JP2019134080A - 半導体モジュール - Google Patents

半導体モジュール Download PDF

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Publication number
JP2019134080A
JP2019134080A JP2018015526A JP2018015526A JP2019134080A JP 2019134080 A JP2019134080 A JP 2019134080A JP 2018015526 A JP2018015526 A JP 2018015526A JP 2018015526 A JP2018015526 A JP 2018015526A JP 2019134080 A JP2019134080 A JP 2019134080A
Authority
JP
Japan
Prior art keywords
bus bar
terminals
semiconductor
terminal
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018015526A
Other languages
English (en)
Japanese (ja)
Inventor
成功 有村
Seiko Arimura
成功 有村
浩志 瀧
Hiroshi Taki
浩志 瀧
高志 増澤
Takashi Masuzawa
高志 増澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2018015526A priority Critical patent/JP2019134080A/ja
Priority to PCT/JP2018/048159 priority patent/WO2019150870A1/fr
Publication of JP2019134080A publication Critical patent/JP2019134080A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)
JP2018015526A 2018-01-31 2018-01-31 半導体モジュール Pending JP2019134080A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018015526A JP2019134080A (ja) 2018-01-31 2018-01-31 半導体モジュール
PCT/JP2018/048159 WO2019150870A1 (fr) 2018-01-31 2018-12-27 Module semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018015526A JP2019134080A (ja) 2018-01-31 2018-01-31 半導体モジュール

Publications (1)

Publication Number Publication Date
JP2019134080A true JP2019134080A (ja) 2019-08-08

Family

ID=67478125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018015526A Pending JP2019134080A (ja) 2018-01-31 2018-01-31 半導体モジュール

Country Status (2)

Country Link
JP (1) JP2019134080A (fr)
WO (1) WO2019150870A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7308162B2 (ja) * 2020-02-19 2023-07-13 株式会社日立製作所 電力変換ユニット、および電力変換装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225847B2 (ja) * 1996-08-30 2001-11-05 株式会社日立製作所 半導体モジュール
JP3723869B2 (ja) * 2001-03-30 2005-12-07 株式会社日立製作所 半導体装置
JP5481104B2 (ja) * 2009-06-11 2014-04-23 ルネサスエレクトロニクス株式会社 半導体装置
JP2014086506A (ja) * 2012-10-22 2014-05-12 Toyota Motor Corp 半導体装置
JP6275574B2 (ja) * 2014-07-07 2018-02-07 株式会社東芝 半導体装置
JP6488996B2 (ja) * 2015-11-27 2019-03-27 株式会社デンソー 電力変換装置

Also Published As

Publication number Publication date
WO2019150870A1 (fr) 2019-08-08

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