 2018-01-29 半導体装置
JPJP-P-2018-012842 2018-01-29
PCT/JP2018/047287 WO2019146339A1 (ja) 2018-01-29 2018-12-21 半導体装置

Publications (2)

Publication Number Publication Date
KR20200090239A KR20200090239A (ko) 2020-07-28
KR102459822B1 true KR102459822B1 (ko) 2022-10-26

Family

ID=67395853

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207018716A Active KR102459822B1 (ko) 2018-01-29 2018-12-21 반도체 장치

Country Status (5)

Country Link
JP (1) JP6620176B2 (enExample)
KR (1) KR102459822B1 (enExample)
CN (1) CN111656540B (enExample)
TW (1) TWI785195B (enExample)
WO (1) WO2019146339A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7189994B2 (ja) * 2021-04-16 2022-12-14 アオイ電子株式会社 半導体装置およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005043192A (ja) * 2003-07-28 2005-02-17 Olympus Corp 光学式エンコーダ及びその製造方法並びに光学レンズモジュール
JP3684823B2 (ja) * 1998-03-26 2005-08-17 松下電工株式会社 半導体リレー
JP2005283457A (ja) * 2004-03-30 2005-10-13 Olympus Corp 光学式エンコーダ及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132535A (ja) * 1984-07-25 1986-02-15 Sanyo Electric Co Ltd センサの製造方法
JPH06204508A (ja) * 1992-12-28 1994-07-22 Canon Inc 光学式検出装置
JP3573400B2 (ja) * 1997-07-16 2004-10-06 シャープ株式会社 光学式入力装置
JP3819664B2 (ja) * 2000-03-08 2006-09-13 シャープ株式会社 光結合素子
JP4812189B2 (ja) * 2001-06-15 2011-11-09 オリンパス株式会社 光学式検出装置
EP1376960A1 (en) 2002-06-29 2004-01-02 Deutsche Thomson-Brandt Gmbh Data link layer device with two transmission modes for a serial communication bus
JP2004063764A (ja) * 2002-07-29 2004-02-26 Toshiba Corp 光結合半導体装置、およびその製造方法
JP2005038956A (ja) * 2003-07-17 2005-02-10 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP5381280B2 (ja) * 2009-04-23 2014-01-08 オムロン株式会社 光結合装置
KR101069197B1 (ko) * 2009-09-25 2011-09-30 전자부품연구원 발광 및 수광 소자가 일체로 형성된 패키지 모듈
WO2013190871A1 (ja) * 2012-06-20 2013-12-27 アオイ電子株式会社 光源一体型光センサ
EP2860497B2 (de) * 2013-10-09 2019-04-10 SICK STEGMANN GmbH Optoelektronischer Sensor und Verfahren zur Herstellung eines solchen
JP2015095584A (ja) * 2013-11-13 2015-05-18 ローム株式会社 光学装置、光学装置の製造方法
JP2015177052A (ja) * 2014-03-14 2015-10-05 株式会社東芝 光結合装置
KR102455919B1 (ko) * 2014-07-25 2022-10-17 에이엠에스 센서스 싱가포르 피티이. 리미티드. 서로 광학적으로 분리된 영역들을 갖는 이미지 센서를 포함하는 광전 모듈들

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3684823B2 (ja) * 1998-03-26 2005-08-17 松下電工株式会社 半導体リレー
JP2005043192A (ja) * 2003-07-28 2005-02-17 Olympus Corp 光学式エンコーダ及びその製造方法並びに光学レンズモジュール
JP2005283457A (ja) * 2004-03-30 2005-10-13 Olympus Corp 光学式エンコーダ及びその製造方法

Also Published As

Publication number Publication date
KR20200090239A (ko) 2020-07-28
TW201941447A (zh) 2019-10-16
CN111656540A (zh) 2020-09-11
JP2019133994A (ja) 2019-08-08
WO2019146339A1 (ja) 2019-08-01
CN111656540B (zh) 2023-06-13
JP6620176B2 (ja) 2019-12-11
TWI785195B (zh) 2022-12-01

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