JP2019106448A - 抵抗器の製造方法 - Google Patents
抵抗器の製造方法 Download PDFInfo
- Publication number
- JP2019106448A JP2019106448A JP2017237820A JP2017237820A JP2019106448A JP 2019106448 A JP2019106448 A JP 2019106448A JP 2017237820 A JP2017237820 A JP 2017237820A JP 2017237820 A JP2017237820 A JP 2017237820A JP 2019106448 A JP2019106448 A JP 2019106448A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- conductive layer
- electrode plate
- heat conductive
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 143
- 239000000543 intermediate Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 10
- 239000011241 protective layer Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000001382 dynamic differential scanning calorimetry Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/07—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by resistor foil bonding, e.g. cladding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Details Of Resistors (AREA)
Abstract
Description
本実施形態の抵抗器の製造方法に関し、図面を用いながら以下、製造工程順に説明する。
以上の製造工程を経て製造された抵抗器11は、図8Bや図8Cに示すように、抵抗体2と、抵抗体2の両側に配置され、抵抗体2の下面側に折り曲げられた電極板3と、抵抗体2と電極板3との間に介在する硬化された複数の熱伝導層4、5と、を有することを特徴とする。
ポリイミド・エポキシ樹脂
[示差走査型熱量計]
株式会社リガク製のDSC8231
2 :抵抗体
3 :電極板
4 :第1熱伝導層
5 :第2熱伝導層
6 :切欠き
7 :保護層
7a :表面保護層
7b :底面保護層
8 :メッキ層
10 :抵抗器中間体
11 :抵抗器
Claims (5)
- 抵抗体の表面に、未硬化の第1熱伝導層を形成する工程、
前記第1熱伝導層を硬化させる工程、
前記第1熱伝導層の表面に、未硬化の第2熱伝導層を積層する工程、
前記抵抗体の両側に配置された電極板を折り曲げ、前記第2熱伝導層を硬化させ、前記抵抗体と前記電極板の間を、前記第1熱伝導層及び前記第2熱伝導層を介して接着する工程、
を有することを特徴とする抵抗器の製造方法。 - 前記第1熱伝導層及び前記第2熱伝導層の少なくともいずれか一方には、未硬化で固化した状態のものを用いることを特徴とする請求項1に記載の抵抗器の製造方法。
- 前記第1熱伝導層及び前記第2熱伝導層の少なくともいずれか一方は、熱伝導性樹脂フィルムであることを特徴とする請求項2に記載の抵抗器の製造方法。
- 折り曲げた前記電極板に圧力を加えながら前記第2熱伝導層を硬化させることを特徴とする請求項1から請求項3のいずれかに記載の抵抗器の製造方法。
- 抵抗体と、
前記抵抗体の両側に配置され、前記抵抗体の下面側に折り曲げられた電極板と、
前記抵抗体と前記電極板との間に介在する硬化された複数の熱伝導層と、を有することを特徴とする抵抗器。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017237820A JP6573956B2 (ja) | 2017-12-12 | 2017-12-12 | 抵抗器の製造方法 |
US16/771,393 US11462343B2 (en) | 2017-12-12 | 2018-12-11 | Resistor manufacturing method and resistor |
CN201880079608.4A CN111465998B (zh) | 2017-12-12 | 2018-12-11 | 电阻器的制造方法和电阻器 |
KR1020207018158A KR102296732B1 (ko) | 2017-12-12 | 2018-12-11 | 저항기의 제조 방법 및 저항기 |
PCT/JP2018/045456 WO2019117127A1 (ja) | 2017-12-12 | 2018-12-11 | 抵抗器の製造方法及び抵抗器 |
EP18887518.1A EP3726541A4 (en) | 2017-12-12 | 2018-12-11 | Resistor manufacturing method and resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017237820A JP6573956B2 (ja) | 2017-12-12 | 2017-12-12 | 抵抗器の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019106448A true JP2019106448A (ja) | 2019-06-27 |
JP6573956B2 JP6573956B2 (ja) | 2019-09-11 |
Family
ID=66819690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017237820A Active JP6573956B2 (ja) | 2017-12-12 | 2017-12-12 | 抵抗器の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11462343B2 (ja) |
EP (1) | EP3726541A4 (ja) |
JP (1) | JP6573956B2 (ja) |
KR (1) | KR102296732B1 (ja) |
CN (1) | CN111465998B (ja) |
WO (1) | WO2019117127A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5314133U (ja) * | 1976-07-19 | 1978-02-06 | ||
JPS59177929U (ja) * | 1983-05-13 | 1984-11-28 | 日本電気株式会社 | 樹脂外装形電子部品 |
JPH11162721A (ja) * | 1997-11-21 | 1999-06-18 | Hokuriku Electric Ind Co Ltd | チップ抵抗器の製造方法 |
JP2004128000A (ja) * | 2002-09-30 | 2004-04-22 | Koa Corp | 金属板抵抗器およびその製造方法 |
JP2008532280A (ja) * | 2005-02-25 | 2008-08-14 | ヴィスハイ デール エレクトロニクス,インコーポレーテッド | 熱的に伝導性で、電気的に非伝導性の充填材を備えた表面実装電気抵抗器およびそれを製作する方法 |
JP2015008316A (ja) * | 2005-11-07 | 2015-01-15 | タイコエレクトロニクスジャパン合同会社 | Ptcデバイス |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62290581A (ja) | 1986-06-09 | 1987-12-17 | Mitsubishi Paper Mills Ltd | 熱転写記録材料 |
FR2640825B1 (fr) * | 1988-12-20 | 1991-01-25 | Europ Composants Electron | Composant electrique a report direct |
DE4339551C1 (de) * | 1993-11-19 | 1994-10-13 | Heusler Isabellenhuette | Widerstand in SMD-Bauweise und Verfahren zu seiner Herstellung sowie Leiterplatte mit solchem Widerstand |
