JP2019175911A - 半導体装置の製造方法、基板処理装置およびプログラム - Google Patents
半導体装置の製造方法、基板処理装置およびプログラム Download PDFInfo
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- JP2019175911A JP2019175911A JP2018059822A JP2018059822A JP2019175911A JP 2019175911 A JP2019175911 A JP 2019175911A JP 2018059822 A JP2018059822 A JP 2018059822A JP 2018059822 A JP2018059822 A JP 2018059822A JP 2019175911 A JP2019175911 A JP 2019175911A
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- H—ELECTRICITY
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
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- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
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- H01L21/02131—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being halogen doped silicon oxides, e.g. FSG
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Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018059822A JP2019175911A (ja) | 2018-03-27 | 2018-03-27 | 半導体装置の製造方法、基板処理装置およびプログラム |
| KR1020190020196A KR102206178B1 (ko) | 2018-03-27 | 2019-02-21 | 반도체 장치의 제조 방법, 기판 처리 장치 및 기록 매체 |
| CN201910140399.6A CN110310884A (zh) | 2018-03-27 | 2019-02-22 | 半导体装置的制造方法、基板处理装置及存储介质 |
| TW108106401A TW201942981A (zh) | 2018-03-27 | 2019-02-26 | 半導體裝置的製造方法、基板處理裝置及記錄媒體 |
| US16/285,970 US20190304791A1 (en) | 2018-03-27 | 2019-02-26 | Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018059822A JP2019175911A (ja) | 2018-03-27 | 2018-03-27 | 半導体装置の製造方法、基板処理装置およびプログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019175911A true JP2019175911A (ja) | 2019-10-10 |
| JP2019175911A5 JP2019175911A5 (enExample) | 2019-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018059822A Pending JP2019175911A (ja) | 2018-03-27 | 2018-03-27 | 半導体装置の製造方法、基板処理装置およびプログラム |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20190304791A1 (enExample) |
| JP (1) | JP2019175911A (enExample) |
| KR (1) | KR102206178B1 (enExample) |
| CN (1) | CN110310884A (enExample) |
| TW (1) | TW201942981A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023018500A (ja) * | 2021-07-27 | 2023-02-08 | 東京エレクトロン株式会社 | 窒化チタン膜を形成する方法、及び窒化チタン膜を形成する装置 |
| US12463031B2 (en) | 2020-11-25 | 2025-11-04 | Kokusai Electric Corporation | Method of processing substrate, recording medium, and substrate processing apparatus |
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| CN113518836B (zh) | 2019-03-06 | 2023-11-24 | 株式会社国际电气 | 半导体装置的制造方法、记录介质、基板处理装置和基板处理方法 |
| KR102128328B1 (ko) | 2019-09-16 | 2020-06-30 | 디씨에스이엔지 주식회사 | 파이프 가공 캐리지 |
| CN112164697B (zh) * | 2020-09-28 | 2021-12-17 | 长江存储科技有限责任公司 | 一种半导体器件的制备方法、半导体结构 |
| JP7589578B2 (ja) * | 2021-02-16 | 2024-11-26 | 東京エレクトロン株式会社 | エッチング方法及びエッチング装置 |
| CN117981052A (zh) * | 2021-10-29 | 2024-05-03 | 株式会社国际电气 | 半导体装置的制造方法、基板处理方法、基板处理装置以及记录介质 |
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| US12463031B2 (en) | 2020-11-25 | 2025-11-04 | Kokusai Electric Corporation | Method of processing substrate, recording medium, and substrate processing apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110310884A (zh) | 2019-10-08 |
| US20190304791A1 (en) | 2019-10-03 |
| TW201942981A (zh) | 2019-11-01 |
| KR102206178B1 (ko) | 2021-01-22 |
| KR20190113548A (ko) | 2019-10-08 |
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