WO1997006660A2 (en) * | 1995-08-15 | 1997-02-27 | Bourns, Multifuse (Hong Kong), Ltd. | Surface mount conductive polymer devices and method for manufacturing such devices |
DE19953594A1 (de) * | 1998-11-20 | 2000-05-25 | Matsushita Electric Ind Co Ltd | Oberflächenmontierte elektronische Komponente |
JP3860515B2 (ja) * | 2002-07-24 | 2006-12-20 | ローム株式会社 | チップ抵抗器 |
JP5135585B2 (ja) * | 2008-07-25 | 2013-02-06 | セイコーインスツル株式会社 | サーマルヘッドの製造方法 |
JPWO2011162181A1 (ja) * | 2010-06-21 | 2013-08-22 | コーア株式会社 | 面実装バリスタ |
TWI600354B (zh) * | 2014-09-03 | 2017-09-21 | 光頡科技股份有限公司 | 具高彎折力之微電阻結構及其製造方法 |
KR101853170B1 (ko) | 2015-12-22 | 2018-04-27 | 삼성전기주식회사 | 칩 저항기 및 그 제조 방법 |
US11011290B2 (en) * | 2017-12-12 | 2021-05-18 | Koa Corporation | Method for manufacturing resistor, and resistor |
-
2017
- 2017-12-12 JP JP2017237820A patent/JP6573956B2/ja active Active
-
2018
- 2018-12-11 US US16/771,393 patent/US11462343B2/en active Active
- 2018-12-11 CN CN201880079608.4A patent/CN111465998B/zh active Active
- 2018-12-11 KR KR1020207018158A patent/KR102296732B1/ko active IP Right Grant
- 2018-12-11 WO PCT/JP2018/045456 patent/WO2019117127A1/ja unknown
- 2018-12-11 EP EP18887518.1A patent/EP3726541A4/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5314133U (ja) * | 1976-07-19 | 1978-02-06 | ||
JPS59177929U (ja) * | 1983-05-13 | 1984-11-28 | 日本電気株式会社 | 樹脂外装形電子部品 |
JPH11162721A (ja) * | 1997-11-21 | 1999-06-18 | Hokuriku Electric Ind Co Ltd | チップ抵抗器の製造方法 |
JP2004128000A (ja) * | 2002-09-30 | 2004-04-22 | Koa Corp | 金属板抵抗器およびその製造方法 |
JP2008532280A (ja) * | 2005-02-25 | 2008-08-14 | ヴィスハイ デール エレクトロニクス,インコーポレーテッド | 熱的に伝導性で、電気的に非伝導性の充填材を備えた表面実装電気抵抗器およびそれを製作する方法 |
JP2015008316A (ja) * | 2005-11-07 | 2015-01-15 | タイコエレクトロニクスジャパン合同会社 | Ptcデバイス |
Also Published As
Publication number | Publication date |
---|---|
US20200395150A1 (en) | 2020-12-17 |
EP3726541A1 (en) | 2020-10-21 |
WO2019117127A1 (ja) | 2019-06-20 |
KR102296732B1 (ko) | 2021-09-02 |
CN111465998B (zh) | 2022-07-08 |
EP3726541A4 (en) | 2021-12-29 |
KR20200090866A (ko) | 2020-07-29 |
US11462343B2 (en) | 2022-10-04 |
JP6573956B2 (ja) | 2019-09-11 |
CN111465998A (zh) | 2020-07-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11942265B2 (en) | Inductor | |
JP6726821B2 (ja) | 半導体装置の製造方法 | |
TWI497535B (zh) | 具有軟性材料層之微電阻元件及其製造方法 | |
JP2006332413A (ja) | チップ抵抗器およびその製造方法 | |
KR102296639B1 (ko) | 저항기의 제조 방법 | |
US11011290B2 (en) | Method for manufacturing resistor, and resistor | |
WO2019117127A1 (ja) | 抵抗器の製造方法及び抵抗器 | |
US11456108B2 (en) | Multilayer board and manufacturing method thereof | |
KR20200132581A (ko) | 세라믹 기판 제조 방법 | |
TWI552662B (zh) | A manufacturing method of a substrate in which an element is incorporated, and a substrate having a built-in element manufactured by the method | |
JP2009117479A (ja) | コイル部品 | |
JP2022097670A (ja) | コイル部品 | |
US11291110B2 (en) | Resin substrate and electronic device | |
JP2019169634A (ja) | 絶縁回路基板、及び、絶縁回路基板の製造方法 | |
JP4952766B2 (ja) | 電子部品及び電子部品の製造方法 | |
JP3012875B2 (ja) | チップ抵抗器の製造方法 | |
JP4566573B2 (ja) | 部品実装構造および部品実装方法 | |
JP2009099600A (ja) | 受動素子シート、これを実装した回路配線基板及びその製造方法 | |
JP2006260783A (ja) | 導電性組成物および配線基板 | |
JP3889710B2 (ja) | 混成集積回路装置 | |
JP3323156B2 (ja) | チップ抵抗器 | |
JP2015138881A (ja) | 基板および基板の製造方法 | |
JP2020167234A (ja) | モジュールおよびその製造方法 | |
JP2000200701A (ja) | チップ型抵抗器およびその製造方法 | |
JP2012064621A (ja) | 回路基板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181221 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20181221 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20190221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190226 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190424 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190716 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190814 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6573956 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |